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会议日程 Agenda 2022

中国集成电路设计业2023年会

暨广州集成电路产业创新发展高峰论坛

CSIA-ICCAD 2023 Annual Conference &

Guangzhou IC Industry Innovation and Development Summit

会议日程

Agenda

 

20231110日,星期五

Nov.10, Friday, 2023

 

地点广州保利世贸博览馆三层天悦厅

Venue: Grand Mansion Hall, 3F, PWTC Expo

 

Time

        

Contents

Opening Ceremony

主持人:广州市领导

Moderator:

08:30-09:00

领导致辞

Address, Leader

高峰论坛

Top Forum

主持人:程晋格,中国半导体行业协会集成电路设计分会秘书长

Moderator: Jinge Cheng, General Secretary, CSIA-ICCAD

09:00-09:30

主旨演讲

        魏少军教授,中国半导体行业协会集成电路设计分会理事长

-       Prof. Shaojun Wei, General Director, CSIA-ICCAD

09:30-09:50

广州集成电路产业情况介绍

        广州市工信局

09:50-10:10

"E"致精,恒"E"致远——国产EDA的发展之路

        刘伟平,北京华大九天科技股份有限公司董事长

Focus on EDA to Seek for Perfection, Persist in EDA to Seek for ExcellenceThe Development Road of Domestic EDA

-       Weiping Liu, Chairman of the Board, Empyrean Technology Co., Ltd.

10:10-10:30

-       TSMC

10:30-10:50

-       Cadence

10:50-11:10

疾风知劲草——多维演进的新国产EDA创新

        徐昀,上海合见工业软件集团总裁

 

-        

11:10-11:30

焕新声音活力:AI驱动下的音频芯片创新

        周正宇博士,炬芯科技股份有限公司董事长兼CEO

Revitalizing Sound: AI-Driven Audio Chips Innovation

-       Zhenyu Zhou Ph.D, Chairman & CEO, Actions Technology Co., LTD

11:30-11:50

-       安谋科技

11:50-12:10

Chiplet率先落地的应用场景:AIGC和智慧驾驶

        戴伟民,芯原股份创始人、董事长兼总裁

Commercialization of Chiplet: AIGC and Intelligent Driving

-       Wayne Dai, Chairman, President and CEO, VeriSilicon

12:10-13:20

自助午餐 Buffet Lunch

主持人:中国半导体行业协会IC设计分会副理事长

Moderator: Vice General Director, CSIA-ICCAD

13:15-13:20

幸运抽奖 Lucky Draw

13:20-13:40

高速接口IP助力芯片产业迎接Chiplet时代的挑战与机遇

        曾克强,芯耀辉董事长

High-speed Interface IP Helps the Chip Industry Meet the Challenges and Opportunities of the Chiplet Era

-       Keqiang Zeng, Chairman, AkroStar

13:40-14:00

        彭进,中芯国际集成电路制造有限公司资深副总裁

-       John Peng, SVP, Semiconductor Manufacturing International Corporation

14:00-14:20

借力创新,从经济低迷中持续壮大

        凌琳,西门子EDA全球副总裁、中国区总经理

Emerging Stronger from the Downturn with Innovation

-       Pete Ling, Vice President, China Country Manager, Siemens EDA

14:20-14:40

国微芯后端和制造端EDA整体解决方案

        白耿,深圳国微芯科技有限公司执行总裁/首席技术官

GWX Technology Design Back-end and Manufacturing EDA Integrated Solutions

-       Geng Bai, Executive President/CTO, GWX Technology Co., Ltd.

14:40-15:00

共赢 EDA新生态:全方位解决方案与多元合作

        陈英仁,思尔芯S2C副总裁

Win-Win for A New EDA Ecosystem: Comprehensive Solutions and Diverse Collaboration

-       Ying, VP, S2C

15:00-15:20

云智一体的数字验证全流程工具平台,帮助产业实现验证前置

        傅勇,芯华章科技首席技术官

 

-       Yong Fu, Chief Technology Officer, XEPIC

 

-        

15:20-15:40

算力时代的互联IP

        唐睿,奎芯科技市场及战略部副总裁

Interconnect IP in the Era of Computing Power

-       Rui Tang, M Square, Marketing & Strategy VP

15:40-16:00

强化芯片供应结构,加速迎向纯电车时代

        林伟圣,和舰芯片制造(苏州)股份有限公司销售副总经理

Structural Readiness for EV Era

-       W S Lin, Sales VP, HeJian Technology (Suzhou) Co., Ltd.

16:00-16:20

健全IP生态,深耕应用创新

-       沈莉,成都锐成芯微科技股份有限公司CEO

Building a strong IP Ecosystem and Nurturing Application Innovation

-       Lydia Shen, CEO, Chengdu Analog Circuit Technology Inc.

16:40-17:00

推动国产EDA生态建设,支撑集成电路发展

        杨廉峰,上海概伦电子股份有限公司董事/总裁

DTCO: The Path for China EDA

-       Lianfeng Yang, President, Primarius Technologies, Co., Ltd.

17:00-17:20

摩尔精英一站式平台助力客户芯片高效研发到量产

        张竞扬,摩尔精英董事长兼CEO

MooreElite Make IC Design Easy and Efficient

-       Jingyang Zhang, Chairman & CEO, MooreElite

17:20-17:40

Tower Semiconductor Where Analog and Value Meet

        秦磊,Tower Semiconductor全球副总裁

Tower Semiconductor Where Analog and Value Meet

-       Lei Qin, VP of China Operations, Tower Semiconductor Ltd.

17:40-18:00

开放创,共赢未来

        邵华,上海华力微电子有限公司研发副总裁

Open and Innovative Chip Manufacturing Will Achieve a Win-Win Future

-       Chris Shao, VP of Technology Development DivisionHLMC

18:00-18:05

幸运抽奖 Lucky Draw

18:05-18:30

观展与交流 Visiting Exhibition

18:30-20:30

欢迎晚宴(华大九天赞助)

Welcome Dinner Banquet (Sponsored by Empyrean)

地点:广州保利世贸博览馆三层5号馆

Venue: Hall 5, 3F, PWTC Expo


20231111日,星期六

Nov. 10, Saturday, 2023

专题论坛(一)

Subject Forum ()

 

地点:广州保利世贸博览馆三层A会议室

Venue: Meeting Room A, 3F, PWTC Expo

 

Time

   

Contents

演讲人

Lecturer

IPIC设计服务(一)

IP and IC Design Service (I)

主持人:余成斌,中国半导体行业协会集成电路设计分会副理事长

Moderator: Seng-Pan (Ben) U, Vice General Director, CSIA-ICCAD

08:40-09:00

奠基RISC-V未来,开创无限可能

Building the Foundation for the RISC-V Future

范涛, SiFive商务拓展总监

Franky Fan, Business Development Director, SiFive

09:00-09:20

 

TSMC

09:20-09:40

接口IP--为汽车搭建智慧神经网络,为智能驾驶保驾护航

Interface lP—Build "Intelligent Neural Network" for Cars to Escort Intelligent Driving

黄浩然,芯耀辉产品市场总监

Thomas Huang, Product Marketing Director, AkroStar

09:40-10:00

智慧驾驶的一站式芯片定制服务平台

One-Stop Custom Silicon Services Platform for Intelligent Driving

汪志伟,芯原股份高级副总裁、定制芯片平台事业部总经理

Wiseway Wang, Senior Vice President and General Manager of Custom Silicon Platform Division, VeriSilicon

10:00-10:20

 

安谋科技

10:20-10:40

双频段WiFi6射频IP,助力高端无线传输

Dual Band WiFi6 RFIP Enables High Speed Wireless Communication

杨毅,成都锐成芯微科技股份有限公司副总经理

Yi Yang, VP, Chengdu Analog Circuit Technology Inc.

10:40-11:00

 

索喜科技(上海)有限公司

11:00-11:20

高性能计算IP“三件套”: DDRnSerDesChiplet

Three HPC Interface IP Solutions: DDRn, SerDes and Chiplet

高专,芯动科技有限公司VP/技术总监

Zachary Gao, VP/Technical Director, INNOSILICON Technology Ltd.

11:20-11:40

整合多芯片的一站式先进封装服务

One-stop-shopping Advanced Package Service for Multi-source Dies

谢秉宏,智原科技ASIC项目开发副部长

Spark Hsieh, Deputy Director, Faraday Tech Corporation

11:40-12:00

领先GPU IP助力云游戏加速

IMG GPU IP Enable Cloud Gaming Acceleration

李安,Imagination资深技术经理

Adam Lee, Senior Field Applications Engineering Manager, Imagination

12:00-12:20

AlphawaveSemi:在高性能运算,人工智能,机器学习,企业级网络领域中,复杂高性能IP /小芯片与ASIC设计服务挑战的正解

AlphawaveSemi : The answers to the complex of high performance IP/chiplet and ASIC design service for HPC, AI,ML, Enterprise and Networking

郭大玮,源昉芯片科技(南京)有限公司资深销售总监

David Kuo, Senior Sales Director, Alphawave Semi (Nanjing) Co., Ltd.

12:20-12:25

幸运抽奖Lucky Draw

12:25-13:10

自助午餐 Buffet Lunch

主持人:徐璐琦,中国半导体行业协会集成电路设计分会副秘书长

Moderator: Luqi Xu, Vice General Secretary, CSIA-ICCAD

13:10-13:30

玄铁软硬件全栈技术,加速RISC-V生态建设

XuanTie Full-stack Software and Hardware Technology Accelerates the Construction of RISC-V Ecosystem

陈炜,平头哥半导体生态总监

Wei Chen, Ecological Director, T-head

13:30-13:50

国产FPGA如何在差异化发展中取得突破?

How to Make a Breakthrough During Their Own Differentiated Development for Chinese FPGA Chip Makers

王添平,广东高云半导体科技有限公司CTO

Tianping Wang, CTO, Gowin Semiconductor Co., Ltd.

13:50-14:10

基于PSRAMvMAC的芯思原国产IP解决方案

VeriSyno's Domestic IP Solutions for PSRAM and vMAC

吴刚,芯思原微电子有限公司AE经理

Hero Wu, AE Manager, Beijing VeriSyno Microelectronics Co., Ltd.

14:10-14:30

基于NEC CyberWorkBench高阶综合工具的敏捷灵活可重构RTL设计方法及其在IP核开发中的工程应用

A NEC CyberWorkBench High-Level Synthesis Tool-Based Agile and Flexible Reconfigurable RTL Design Methodology and Engineering Applications for IP Core Development

马翔,矽泰科技总监

Jon Ma, Director, Cybertek-Solution Inc.

14:30-14:50

基于2.5/3D接口IP技术演进的Chiplet方案介绍

GUC’s Chiplet Solutions from 2.5D to 3D

肖有军, 创意电子股份有限公司技术总监

YJ Xiao, Director, Global Unichip Corporation (GUC)

14:50-15:10

企业级IPChipletTurnkey平台助力芯片高效交付

Enterprise-class IP, Chiplet and Turnkey Platform, Empower Efficient Delivery of Chip

王洪鹏,中茵微电子(南京)有限公司董事长

Jason Wang, Chairman, JoinSilicon Microelectronics (Nanjing) Co., Ltd.

15:10-15:30

针对数据中心应用的RISC-V CPU——RiVAI P600

RISC-V CPU for Data Center Applications – RiVAI P600

梁松海博士,睿思芯科(深圳)技术有限公司首席科学家

Dr. Songhai Liang, Chief Scientist, RIVAI Technologies (Shenzhen) Co., Ltd.

15:30-15:50

车规级PQC Ready Securyzr SE,开启Chip to Cloud之旅

PQC Ready Securyzr iSE for Automotive: Open Your Journey from Chip to Cloud

Hassan Triqui, Co-Founder, CEO and President, Secure-IC

15:50-16:10

十年一剑,携手共赢——灿芯的芯片定制之路

Ten Years' Win-Win Partnership with SMIC – Brite's One-Stop ASIC Design Solution

胡红明,灿芯半导体高级总监

Edbert HU, Senior Director, Brite Semiconductor

16:10-16:30

适应生成式人工智能时代的NPU IP架构

Adapting NPU IP Architecture for the Generative AI Era

李毅,CEVA产品经理

Allen Li, Product Solution Manager, CEVA China

16:30-16:50

满足800G/1.6T以太网带宽的IP解决方案

Meeting Ethernet Bandwidth Demand: 800G/1.6T IP solution

黎韧,新思科技主任应用工程师

Will Li, Staff - Application Engineer, Synopsys

16:50-17:10

SOC敏捷设计与快速迭代

SOC's Agile Design and Rapid Iteration

金葆晖,上海逸集晟网络科技有限公司总经理

Baohui Jin, GM, Shanghai Ezchip Network Technology Co., Ltd.

17:10-17:30

异构计算和ChipletAI驱动的算力时代新引擎

Enhancing AI-driven Engine: Unleashing the Power of Heterogeneous Computing and Chiplets

祝俊东,奇异摩尔(上海)集成电路设计有限公司联合创始人兼产品及解决方案副总裁

Jundong Zhu, VP of Products and Solutions, Kiwi Moore (Shanghai) IC Co., Ltd.

17:30-17:50

Andes晶心持续协助RISC-V于科技领域领先全球

Andes Technology Continues to Assist RISC-V in Leading the World in the Technology Field

谢幼龄,Andes晶心科技IPBU业务处协理

Amanda Hsieh, AVP of IPBU Sales Division, Andes Technology

17:50-17:55

幸运抽奖Lucky Draw

18:30-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:广州广交会威斯汀酒店宴会厅

Site: Banquet Hall, The Westin Pazhou


20231111日,星期六

Nov. 10, Saturday, 2023

专题论坛(二)

Subject Forum (II)

 

地点:广州保利世贸博览馆三层B会议室

Venue: Meeting Room B, 3F, PWTC Expo

 

Time

   

Contents

演讲人

Lecturer

IPIC设计服务(二)

IP and IC Design Service (II)

主持人:李军,中国半导体行业协会集成电路设计分会副秘书长

Moderator: Jun Li, Vice General Secretary, CSIA-ICCAD

08:40-09:00

人工智能/高性能计算应用的SoC平台解决方案

SoC Platform Solution for AI/HPC Application

布兰登 , SEMIFIVE的首席执行官兼联合创始人

Brandon Cho, CEO and Co-founder, SEMIFIVE

09:00-09:20

精益求精,完整设计支持加速智能电动双引擎

Keep Improving, Complete Design Supports Accelerated AI/EV Twin Engines

唐斌辉,和舰芯片制造(苏州)股份有限公司销售客户经理

Victor Tang, Sales Manager, HeJian Technology (Suzhou) Co., Ltd.

09:20-09:40

奎芯科技LPDDR:引领DDR技术的新篇章

王尚元,奎芯科技资深产品经理

Shangyuan Wang, Senior PM, M Square

09:40-10:00

如何看待最近几年中国的半导体行业的发展

谭飞鸿,广州思信电子科技有限公司CTO

Tan, Edmond FeiHong, CTO, Guangzhou Sytrons Technology Co., Ltd.

10:00-10:20

IP定制——IC设计的加速器

IP Customization - Accelerator for IC Design

罗培君,四川和芯微电子股份有限公司销售经理

Peijun Luo, Sales Manager, IPGoal Microelectronics (Sichuan) Co., Ltd.

10:20-10:40

国产芯片需要什么样的芯片设计服务公司?

What Kind of Chip Design Service Companies does They Need

陈凯,佩纶半导体资深营销

Kai Chen, Senior Marketing, Shanghai Peilun Semiconductor Co., Ltd.

10:40-11:00

高端定制SoC芯片全流程设计服务

Spec-to-Chip Design and Production Service for Customized Hi-end SoC

罗东,无锡华大国奇科技有限公司研发副总裁

Dong Luo, Engineering VP, Qualchip Technologies, Inc.

11:00-11:20

灵活、低功耗、宽范围的显示端口PMA

A flexible, low-power, and Wide-range DisplayPort PMA

CC Chen, Silicon Creations模拟/混合信号设计总监

CC Chen, Director of Analog/Mixed-Signal Design, Silicon Creations

11:20-11:40

系統單芯片在RTL级别做性能分析的挑战和策略

The Challenges and Strategies of SoC Performance Analysis at RTL Level

王俊凱,撷发科技销售市场副总裁

Roger Wang, VP of Sales and Marketing, Microip Inc.

11:40-12:00

全国产RAID芯片的突破者

The Pioneers of Domestic RAID Chips

王誉霖,苏州国芯高性能计算和人工智能芯片事业部副总经理

Ulan Won, VGM of HPC & AI Chips Division, C*Core

12:00-12:20

赛昉科技首个全国产RISC-V “big.LITTLE” IP子系统平台

The First Domestic RISC-V "big. LITTLE" IP Subsystem Platform form StarFive

周杰,广东赛昉科技有限公司资深销售总监

Jay Zhou, Sr. Sales Direcor, Guangdong StarFive Technology Co., Ltd.

12:20-12:25

幸运抽奖Lucky Draw

12:25-13:10

自助午餐 Buffet Lunch

主持人:赵建忠教授,中国半导体行业协会集成电路设计分会副秘书长

Moderator: Prof. Jianzhong Zhao, Vice General Secretary, CSIA-ICCAD

13:10-13:30

算力Infra优化创新,加速IC设计仿真

The Optimization and Innovation of Computing Power Infra, which Accelerating IC Design Simulation

邓世友,互联科技解决方案中心总经理

Shiyou Deng, GM of the Solution Center, NEOLINK

13:30-13:50

支撑、共享、安全——芯片开发中的数字资产管理

Empowering, Sharing and Securing: Digital Asset Management in SoC Design

李培,龙智资深顾问、技术支持部门负责人

Pei Li, Senior Consultant of Head of Technical Support, Dragonsoft

13:50-14:10

满足低功耗OCP NVMe云端SSD应用的全新 PCIe/CXL PHY & ONFi IP方案

M31 PCIe/CXL PHY & ONFi IP Solutions for Low Power OCP NVMe Cloud SSD Applications

朱有钦, 円星科技股份有限公司资深技术经理

King Chu, Senior Technical Manager, M31 Technology Corporation

14:10-14:30

ReRAM: The Next NVM is Here

Coby Hanoch, CEO, Weebit Nano Ltd.

14:30-14:50

支持集成电路产业的发展和挑战——全方位第三方检测服务平台

Supporting the Challenge and Development of IC - Comprehensive 3rd Party Service Lab Platform

庄振宏,季丰电子销售副总

Bryan Chuang, VP of Sales, Giga Force

14:50-15:10

专业设计服务助力客户成功

Professional Design Services Help Customers Succeed

王国良,上海申首半导体科技有限公司CEO

Francis Wang, CEO, Shanghai S1semi Technology Co., Ltd.

15:10-15:30

从设计面到产品应用端- 机器学习驱动的芯片效能监测

On-Chip ML-Driven Monitoring from Design to Field

徐文龙,以色列商博谛安科技应用工程设计总监

Dragon Hsu, AE Director, proteanTecs

15:30-15:50

确保应用功能安全的IP Core 考量

IP Core Considerations for Ensuring Functional Safety in Applications

卡蒂克,智权半导体科技(厦门)有限公司总经理

Karthik Gopal, GM, Asia, SmartDV Technologies

15:50-16:10

含密芯片——信息安全系统的基石

Crypto Inside of Chips - The Cornerstone of Cybersecurity Systems

马博,深圳市纽创信安科技开发有限公司芯片安全事业部总经理

Bo Ma, GM of Division Chip & Security, Open Security Research, Inc.

16:10-16:30

 

上海合见工业软件集团有限公司

16:30-16:50

OPENEDGES LPDDR5X PHY的市场差异化

Market Differentiation of OPENEDGES LPDDR5X PHY

许永桓,OPENEDGES Technology技术总监

YungHuan Hsu, Technical Director, OPENEDGES Technology

16:50-17:10

基于RISC-V面向应用的专用处理器解决方案

Application-Oriented Processor Solution Based on RISC-V

曾轶,南京隼瞻科技有限公司CEO

Yi Zeng, CEO, WingSemi Technologies Co., Ltd.

17:10-17:30

专为数据中心的AI应用而设计的内存系统

Memory Systems for AI in the Data Center

苏雷,蓝铂世信息技术咨询(上海)有限公司大中华区总经理

Raymond Su, Country Manager of Greater China, Rambus Information Technology Consulting (Shanghai) Co., Ltd.

17:30-17:50

力旺电子先进非挥发内存IP布局介绍

Introduction of eMemory’s Emerging NVM IP

柳星舟, 力旺电子亚太晶圆策略业务总监

Emory Liu, Regional Director of Foundry Business Development of Asia, eMemory

17:50-17:55

幸运抽奖Lucky Draw

18:30-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:广州广交会威斯汀酒店宴会厅

Site: Banquet Hall, The Westin Pazhou


20231111日,星期六

Nov. 10, Saturday, 2023

专题论坛(三)

Subject Forum (III)

 

地点:广州保利世贸博览馆三层C会议室

Venue: Meeting Room C, 3F, PWTC Expo

 

Time

   

Contents

演讲人

Lecturer

先进封装与测试(一)

Advanced Packaging and Testing (I)

主持人:周荣,中国半导体行业协会集成电路设计分会副秘书长

Moderator: Rong Zhou, Vice General Secretary, CSIA-ICCAD

08:40-09:00

高速SerDes测试载板解决方案

High-Speed SerDes Test Solution of ATE

徐芝亚,零壹半导体技术(常州)有限公司高级产品经理

Albert Xu, Senior Product Manager, ZeroOne Semiconductor Technology (Changzhou) Co., Ltd.

09:00-09:20

几种典型高性能芯片的测试验证方法

Test Verification Methods for Several Typical High-performance Chips

阳任平,是德科技IC行业经理

Renping Yang, IC Industry Manager, Keysight Technology

09:20-09:40

稳定的量产测试方案开发

The Stable Test Plan Development for Chip Mass Production

肖涛丰,摩尔精英测试部负责人

Taofeng Xiao, Director of Test Engineering, MooreElite

09:40-10:00

支持集成电路产业的发展和挑战——全方位第三方检测服务平台

Supporting the Challenge and Development of IC - Comprehensive 3rd Party Service Lab Platform

庄振宏,季丰电子销售副总

Bryan Chuang, VP of Sales, Giga Force

10:00-10:20

 

日月光集团ASE Group

10:20-10:40

 

通富微电

10:40-11:00

汽车半导体封装——市场与技术动态

Automotive Semiconductor Packaging-Market & Technology Dynamics

赵春华,安靠科技技术专案管理总监

Charlie Zhao, Director – TPM, Amkor Technology China

11:00-11:20

系统级封装集成及基于晶圆级技术的封装集成趋势

Package Challenges and Solutions On SiP & Chiplet

钟磊,甬矽电子(宁波)股份有限公司研发总监

Lei Zhong, R&D Director, Forehope Electronic (NING BO) Co., Ltd.

11:20-11:40

面向Chiplet的后摩尔EDA工具链

Towards Chiplet EDA Toolchain in the Post-Moore's Law Era

余浩,深圳市比昂芯科技有限公司首席科学家

Hao Yu, Chief Scientist, Shenzhen BTD Technology Co., Ltd.

11:40-12:00

先进封装材料CUFLMC解决方案Solutions of Advanced Packaging Materials CUF and LMC

盛昊旼,上海本诺电子材料有限公司技术经理

Haomin Sheng, Technical Manager, Bonotec Electronic Material Co., Ltd.

12:00-12:20

 

西门子EDA

12:20-12:25

幸运抽奖Lucky Draw

12:05-13:10

自助午餐Buffet Lunch

主持人:徐秀法,中国半导体行业协会集成电路设计分会副秘书长

Moderator: Xiufa Xu, Vice General Secretary, CSIA-ICCAD

13:10-13:30

三维系统集成与晶圆级扇出型封装技术进展

3D System Integration and Wafer Level Fan-out Packaging Technology

吕书臣,江苏中科智芯集成科技有限公司董事/副总经理

Shuchen Lv, VP, CASMEIT

13:30-13:50

高端芯片量产ATE测试趋势与挑战

Trends and Challenges of High-end Chip Mass Production ATE Test

李震,杭州朗迅科技股份有限公司CMO

Zhen Li, CMO, Hangzhou Luntek Technology Co., Ltd.

13:50-14:10

功率半导体特色封装和先进封装技术及挑战

Special Packaging and Advanced Packaging Technology of Power Device and Challenges

潘效飞,华润微电子封测事业群研发总监

Arthur Pan, R&D Director, CRMICRO Assembly & Test Business Group

14:10-14:30

Labless如何助力半导体行业的高速发展

How Labless Drives the High-speed Development of the Semiconductor Industry

李晓旻,胜科纳米(苏州)股份有限公司董事长

Xiaomin Li, Chairman, Wintech Nano (SuzhouCo., Ltd.

14:30-14:50

高性能3D SIPFC-SiP的产业机遇

Industry Opportunities for High Performance 3D SIP and FC-SiP

朱文辉,长沙安牧泉智能科技有限公司首席科学家/董事长

Wenhui Zhu, Chief Scientist/Chairman, Changsha AnMuQuan Intelligent Technology Co., Ltd.

14:50-15:10

智能制造深化半导体封测核心竞争力

Deepening the Core Competitiveness of Semiconductor Package and Testing Industry through Intelligent Manufacturing

陈俊宏,赛美特半导体封测行业专家顾问

Tony Chen, An Expert Consultant in the Semiconductor Packaging and Testing Industry of SEMI-TECH Co., Ltd.

15:10-15:30

后摩尔时代集成电路可靠性及检测技术发展与展望

Development and Prospect of Integrated Circuit Reliability and Detection Technology in Post-Moore Era

张东明,北京时代民芯科技有限公司副总经理

Dongming Zhang, Deputy Director, Beijing Mxtronics Technology Co., Ltd.

15:30-15:50

后摩尔时代-先进封装助力半导体行业破局

马晓波,湖南越摩先进半导体有限公司研究院副总监

Xiaobo Ma, Deputy Director of Research Institute, Hunan More Than Moore Advanced Semiconductor Co., Ltd.

15:50-16:10

关于Chiplet封装方案成本的一些思考

Some Thoughts on the Cost of Chiplet Packaging Solutions

蒋振雷,杭州晶通科技有限公司CEO

Zhenlei Jiang, CEO, Hangzhou Microsilicon Technology Co., Ltd.

16:10-16:30

国产环氧塑封料的技术发展探讨

Technical Development of Domestic Epoxy Molding Compoun

谭伟,江苏华海诚科新材料股份有限公司研发部部长

Wei Tan, R&D Manager, Jiangsu HHCK Advanced Materials Co., Ltd.

16:30-16:50

智能数字时代的先进封装技术

Advanced Packaging Technology in the Era of Intelligent Digitalization

刘卫东,华天科技技术市场总监

Wade Liu, HQ Technology Marketing Director, HT-Tech

16:50-17:10

晶圆翘曲矫正助力先进封装

Wafer Warpage Adjustment Technology Boosts Advanced Packaging

周翔,ERS electronic GmbH副总裁兼中国区总经理

Joshua Zhou, VP and China GM, ERS electronic GmbH

17:10-17:30

封装集成创新与挑战

Packaging Integration Innovations and Challenges

刘丰满,华进半导体封装先导技术研发中心有限公司首席科学家

Fengman Liu, Director of R&D, National Center for Advanced Packaging Co., Ltd.

17:30-17:50

车规级功率模块用高Tg环氧塑封料研发及挑战

Development & Challenges of High Tg EMC for Automotive Power Module

詹友为,上海道宜半导体材料有限公司 研发经理

Will Zhan, R&D Manager, DOITECH Semiconductor Advanced Material Co., Ltd.

17:50-17:55

幸运抽奖Lucky Draw

18:30-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:广州广交会威斯汀酒店宴会厅

Site: Banquet Hall, The Westin Pazhou


20231111日,星期六

Nov. 10, Saturday, 2023

专题论坛(四)

Subject Forum (IV)

 

地点:广州保利世贸博览馆三层D会议室

Venue: Meeting Room D, 3F, PWTC Expo

 

Time

   

Contents

演讲人

Lecturer

 

广州集成电路产业创新发展高峰论坛——广州汽车电子产业协同

Guangzhou IC Industry Innovation and Development Summit——Guangzhou Automotive Electronics Industry Collaboration

 

主持人:徐伟,广州市半导体协会副会长

Moderator: Wei Xu, Vice Chairman, GZSIA

 

 

08:30-08:45

领导致辞

Address, Leader

陈卫,广州市半导体协会会长

Tony Chen, Chairman, GZSIA

广州市工业和信息化局领导

Leader, Guangzhou Municipal Industry and Information Technology Bureau

 

08:45-09:15

智能网联技术发展对芯片带来的需求和挑战

Demands and Challenges of Automotive Chips in the Era of ICV

梁伟强,广汽研究院副院长,智能网联技术研发中心主任

WeiQiang Liang, Vice President of GAC R&D Center & Director of ICV R&D Center

 

09:15-09:45

产业协调共建国产汽车芯片供应链

Industry Coordination and Co-Construction of Domestic Automobile Chip Supply Chain

赵斌,粤芯半导体技术股份有限公司战略产品与设计服务副总裁

Jeff Zhao, Vice President of Strategic Products & Design Services, CanSemi Technology Co., Ltd.

 

09:45-10:15

碳化硅器件及模块的汽车类应用前景

The Application Prospect of SiC Devices and Modules in Automobile

周晓阳,广东芯聚能半导体有限公司总裁

Gilbert Zhou, President, Guangdong AccoPower Semiconductor Co., Ltd.

 

10:15-10:45

车联网中的射频芯片

RF Chips in the Connected Car

李阳,广州慧智微电子股份有限公司董事长兼总经理

Yang Li, Chairman & GM, Smarter Microelectronics Co., Ltd.

 

10:45-11:15

携手并进,共同打造汽车芯片产业新生态

Together create a new ecology of the automotive chip industry

恩云飞,工业和信息化部电子第五研究所总工程师

Yunfei En, Chief Engineer, The Fifth Institute of Electronics, Ministry of Industry and Information Technology

 

11:15-12:00

圆桌会议

Roundtable

 

主持人:

Moderator:

 伟,广州市半导体协会副会长

Wei Xu, Vice Chairman, GZSIA

 

嘉宾:

Guest:

 晶,立讯精密汽车电子总经理

Jing Li, GM of Automotive Electronics Division, Luxshare Precision Industry Co., Ltd.

胡胜发,广州安凯微电子股份有限公司董事长兼总裁

Norman Hu, Chairman & President, Guangzhou Anyka Microelectronics Co., Ltd.

刘文超,广州概伦电子技术有限公司总经理

Wenchao Liu, GM, Primarius Technologies (Guangzhou)

  健,广东晟矽微电子有限公司董事长

Jian Lu, Chairman, Guangdong SinoMCU Microelectronics Co., Ltd.

12:00-12:05

幸运抽奖Lucky Draw

 

12:05-13:10

自助午餐Buffet Lunch

 

先进封装与测试(二)

Advanced Packaging and Testing (II)

 

主持人:中国半导体行业协会集成电路设计分会副秘书长

Moderator: Vice General Secretary, CSIA-ICCAD

 

13:10-13:30

引领科技前沿的测试革新之道

Innovating Testing for Leading the Technological Frontier

葛樑,爱德万测试(中国)管理有限公司业务发展部总监

Ge Liang, SoC Business Development & COE Manager, Advantest (China) Co., Ltd.

 

13:30-13:50

以创新技术助力半导体封装测试效能升级

Help Semiconductor Packaging and Test Performance Upgrade with Innovative Technology

罗雄科,上海泽丰半导体科技有限公司董事长

Xiongke Luo, Chairman, Shanghai Zenfocus Semi-Tech Co., Ltd.

 

13:50-14:10

突破传统IC FT & SLT测试的堆叠分选机架构

Break Through Final Test & System Level Test by Stack-structure Handler

吕建坤, 苏州华兴源创科技股份有限公司半导体事业部副总经理

Steve Lu, VP of Suzhou HYC Semiconductor Business Group

 

14:10-14:30

先进工艺节点为汽车芯片带来的测试挑战和解决方案

Challenges and Solution for Automotive Chips are with Advanced Nodes

张震宇,泰瑞达Complex SOC 事业部亚太区总经理

Fisher Zhang, General Manager, Complex SOC BU, Asia, Teradyne

 

14:30-14:50

探索一站式先进封装测试赋能Fabless新模式

Empowering a New Mode of Fabless by Exploring One-stop Advanced Packaging & Testing

彭勇,池州华宇电子科技股份有限公司董事长兼总经理

Peter Peng, GM, Chizhou HISEMI Electronics Technology Co., Ltd.

 

14:50-15:10

 

上海合见工业软件集团有限公司

 

15:10-15:30

集成电路测试技术发展展望

The Way of Integrated Circuit Testing

阚应东,悦芯半导体科技有限公司市场经理

Yingdong Kan, Marketing, TBSTest Technologies Co., Ltd.

 

15:30-15:50

车规芯片测试的趋势和挑战

Trends and challenges of Automotive Devices Testing

杨泽坤,深圳米飞泰克科技股份有限公司测试副总经理

Andy Yang (Zekun Yang), Vice GM, Shenzhen Mifei Tech Limited

 

15:50-16:10

如何调试 USB4 PHY-logic和边带链路层

How to Debug USB4 PHY-logic and Sideband Link Layers

李发存,特励达力科中国区市场经理

Denny Li, Marketing Manager, Teledyne Lecroy

 

16:10-16:30

光纤光谱仪在半导体制程工艺以及消费电子中的应用

Application of Fiber Optic Spectrometer in Semiconductor Process Technology and Consumer Electronics

王子豪,海洋光学大客户经理

Zihao Wang, Key Account Manager of South China Manufacturing Industry, Ocean Optics

 

16:30-16:50

新一代MCU动态老化解决方案

胡久恒,杭州高坤电子科技有限公司总经理

 

16:50-17:10

半导体测试治具解决方案设计

Design TIPS for Test

施元军,苏州晶晟微纳半导体科技有限公司总经理

Yuanjun Shi, GM, Suzhou Nanofab Semiconductor Technology Limited

 

17:10-17:30

HDRF2:多端口 RF IC测试的前沿突破

HDRF2: Pushing Boundaries in Multi-Port RF IC Testing

李永煌,致茂电子股份有限公司资深经理

Spancer Lee, Senior Manager, Chroma ATE INC.

 

17:30-17:50

高频射频芯片封装测试解决方案

High Frequency RF Chip Package and Test Solution

汪庆喜,冠群信息技术(南京)有限公司工程技术部经理

Qingxi Wang, Engineering Manager, CSSCA TechnologiesNanJingCo.Ltd.

 

17:50-17:55

幸运抽奖Lucky Draw

 

18:30-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:广州广交会威斯汀酒店宴会厅

Site: Banquet Hall, The Westin Pazhou

 


20231

111日,星期六

Nov. 10, Saturday, 2023

专题论坛(五)

Subject Forum (V)

 

地点:广州保利世贸博览馆三层E会议室

Venue: Meeting Room E, 3F, PWTC Expo

 

Time

   

Contents

演讲人

Lecturer

EDAIC设计(一)

EDA and IC Design (I)

主持人:沈磊,中国半导体行业协会集成电路设计分会副理事长

Moderator: Lei Shen, Vice General Director, CSIA-ICCAD

08:40-09:00

通过DTCO打造应用驱动得EDA解决方案

 

刘文超,概伦电子副总裁

Wenchao Liu, VP, Primarius Technologies Co., Ltd.

09:00-09:20

加强国产EDA全流程整合,服务先进工艺下的系统级芯片设计

Integrating Domestic EDA Flow to Boost System Level Design in the Advanced Technology Node

陈俊博士,深圳鸿芯微纳技术有限公司研发总监

Jun Chen, R&D Director, Shenzhen Giga Design Automation Co., Ltd.

09:20-09:40

量体裁衣”——FARMStudio赋能领域专用处理器设计

"Tailoring your processor" - FARMStudio Empower Domain-specific Processor Design

张卫航,芯易荟(上海)芯片科技有限公司副总裁

Leon Zhang, VP, ChipEasy TechnologyShanghai Limited

09:40-10:00

更智能、更高效——重构数字实现全流程

More Intelligent and Efficient - Reconstructing the Entire Process of Digital Implementation

邵振,芯行纪科技有限公司资深技术副总裁

Zhen Shao, Senior Engineering VP, X-Times Design Automation Co., LTD

10:00-10:20

速石科技新一代芯片研发平台——助力半导体企业快速降本增效缩短芯片研发周期

New Generation Chip Design R&D Platform from Fastone – Increase R&D Efficiency, Shorten R&D Cycle Time and Reduce TTotal Cost

陈琳涛,上海速石信息科技有限公司高级技术总监

Leo Chen, Senior Director, Shanghai FASTONE Information Technology Co., Ltd.

10:20-10:40

基于敏捷验证,以数字验证全流程解决方案加速芯片创新效率

杨晔,芯华章科技资深产品和业务规划总监

Ye Yang, Product and Business Planning Senior Director, XEPIC

10:40-11:00

 

上海合见工业软件集团有限公司

11:00-11:20

EDA助力泛模拟芯片设计-制造协同

A Collaborative EDA Solution for Analog Related Chip Design and Manufacturing

刘晓明,北京华大九天科技股份有限公司高级产品总监

Michael Liu, Senior Product Director, Empyrean Technology Co., Ltd.

11:20-11:40

 

深圳国微芯科技有限公司

11:40-12:00

芯启源仿真加速和原型验证一体化平台助力芯片设计提供研发效率

Emulation and Prototyping Platform MimicPro

裘烨敏,芯启源电子科技有限公司EDA & IP销售总经理

Yemin Qiu, EDA & IP Sales GM, Corigine Electronic Technology Co., Ltd.

12:00-12:05

幸运抽奖 Lucky Draw

12:05-13:10

自助午餐Buffet Lunch

主持人:刘娜,中国半导体行业协会集成电路设计分会副秘书长

Moderator: Na Liu, Vice General Secretary, CSIA-ICCAD

13:10-13:30

OmniArk芯神鼎硬件仿真系统在芯片前端验证领域创新突破

Innovative Breakthroughs in Front-End Chip Verification with OmniArk Emulation

秦英明,思尔芯S2C产品经理

Alex Qin, PM, S2C

13:30-13:50

 

Cadence

13:50-14:10

早期功耗分析助力实现最优设计决策

Early Stage Power Estimation for Optimal Design Decisions

戚仲辉,英诺达(成都)电子科技有限公司资深AE

Zhonghui Qi, Senior Application Engineer, EnnoCAD Electronic Technology Co., Ltd.

14:10-14:30

EDA加速实现汽车智能化

How Siemens Accelerates Automotive Intelligence

牛风举,西门子EDA中国区产品总监

Actel Niu, Product Director, China, Siemens EDA

14:30-14:50

EDA解决方案助力3DIC Chiplet设计

EDA Solution for 3DIC Chiplet Design

黄晓波,芯和半导体科技(上海)股份有限公司技术市场总监

Xiaobo Huang, Director of Technical Marketing, Xpeedic

14:50-15:10

芯片-封装-系统协同仿真助力3DIC设计一次性流片成功

CPS Co-Simulation Enable First Time 3DIC Silicon Success

张书强,安似科技(上海)有限公司技术总监

Shuqiang Zhang, ACE Director, Ansys

15:10-15:30

加速功能验证收敛,HyperSemu砥砺前行

Accelerating Feature Validation Convergence, HyperSemu Forges Ahead

吕旭东,无锡亚科鸿禹电子有限公司验证产品高级总监

Eric Lv, Senior Chief Product Officer,

HyperSilicon Co., Ltd.

15:30-15:50

提升芯片可靠性:EDA自动化的重要使命

EDA Automation is Needed to Improve Chip Reliability

朱允山,上海伴芯科技有限公司CEO

Yunshan Zhu, CEO, IC Bench, Inc.

15:50-16:10

EDA助力科技革命

Julin Technology’s EDA Software Promote Technological Revolution Process

孙家鑫,巨霖科技(上海)有限公司创始人兼总经理

Jiaxin Sun, Founder and GM, Julin Technology Co., Ltd.

16:10-16:30

赋能半导体,加速芯片设计生产力

Empowering Semiconductors to Accelerate Chip Design Productivity

刘道龙,腾讯云半导体行业首席架构师

Riker Liu, Chief Architect of Tencent Cloud

16:30-16:50

 

杭州智灵瞳

16:50-17:10

面向集成电路及系统应用的新一代EDA平台

New Generation of EDA Platforms for IC and System Applications

王浩,宁波德图科技有限公司华南区总经理

Hao Wang, GM of South China Region, Ningbo DetooLIC Technology Co., Ltd.

17:10-17:30

可扩展的超大规模并行计算电路仿真平台

A Scalable Parallel Computing for Circuit Simulation and Design

靳超:深圳比昂芯科技有限公司副总裁

Chao Jin, VP, Shenzhen BTD Technology Co., Ltd.

17:30-17:50

设计汽车芯片功能安全

Design Function Safety for Automobile ASIC

陈晓挺,MathWorks通信、电子和半导体行业市场经理

Vincent Chen, CES Industry Marketing Manager, MathWorks

17:50-17:55

幸运抽奖Lucky Draw

18:30-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:广州广交会威斯汀酒店宴会厅

Site: Banquet Hall, The Westin Pazhou


20231111日,星期六

Nov. 10, Saturday, 2023

专题论坛(六)

Subject Forum (VI)

 

地点:广州保利世贸博览馆三层F会议室

Venue: Meeting Room F, 3F, PWTC Expo

 

Time

   

Contents

演讲人

Lecturer

FOUNDRY与工艺技术

Foundry and Process Technology

主持人:张力天,中国半导体行业协会集成电路设计分会副理事长

Moderator: Litian Zhang, Vice General Director, CSIA-ICCAD

08:40-09:00

一体化良率解决方案实践:从设计可制造性优化到彻底的OPC坏点解决策略

HPOTM in actionfrom design manufacturability optimization to defect free OPC

张生睿, 东方晶源微电子科技(北京)股份有限公司产品总监

Shengrui Zhang, Product Director, Dongfang Jingyuan Electron Co., Ltd.

09:00-09:20

 

TSMC

09:20-09:40

A Deep Dive to Tower’s BCD Technology – Enabling Green and Automotive World

王敏,Tower Semiconductor销售&FAE经理

Min Wang, Sales & FAE Manager, Tower Semiconductor Ltd.

09:40-10:00

联电先进特色工艺及车规平台

UMC Advanced Specialty Technologies & Auto Platform

陈剑波,和舰芯片制造(苏州)股份有限公司销售经理

Snowwolf Chen, Sales Manager, HeJian Technology (Suzhou) Co., Ltd.

10:00-10:20

华力先进特色工艺平台晶圆代工技术

HLMC Advanced Specialty Foundry Technologies

田明,上海华力微电子有限公司研发总监

Ming Tian, Senior Director of TDHLMC

10:20-10:40

荣芯153nm 5-120V全电压BCD解决方案助推电源管理驱动产品升级

Rongsemi 153nm Full Voltage 5-120v BCD Solution Release and Promote the Upgrade on PMIC Product Line

沈亮,荣芯半导体有限公司市场营销副总裁

Neo Shen, VP of Marketing & Sales, Rong Semiconductor Co., Ltd.

10:40-11:00

 

华润上华

11:00-11:20

差异化工艺助力手机射频芯片技术演进

Differentiated Technologies Drive Mobile RF Devices’ Evolution

张楷晨博士,格芯半导体科技(上海)有限公司手机无线业务线经理

Calvin Zhang Ph.D, Smart Mobile Device & Wearable Business Line Manager, GlobalFoundries China

11:20-11:40

X-FAB以模拟工艺连结现实世界

How X-FAB’s Analog Foundry Technologies Build a Bridge Between the Digital and the Real World

卫鹤鸣,X-FAB技术市场经理

Heming WEI, Technical Marketing Manager, X-FAB

11:40-12:00

 

华虹宏力

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:10

自助午餐 Buffet Lunch

EDAIC设计(二)

EDA and IC Design (II)

主持人:曹华锋,中国半导体行业协会集成电路设计分会副秘书长

Moderator: Huafeng Cao, Vice General Director, CSIA-ICCAD

13:10-13:30

AI设计AI芯片——一个创新的新时代

AI Designing AI Chips – A New Era of Innovation

汤木明,新思科技技术总监

Muming Tang, Director of Application Engineering, Synopsys

13:30-13:50

自主可控的数字集成电路物理实现工具助推国产DTCO工艺流程

Self-controlled Physical Implementation Tools of Digital Integrated Circuit Promote Domestic DTCO Progress

杨皓津,上海立芯软件科技有限公司副总经理

Haojin Yang, VP, Shanghai LEDA Technology Co., Ltd.

13:50-14:10

底层融合赋能签核高维度创新

High-Dimensional Innovation in Signoff  Empowered By Underlying Integration

任旭,杭州行芯科技有限公司销售总监

Xu Ren, Sales Director, PHLEXING Technology Co., Ltd.

14:10-14:30

良率驱动型后端设计EDA智能解决方案

Yield-Driven EDA Intelligent Solution for Back-End Design

李江伟,华芯巨数(杭州)微电子有限公司创始人/CEO

Jiangwei Li, Founder/CEO, Huaxin Jusu (Hangzhou) Microelectronics Co., Ltd.

14:30-14:50

通过快速、高效的寄生参数分析和缩减来确保正确的电路设计

Ensuring Appropriate Circuit Behaviour Through Fast and Efficient Post-layout Parasitic Exploration and Reduction

刘客,Silvaco中国AE经理

Ke Liu, AE Manager, Silvaco China Co., Ltd.

14:50-15:10

Altair先进可视化芯片开发平台及案例介绍

Altair Advanced Visualization Chip Development Platform and Case Introduction

王轶华,Altair企业计算部技术总监

Yihua Wang, Technical Director of Enterprise Computing Group, Altair

15:10-15:30

超宽带(UWB)芯片射频模拟前端的设计分析与探讨

The Analysis of the Analog Front End of an Ultra-Wideband Transceiver IC

冯琪,苏州芯联成软件有限公司电路工程处经理

Qi Feng, Head of IC Analysis Department, Suzhou Silintech Company

15:30-15:50

数字电路仿真EDA工具助力国产IC设计

Digital IC Simulation EDA Assisting Domestic IC Design

管楠,上海芯思维信息科技有限公司AE Manager

Nan Guan, AE Manager, Shanghai Semisight Information Technology Co., Ltd.

15:50-16:10

新一代智能化PCB&封装设计工具链及数据综合解决方案

New Generation Intelligent PCB&packaging Design Toolchain and Data Comprehensive Solution

杨飞,宁波为昕科技有限公司CEO

Fei Yang, CEO, Ningbo Vxin Technology Co., Ltd.

16:10-16:30

国产DFT普及实现与自主可控挑战

Domestic DFT Popularization Realization and Autonomous Control Challenges

赵瑜斌,无锡玖熠半导体科技有限公司产品总监

Robin Zhao, Product Director, Wuxi Splendor Semicondutor Technology Co., Ltd.

16:30-16:50

深耕增量式设计流程应用,赋能EDA发展新动力

 

魏星,奇捷科技(深圳)有限公司CEO

 

16:50-17:10

一站式集成电路设计云平台——楷领凌云平台

One-stop IC Design Cloud Platform

梁璞,上海楷领科技有限公司业务副总裁

Pu Liang, VP of Business Development, Kailing Technology (Shanghai) Co., Ltd.

17:10-17:30

测试数据分析SaaS助力中小IC设计公司实现科学品控

Test Data Analysis SaaS Helps IC Design SMEs Achieve Efficient Quality Control

郑尊标,杭州芯翼科技有限公司创始人/CEO

Zunbiao Zheng, Founder & CEO, Hangzhou Chipwing Technology Co., Ltd.

17:30-17:35

幸运抽奖Lucky Draw

18:30-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:广州广交会威斯汀酒店宴会厅

Site: Banquet Hall, The Westin Pazhou

 


20231111日,星期六

Nov. 10, Saturday, 2023

专题论坛(七)

Subject Forum (VII)

 

地点:广州保利世贸博览馆三层G会议室

Venue: Meeting Room G, 3F, PWTC Expo

 

Time

   

Contents

演讲人

Lecturer

IC设计与创新应用

IC Design & Innovation Application

主持人:

Moderator:

08:40-09:00

小芯片,大动能,联想凌拓半导体行业高效存储解决方案

Small Chips, Big Momentum, Lenovo NetApp Storage Solutions for Semiconductor Industry

陈毅腾,联想凌拓芯片行业架构师

Yiteng Chen, Semiconductor Industry Architect, Lenovo NetApp Technology Limited

09:00-09:20

Wi-SUN助推海外智能量测架构项目建设

Wi-SUN Promotes the Construction of Advanced Metering Infrastructure Developments

赵海波,珠海中慧微电子有限公司总经理

Haibo Zhao, CEO, ZhuHai ZhongHui Microelectronics Co., Ltd.

09:20-09:40

蚂蚁搬大象”——轻量级DSP从指令到AI应用的进化

"Ants Carrying Elephants” - Lightweight DSP Evolution from Instructions to AI Applications

范名超,芯易荟(上海)芯片科技有限公司智能芯片方案架构师

Mingchao FAN, NPU Architect, ChipEasy Technology (Shanghai) Limited

09:40-10:00

从系统级、芯片级寻求突破存储墙

Breaking Memory Wall in System and Chip Level

左丰国,西安紫光国芯半导体股份有限公司副总裁

Fengguo Zuo, VP, Xi‘an UniIC Semiconductors Co., Ltd.

10:00-10:20

 

地平线

10:20-10:40

安路科技第二代FPSOC器件特色和优势

Anlogic 2nd FPSOC FPGA Introduction

邓龙,上海安路信息科技股份有限公司市场部总监

Alex Deng, Marketing Director, Shanghai Anlogic Infotech Co., Ltd.

10:40-11:00

基于半导体数据特征的一站式数据分析方案

One Shop Data Analysis Solution Based on Semiconductor Data Features

赵明辉,上海喆塔信息科技有限公司产品总监

Minghui Zhao, Product Director, Shanghai Zetatech Co., Ltd.

11:00-11:20

22nm产品创新突破,助力国产FPGA新发展

Breakthrough Innovation in 22nm Technology as a Driving Force to the New Development of China's FPGA Industry

王海力,京微齐力(北京)科技股份有限公司CEO

Haili Wang, CEO, Hercules Microelectronics Co., Ltd.

11:20-11:40

国产FPGA赋能数字底座创新

 

吕喆,深圳市紫光同创电子有限公司市场总监

11:40-12:00

智联新时代,用芯共创数字未来

Creating a Digital Future Together

吴昊,紫光展锐市场总监

Jacky Wu, Marketing Director, UNISOC

12:00-12:20

光纤通信及其专用集成电路

Optical Fiber Communication and Its ASICs

陈永洲,武汉飞思灵微电子有限公司技术总监

YongZhou Chen, Technical Director, Wuhan Fisilink Microelectronics Technology Co., Ltd.

12:20-12:25

幸运抽奖Lucky Draw

12:25-13:10

自助午餐 Buffet Lunch

IC设计与创新应用

IC Design & Innovation Application

主持人:中国半导体行业协会集成电路设计分会副秘书长

Moderator: Vice General Secretary, CSIA-ICCAD

13:10-13:30

 

华登国际(华芯(上海)创业投资

13:30-13:50

全球供应链重构下的中国半导体自主可控及投资机会

 

陈瑜,元禾璞华执行董事

13:50-14:10

 

西门子EDA

14:10-14:30

车规电源芯片的挑战和机遇

倪川,瓴芯电子科技(无锡)有限公司CEO

Chuan Ni, CEO, LEN Technology Ltd.

14:30-14:50

存算一体技术开启人工智能计算的新时代

Processing-in-Memory (PIM) Technology Opens a New Era of Computing

杨越,苹芯科技联合创始人兼CEO

Yue YangCo founder & CEO of Pimchip Technology

14:50-15:10

边缘AI芯片部署Transformer模型

Edge AI SoC Deploy Transformer Model

唐琦,爱芯元智半导体(宁波)有限公司AI推理引擎总监

Qi Tang, Director of AI Inference Engine, AXera Semiconductor (Ningbo) Co., Ltd.

15:10-15:30

兆易创新存储助力新一代智能可穿戴应用

GigaDevice Memory Drives the Innovation in Smart Wearable Application

王欢,兆易创新Flash事业部市场经理

Wing Wang, Marketing Manager of Flash BU, GigaDevice Semiconductor Inc.

15:30-15:50

破风®8676”多模态可重构5G射频收发信机芯片

PoFeng 8676 Multi-mode Re-configurable 5G RF Transceiver Chip

李男,中国移动通信有限公司研究院无线与终端技术研究所副所长

Nan Li, Deputy Director of Department of Wireless and Terminal Technology Research, China Mobile Research Institute

15:50-16:10

黑芝麻智能单SoC芯片方案加速汽车智能化转型

Single SoC Chip Enabling Intelligent Transformation of Automobile

张松,黑芝麻智能高级产品市场经理

Song Zhang, Senior Product Marketing Manager of Black Sesame Technologies Co., Ltd.

16:10-16:30

射频芯片系统集成设计挑战与解决方法

Challenges and Solutions for System Integration of RF Chip Design

胡劼,深圳市中兴微电子技术有限公司模拟设计部部长

Jie Hu, Director of Analog Design Dept, Sanechips Technology Co., Ltd.

16:30-16:50

 

智芯微

16:50-17:10

国产智能驾驶芯片的挑战和发展

Challenges and Development of Domestic Autonomous Driving Chips

赵敏俊,上海为旌科技有限公司运营副总裁

Michael ZhaoVP of Operations, Shanghai Visinex Technologies Co., Ltd. 

17:10-17:30

下一代存内计算的发展和应用

The Application and Development for Next CIM Chip

王绍迪,北京知存科技有限公司CEO

Shaodi Wang, CEO, Beijing Zhicun (Witmem) Technology Co., Ltd.

17:30-17:50

数字化时代,IC企业如何构建安全、高效的研发工作环境

How does IC Company Security Its DEV in the Digital Era

何轶,北京志翔科技股份有限公司解决方案总监

Yi He, Director of Industry Solution, Zshield Inc.

17:50-17:55

幸运抽奖Lucky Draw

18:30-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:广州广交会威斯汀酒店宴会厅

Site: Banquet Hall, The Westin Pazhou