中国集成电路设计业2023年会
暨广州集成电路产业创新发展高峰论坛
CSIA-ICCAD 2023 Annual Conference &
Guangzhou IC Industry Innovation and Development
Summit
会议日程
Agenda
2023年11月10日，星期五
Nov.10, Friday,
2023
地点：广州保利世贸博览馆三层天悦厅
Venue: Grand Mansion Hall, 3F, PWTC Expo
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时 间
Time
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内 容
Contents
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开 幕 式
Opening
Ceremony
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主持人：广州市领导
Moderator:
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08:30-09:00
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领导致辞
Address, Leader
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高峰论坛
Top
Forum
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主持人：程晋格，中国半导体行业协会集成电路设计分会秘书长
Moderator:
Jinge Cheng, General Secretary, CSIA-ICCAD
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09:00-09:30
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主旨演讲
—
魏少军教授，中国半导体行业协会集成电路设计分会理事长
-
Prof. Shaojun Wei, General Director, CSIA-ICCAD
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09:30-09:50
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广州集成电路产业情况介绍
—
广州市工信局
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09:50-10:10
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专"E"致精，恒"E"致远——国产EDA的发展之路
—
刘伟平，北京华大九天科技股份有限公司董事长
Focus on EDA to Seek for Perfection, Persist in EDA to Seek
for Excellence—The Development Road of Domestic EDA
- Weiping Liu, Chairman of the Board, Empyrean Technology
Co., Ltd.
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10:10-10:30
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- TSMC
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-
Cadence
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疾风知劲草——多维演进的新国产EDA创新
—
徐昀，上海合见工业软件集团总裁
-
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焕新声音活力：AI驱动下的音频芯片创新
—
周正宇博士，炬芯科技股份有限公司董事长兼CEO
Revitalizing Sound:
AI-Driven Audio Chips Innovation
-
Zhenyu
Zhou Ph.D, Chairman & CEO, Actions Technology Co., LTD
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-
安谋科技
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Chiplet率先落地的应用场景：AIGC和智慧驾驶
—
戴伟民，芯原股份创始人、董事长兼总裁
Commercialization of Chiplet:
AIGC and Intelligent Driving
-
Wayne
Dai, Chairman, President and CEO, VeriSilicon
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12:10-13:20
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自助午餐 Buffet Lunch
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主持人：中国半导体行业协会IC设计分会副理事长
Moderator:
Vice General Director, CSIA-ICCAD
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13:15-13:20
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幸运抽奖 Lucky Draw
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13:20-13:40
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高速接口IP助力芯片产业迎接Chiplet时代的挑战与机遇
—
曾克强，芯耀辉董事长
High-speed Interface IP Helps the Chip Industry Meet the Challenges and
Opportunities of the Chiplet Era
-
Keqiang
Zeng, Chairman, AkroStar
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13:40-14:00
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—
彭进，中芯国际集成电路制造有限公司资深副总裁
- John Peng, SVP, Semiconductor Manufacturing International
Corporation
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14:00-14:20
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借力创新，从经济低迷中持续壮大
—
凌琳，西门子EDA全球副总裁、中国区总经理
Emerging Stronger
from the Downturn with Innovation
-
Pete Ling, Vice President, China Country
Manager, Siemens EDA
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14:20-14:40
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国微芯后端和制造端EDA整体解决方案
—
白耿，深圳国微芯科技有限公司执行总裁/首席技术官
GWX
Technology Design Back-end and Manufacturing EDA Integrated Solutions
- Geng Bai, Executive President/CTO, GWX Technology Co., Ltd.
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14:40-15:00
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共赢 EDA新生态：全方位解决方案与多元合作
—
陈英仁，思尔芯S2C副总裁
Win-Win for A New EDA Ecosystem: Comprehensive
Solutions and Diverse Collaboration
-
Ying, VP, S2C
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15:00-15:20
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云智一体的数字验证全流程工具平台，帮助产业实现验证前置
—
傅勇，芯华章科技首席技术官
-
Yong
Fu, Chief Technology Officer, XEPIC
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|
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-
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15:20-15:40
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算力时代的互联IP
—
唐睿，奎芯科技市场及战略部副总裁
Interconnect IP in the Era of Computing Power
-
Rui
Tang, M Square, Marketing & Strategy VP
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15:40-16:00
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强化芯片供应结构，加速迎向纯电车时代
—
林伟圣，和舰芯片制造（苏州）股份有限公司销售副总经理
Structural Readiness for EV Era
- W S Lin, Sales VP, HeJian
Technology (Suzhou) Co., Ltd.
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16:00-16:20
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健全IP生态，深耕应用创新
- 沈莉，成都锐成芯微科技股份有限公司CEO
Building
a strong IP Ecosystem and Nurturing Application Innovation
- Lydia Shen, CEO, Chengdu
Analog Circuit Technology Inc.
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16:40-17:00
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推动国产EDA生态建设，支撑集成电路发展
—
杨廉峰，上海概伦电子股份有限公司董事/总裁
DTCO: The Path for China EDA
- Lianfeng Yang, President, Primarius Technologies,
Co., Ltd.
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17:00-17:20
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摩尔精英一站式平台助力客户芯片高效研发到量产
—
张竞扬，摩尔精英董事长兼CEO
MooreElite
Make IC Design Easy and Efficient
-
Jingyang
Zhang, Chairman & CEO, MooreElite
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17:20-17:40
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Tower Semiconductor
– Where Analog and
Value Meet
—
秦磊，Tower
Semiconductor全球副总裁
Tower Semiconductor
– Where Analog and
Value Meet
-
Lei Qin, VP of
China Operations, Tower Semiconductor Ltd.
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17:40-18:00
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开放创”芯”，共赢未来
—
邵华，上海华力微电子有限公司研发副总裁
Open and
Innovative Chip Manufacturing Will Achieve a Win-Win Future
-
Chris Shao, VP of
Technology Development Division，HLMC
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18:00-18:05
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幸运抽奖 Lucky Draw
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18:05-18:30
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观展与交流 Visiting
Exhibition
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18:30-20:30
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欢迎晚宴（华大九天赞助）
Welcome
Dinner Banquet (Sponsored by Empyrean)
地点：广州保利世贸博览馆三层5号馆
Venue: Hall
5, 3F, PWTC Expo
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2023年11月11日，星期六
Nov.
10, Saturday, 2023
专题论坛（一）
Subject
Forum (Ⅰ)
地点：广州保利世贸博览馆三层A会议室
Venue: Meeting Room A, 3F, PWTC Expo
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时 间
Time
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内 容
Contents
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演讲人
Lecturer
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IP与IC设计服务（一）
IP and IC Design Service (I)
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主持人：余成斌，中国半导体行业协会集成电路设计分会副理事长
Moderator: Seng-Pan (Ben) U, Vice General Director, CSIA-ICCAD
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08:40-09:00
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奠基RISC-V未来，开创无限可能
Building the Foundation for the RISC-V Future
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范涛, SiFive商务拓展总监
Franky Fan, Business Development Director, SiFive
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09:00-09:20
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TSMC
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09:20-09:40
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接口IP--为汽车搭建“智慧神经网络”，为智能驾驶保驾护航
Interface lP—Build "Intelligent Neural Network" for
Cars to Escort Intelligent Driving
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黄浩然，芯耀辉产品市场总监
Thomas Huang, Product Marketing Director, AkroStar
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09:40-10:00
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智慧驾驶的一站式芯片定制服务平台
One-Stop Custom Silicon Services Platform for Intelligent
Driving
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汪志伟，芯原股份高级副总裁、定制芯片平台事业部总经理
Wiseway Wang, Senior Vice President and General Manager of
Custom Silicon Platform Division, VeriSilicon
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10:00-10:20
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安谋科技
|
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10:20-10:40
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双频段WiFi6射频IP，助力高端无线传输
Dual Band WiFi6 RFIP Enables High Speed Wireless Communication
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杨毅，成都锐成芯微科技股份有限公司副总经理
Yi Yang, VP, Chengdu Analog Circuit
Technology Inc.
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10:40-11:00
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索喜科技（上海）有限公司
|
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11:00-11:20
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高性能计算IP“三件套”: DDRn、SerDes、Chiplet
Three HPC Interface IP Solutions: DDRn, SerDes and Chiplet
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高专，芯动科技有限公司VP/技术总监
Zachary Gao, VP/Technical Director, INNOSILICON Technology
Ltd.
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11:20-11:40
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整合多芯片的一站式先进封装服务
One-stop-shopping Advanced Package Service for Multi-source
Dies
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谢秉宏，智原科技ASIC项目开发副部长
Spark Hsieh, Deputy Director, Faraday Tech Corporation
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11:40-12:00
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领先GPU IP助力云游戏加速
IMG GPU IP Enable Cloud Gaming Acceleration
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李安，Imagination资深技术经理
Adam Lee, Senior Field Applications Engineering Manager, Imagination
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12:00-12:20
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AlphawaveSemi：在高性能运算，人工智能，机器学习，企业级网络领域中，复杂高性能IP /小芯片与ASIC设计服务挑战的正解
AlphawaveSemi : The answers to the complex of high
performance IP/chiplet and ASIC design service for HPC, AI,ML, Enterprise and
Networking
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郭大玮，源昉芯片科技（南京）有限公司资深销售总监
David Kuo, Senior Sales Director, Alphawave Semi (Nanjing)
Co., Ltd.
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12:20-12:25
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幸运抽奖Lucky Draw
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12:25-13:10
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自助午餐 Buffet Lunch
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主持人：徐璐琦，中国半导体行业协会集成电路设计分会副秘书长
Moderator: Luqi Xu, Vice General
Secretary, CSIA-ICCAD
|
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13:10-13:30
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玄铁软硬件全栈技术，加速RISC-V生态建设
XuanTie Full-stack Software and Hardware Technology Accelerates
the Construction of RISC-V Ecosystem
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陈炜，平头哥半导体生态总监
Wei Chen, Ecological Director, T-head
|
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13:30-13:50
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国产FPGA如何在差异化发展中取得突破？
How to Make a Breakthrough During Their Own Differentiated
Development for Chinese FPGA Chip Makers
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王添平，广东高云半导体科技有限公司CTO
Tianping Wang, CTO, Gowin Semiconductor Co., Ltd.
|
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13:50-14:10
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基于PSRAM和vMAC的芯思原国产IP解决方案
VeriSyno's Domestic IP Solutions for PSRAM and vMAC
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吴刚，芯思原微电子有限公司AE经理
Hero Wu, AE Manager, Beijing VeriSyno Microelectronics Co.,
Ltd.
|
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14:10-14:30
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基于NEC CyberWorkBench高阶综合工具的敏捷灵活可重构RTL设计方法及其在IP核开发中的工程应用
A NEC CyberWorkBench High-Level Synthesis Tool-Based Agile
and Flexible Reconfigurable RTL Design Methodology and Engineering
Applications for IP Core Development
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马翔，矽泰科技总监
Jon Ma, Director, Cybertek-Solution Inc.
|
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14:30-14:50
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基于2.5/3D接口IP技术演进的Chiplet方案介绍
GUC’s Chiplet Solutions from 2.5D to 3D
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肖有军, 创意电子股份有限公司技术总监
YJ
Xiao, Director, Global Unichip Corporation (GUC)
|
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14:50-15:10
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企业级IP、Chiplet及Turnkey平台助力芯片高效交付
Enterprise-class
IP, Chiplet and Turnkey Platform, Empower Efficient Delivery of Chip
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王洪鹏，中茵微电子（南京）有限公司董事长
Jason Wang, Chairman, JoinSilicon Microelectronics (Nanjing) Co.,
Ltd.
|
|
15:10-15:30
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针对数据中心应用的RISC-V CPU——RiVAI P600
RISC-V CPU for Data Center Applications – RiVAI P600
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梁松海博士，睿思芯科（深圳）技术有限公司首席科学家
Dr. Songhai Liang, Chief Scientist, RIVAI Technologies (Shenzhen)
Co., Ltd.
|
|
15:30-15:50
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车规级PQC Ready Securyzr SE，开启Chip to Cloud之旅
PQC Ready Securyzr iSE for Automotive:
Open Your Journey from Chip to Cloud
|
Hassan Triqui, Co-Founder, CEO and President, Secure-IC
|
|
15:50-16:10
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十年一剑，携手共赢——灿芯的芯片定制之路
Ten Years' Win-Win Partnership with SMIC – Brite's One-Stop
ASIC Design Solution
|
胡红明，灿芯半导体高级总监
Edbert
HU, Senior Director, Brite Semiconductor
|
|
16:10-16:30
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适应生成式人工智能时代的NPU IP架构
Adapting
NPU IP Architecture for the Generative AI Era
|
李毅，CEVA产品经理
Allen
Li, Product Solution Manager, CEVA China
|
|
16:30-16:50
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满足800G/1.6T以太网带宽的IP解决方案
Meeting Ethernet Bandwidth Demand:
800G/1.6T IP solution
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黎韧，新思科技主任应用工程师
Will Li, Staff - Application Engineer, Synopsys
|
|
16:50-17:10
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SOC敏捷设计与快速迭代
SOC's Agile Design and Rapid Iteration
|
金葆晖，上海逸集晟网络科技有限公司总经理
Baohui Jin, GM, Shanghai Ezchip Network Technology Co., Ltd.
|
|
17:10-17:30
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异构计算和Chiplet，AI驱动的算力时代新引擎
Enhancing AI-driven Engine: Unleashing the Power of
Heterogeneous Computing and Chiplets
|
祝俊东，奇异摩尔（上海）集成电路设计有限公司联合创始人兼产品及解决方案副总裁
Jundong Zhu, VP of Products and Solutions, Kiwi Moore (Shanghai)
IC Co., Ltd.
|
|
17:30-17:50
|
Andes晶心持续协助RISC-V于科技领域领先全球
Andes
Technology Continues to Assist RISC-V in Leading the World in the Technology
Field
|
谢幼龄，Andes晶心科技IPBU业务处协理
Amanda Hsieh, AVP of IPBU Sales Division, Andes Technology
|
|
17:50-17:55
|
幸运抽奖Lucky Draw
|
|
18:30-20:00
|
闭幕晚宴及交旗仪式
Closing Banquet and Flag Handover
Ceremony
地点：广州广交会威斯汀酒店宴会厅
Site: Banquet Hall,
The Westin Pazhou
|
2023年11月11日，星期六
Nov.
10, Saturday, 2023
专题论坛（二）
Subject
Forum (II)
地点：广州保利世贸博览馆三层B会议室
Venue: Meeting Room B, 3F, PWTC Expo
|
时
间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
|
IP与IC设计服务（二）
IP and IC Design Service
(II)
|
|
主持人：李军，中国半导体行业协会集成电路设计分会副秘书长
Moderator: Jun Li,
Vice General Secretary, CSIA-ICCAD
|
|
08:40-09:00
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人工智能/高性能计算应用的SoC平台解决方案
SoC Platform Solution for AI/HPC Application
|
布兰登 赵,
SEMIFIVE的首席执行官兼联合创始人
Brandon Cho, CEO and Co-founder, SEMIFIVE
|
|
09:00-09:20
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精益求精,完整设计支持加速智能电动双引擎
Keep Improving, Complete Design Supports Accelerated AI/EV Twin
Engines
|
唐斌辉，和舰芯片制造（苏州）股份有限公司销售客户经理
Victor Tang, Sales Manager, HeJian Technology (Suzhou) Co.,
Ltd.
|
|
09:20-09:40
|
奎芯科技LPDDR：引领DDR技术的新篇章
|
王尚元，奎芯科技资深产品经理
Shangyuan Wang, Senior PM, M Square
|
|
09:40-10:00
|
如何看待最近几年中国的半导体行业的发展
|
谭飞鸿，广州思信电子科技有限公司CTO
Tan, Edmond FeiHong, CTO, Guangzhou Sytrons Technology Co.,
Ltd.
|
|
10:00-10:20
|
IP定制——IC设计的加速器
IP Customization - Accelerator for IC Design
|
罗培君，四川和芯微电子股份有限公司销售经理
Peijun Luo, Sales Manager, IPGoal Microelectronics (Sichuan)
Co., Ltd.
|
|
10:20-10:40
|
国产芯片需要什么样的芯片设计服务公司？
What Kind of Chip Design Service Companies does They Need？
|
陈凯，佩纶半导体资深营销
Kai Chen, Senior Marketing, Shanghai Peilun Semiconductor
Co., Ltd.
|
|
10:40-11:00
|
高端定制SoC芯片全流程设计服务
Spec-to-Chip Design and Production Service for Customized
Hi-end SoC
|
罗东，无锡华大国奇科技有限公司研发副总裁
Dong Luo, Engineering VP, Qualchip Technologies, Inc.
|
|
11:00-11:20
|
灵活、低功耗、宽范围的显示端口PMA
A flexible, low-power, and Wide-range DisplayPort PMA
|
CC Chen,
Silicon Creations模拟/混合信号设计总监
CC Chen, Director of Analog/Mixed-Signal Design, Silicon Creations
|
|
11:20-11:40
|
系統單芯片在RTL级别做性能分析的挑战和策略
The Challenges and Strategies of SoC Performance Analysis at
RTL Level
|
王俊凱，撷发科技销售市场副总裁
Roger Wang, VP of Sales and Marketing, Microip Inc.
|
|
11:40-12:00
|
全国产RAID芯片的突破者
The Pioneers of Domestic RAID Chips
|
王誉霖，苏州国芯高性能计算和人工智能芯片事业部副总经理
Ulan Won, VGM of HPC & AI Chips Division, C*Core
|
|
12:00-12:20
|
赛昉科技首个全国产RISC-V
“big.LITTLE” IP子系统平台
The First Domestic RISC-V "big. LITTLE" IP Subsystem
Platform form StarFive
|
周杰，广东赛昉科技有限公司资深销售总监
Jay Zhou, Sr. Sales Direcor, Guangdong StarFive Technology Co.,
Ltd.
|
|
12:20-12:25
|
幸运抽奖Lucky Draw
|
|
12:25-13:10
|
自助午餐 Buffet Lunch
|
|
主持人：赵建忠教授，中国半导体行业协会集成电路设计分会副秘书长
Moderator: Prof.
Jianzhong Zhao, Vice General Secretary, CSIA-ICCAD
|
|
13:10-13:30
|
算力Infra优化创新，加速IC设计仿真
The Optimization and Innovation of
Computing Power Infra, which Accelerating IC Design Simulation
|
邓世友，互联科技解决方案中心总经理
Shiyou Deng, GM of the Solution Center, NEOLINK
|
|
13:30-13:50
|
支撑、共享、安全——芯片开发中的数字资产管理
Empowering, Sharing and Securing: Digital
Asset Management in SoC Design
|
李培，龙智资深顾问、技术支持部门负责人
Pei Li, Senior Consultant of Head of Technical Support,
Dragonsoft
|
|
13:50-14:10
|
满足低功耗OCP NVMe云端SSD应用的全新 PCIe/CXL PHY & ONFi IP方案
M31 PCIe/CXL PHY & ONFi IP Solutions
for Low Power OCP NVMe Cloud SSD Applications
|
朱有钦, 円星科技股份有限公司资深技术经理
King Chu, Senior Technical Manager, M31 Technology
Corporation
|
|
14:10-14:30
|
ReRAM: The Next NVM is Here
|
Coby Hanoch, CEO, Weebit Nano Ltd.
|
|
14:30-14:50
|
支持集成电路产业的发展和挑战——全方位第三方检测服务平台
Supporting
the Challenge and Development of IC - Comprehensive 3rd Party Service
Lab Platform
|
庄振宏，季丰电子销售副总
Bryan
Chuang, VP of Sales, Giga Force
|
|
14:50-15:10
|
专业设计服务助力客户成功
Professional Design Services Help Customers
Succeed
|
王国良，上海申首半导体科技有限公司CEO
Francis Wang, CEO, Shanghai S1semi Technology
Co., Ltd.
|
|
15:10-15:30
|
从设计面到产品应用端- 机器学习驱动的芯片效能监测
On-Chip
ML-Driven Monitoring from Design to Field
|
徐文龙，以色列商博谛安科技应用工程设计总监
Dragon
Hsu, AE Director, proteanTecs
|
|
15:30-15:50
|
确保应用功能安全的IP Core 考量
IP Core Considerations for Ensuring
Functional Safety in Applications
|
卡蒂克，智权半导体科技（厦门）有限公司总经理
Karthik Gopal, GM, Asia, SmartDV
Technologies
|
|
15:50-16:10
|
含密芯片——信息安全系统的基石
Crypto Inside of Chips - The Cornerstone of Cybersecurity
Systems
|
马博，深圳市纽创信安科技开发有限公司芯片安全事业部总经理
Bo Ma, GM of Division Chip &
Security, Open Security Research, Inc.
|
|
16:10-16:30
|
|
上海合见工业软件集团有限公司
|
|
16:30-16:50
|
OPENEDGES LPDDR5X PHY的市场差异化
Market Differentiation of OPENEDGES
LPDDR5X PHY
|
许永桓，OPENEDGES
Technology技术总监
YungHuan
Hsu, Technical Director, OPENEDGES Technology
|
|
16:50-17:10
|
基于RISC-V面向应用的专用处理器解决方案
Application-Oriented Processor Solution Based on RISC-V
|
曾轶，南京隼瞻科技有限公司CEO
Yi Zeng, CEO, WingSemi Technologies Co., Ltd.
|
|
17:10-17:30
|
专为数据中心的AI应用而设计的内存系统
Memory Systems for AI in the Data Center
|
苏雷，蓝铂世信息技术咨询（上海）有限公司大中华区总经理
Raymond
Su, Country Manager of Greater China, Rambus Information Technology
Consulting (Shanghai) Co., Ltd.
|
|
17:30-17:50
|
力旺电子先进非挥发内存IP布局介绍
Introduction of eMemory’s Emerging
NVM IP
|
柳星舟, 力旺电子亚太晶圆策略业务总监
Emory Liu, Regional Director of Foundry
Business Development of Asia, eMemory
|
|
17:50-17:55
|
幸运抽奖Lucky Draw
|
|
18:30-20:00
|
闭幕晚宴及交旗仪式
Closing Banquet and
Flag Handover Ceremony
地点：广州广交会威斯汀酒店宴会厅
Site: Banquet Hall,
The Westin Pazhou
|
2023年11月11日，星期六
Nov. 10, Saturday, 2023
专题论坛（三）
Subject
Forum (III)
地点：广州保利世贸博览馆三层C会议室
Venue: Meeting Room C, 3F, PWTC Expo
|
时
间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
|
先进封装与测试（一）
Advanced Packaging
and Testing (I)
|
|
主持人：周荣，中国半导体行业协会集成电路设计分会副秘书长
Moderator: Rong
Zhou, Vice General Secretary, CSIA-ICCAD
|
|
08:40-09:00
|
高速SerDes测试载板解决方案
High-Speed SerDes Test Solution of ATE
|
徐芝亚，零壹半导体技术(常州)有限公司高级产品经理
Albert Xu, Senior Product Manager, ZeroOne Semiconductor
Technology (Changzhou) Co., Ltd.
|
|
09:00-09:20
|
几种典型高性能芯片的测试验证方法
Test Verification Methods for Several
Typical High-performance Chips
|
阳任平，是德科技IC行业经理
Renping Yang, IC Industry Manager, Keysight
Technology
|
|
09:20-09:40
|
稳定的量产测试方案开发
The Stable Test Plan Development for
Chip Mass Production
|
肖涛丰，摩尔精英测试部负责人
Taofeng Xiao,
Director of Test Engineering, MooreElite
|
|
09:40-10:00
|
支持集成电路产业的发展和挑战——全方位第三方检测服务平台
Supporting
the Challenge and Development of IC - Comprehensive 3rd Party Service
Lab Platform
|
庄振宏，季丰电子销售副总
Bryan Chuang, VP of Sales, Giga Force
|
|
10:00-10:20
|
|
日月光集团ASE
Group
|
|
10:20-10:40
|
|
通富微电
|
|
10:40-11:00
|
汽车半导体封装——市场与技术动态
Automotive Semiconductor Packaging-Market & Technology Dynamics
|
赵春华，安靠科技技术专案管理总监
Charlie Zhao, Director – TPM, Amkor Technology China
|
|
11:00-11:20
|
系统级封装集成及基于晶圆级技术的封装集成趋势
Package Challenges and Solutions On SiP & Chiplet
|
钟磊，甬矽电子（宁波）股份有限公司研发总监
Lei Zhong, R&D Director, Forehope Electronic (NING BO) Co.,
Ltd.
|
|
11:20-11:40
|
面向Chiplet的后摩尔EDA工具链
Towards Chiplet EDA Toolchain in the Post-Moore's Law Era
|
余浩，深圳市比昂芯科技有限公司首席科学家
Hao Yu, Chief Scientist, Shenzhen BTD Technology Co., Ltd.
|
|
11:40-12:00
|
先进封装材料CUF及LMC解决方案Solutions
of Advanced Packaging Materials CUF and LMC
|
盛昊旼，上海本诺电子材料有限公司技术经理
Haomin Sheng, Technical Manager, Bonotec Electronic Material Co.,
Ltd.
|
|
12:00-12:20
|
|
西门子EDA
|
|
12:20-12:25
|
幸运抽奖Lucky Draw
|
|
12:05-13:10
|
自助午餐Buffet Lunch
|
|
主持人：徐秀法，中国半导体行业协会集成电路设计分会副秘书长
Moderator: Xiufa
Xu, Vice General Secretary, CSIA-ICCAD
|
|
13:10-13:30
|
三维系统集成与晶圆级扇出型封装技术进展
3D System Integration and Wafer Level Fan-out Packaging Technology
|
吕书臣，江苏中科智芯集成科技有限公司董事/副总经理
Shuchen Lv, VP, CASMEIT
|
|
13:30-13:50
|
高端芯片量产ATE测试趋势与挑战
Trends and Challenges of High-end Chip Mass Production ATE
Test
|
李震，杭州朗迅科技股份有限公司CMO
Zhen Li, CMO, Hangzhou Luntek Technology
Co., Ltd.
|
|
13:50-14:10
|
功率半导体特色封装和先进封装技术及挑战
Special Packaging and Advanced Packaging Technology of Power
Device and Challenges
|
潘效飞，华润微电子封测事业群研发总监
Arthur Pan, R&D Director, CRMICRO Assembly & Test
Business Group
|
|
14:10-14:30
|
Labless如何助力半导体行业的高速发展
How Labless Drives the High-speed Development of the Semiconductor
Industry
|
李晓旻，胜科纳米（苏州）股份有限公司董事长
Xiaomin Li, Chairman, Wintech Nano (Suzhou）Co., Ltd.
|
|
14:30-14:50
|
高性能3D SIP与FC-SiP的产业机遇
Industry Opportunities for High Performance 3D SIP and FC-SiP
|
朱文辉，长沙安牧泉智能科技有限公司首席科学家/董事长
Wenhui Zhu, Chief Scientist/Chairman, Changsha AnMuQuan
Intelligent Technology Co., Ltd.
|
|
14:50-15:10
|
智能制造深化半导体封测核心竞争力
Deepening the Core Competitiveness of
Semiconductor Package and Testing Industry through Intelligent Manufacturing
|
陈俊宏，赛美特半导体封测行业专家顾问
Tony Chen, An Expert Consultant in
the Semiconductor Packaging and Testing Industry of SEMI-TECH Co., Ltd.
|
|
15:10-15:30
|
后摩尔时代集成电路可靠性及检测技术发展与展望
Development and Prospect of Integrated Circuit Reliability and
Detection Technology in Post-Moore Era
|
张东明，北京时代民芯科技有限公司副总经理
Dongming Zhang, Deputy Director, Beijing Mxtronics Technology
Co., Ltd.
|
|
15:30-15:50
|
后摩尔时代-先进封装助力半导体行业破局
|
马晓波，湖南越摩先进半导体有限公司研究院副总监
Xiaobo Ma, Deputy Director of Research Institute, Hunan More
Than Moore Advanced Semiconductor Co., Ltd.
|
|
15:50-16:10
|
关于Chiplet封装方案成本的一些思考
Some Thoughts on the
Cost of Chiplet Packaging Solutions
|
蒋振雷，杭州晶通科技有限公司CEO
Zhenlei Jiang, CEO, Hangzhou
Microsilicon Technology Co., Ltd.
|
|
16:10-16:30
|
国产环氧塑封料的技术发展探讨
Technical Development of Domestic
Epoxy Molding Compoun
|
谭伟，江苏华海诚科新材料股份有限公司研发部部长
Wei Tan, R&D Manager, Jiangsu HHCK Advanced Materials Co., Ltd.
|
|
16:30-16:50
|
智能数字时代的先进封装技术
Advanced Packaging Technology in the Era of Intelligent Digitalization
|
刘卫东，华天科技技术市场总监
Wade Liu, HQ Technology Marketing
Director, HT-Tech
|
|
16:50-17:10
|
晶圆翘曲矫正助力先进封装
Wafer Warpage Adjustment Technology Boosts
Advanced Packaging
|
周翔，ERS
electronic GmbH副总裁兼中国区总经理
Joshua Zhou, VP and China GM, ERS
electronic GmbH
|
|
17:10-17:30
|
封装集成创新与挑战
Packaging Integration Innovations and
Challenges
|
刘丰满，华进半导体封装先导技术研发中心有限公司首席科学家
Fengman Liu, Director of R&D, National
Center for Advanced Packaging Co., Ltd.
|
|
17:30-17:50
|
车规级功率模块用高Tg环氧塑封料研发及挑战
Development & Challenges of High
Tg EMC for Automotive Power Module
|
詹友为，上海道宜半导体材料有限公司 研发经理
Will Zhan, R&D Manager, DOITECH
Semiconductor Advanced Material Co., Ltd.
|
|
17:50-17:55
|
幸运抽奖Lucky Draw
|
|
18:30-20:00
|
闭幕晚宴及交旗仪式
Closing Banquet and
Flag Handover Ceremony
地点：广州广交会威斯汀酒店宴会厅
Site: Banquet Hall, The Westin
Pazhou
|
2023年11月11日，星期六
Nov. 10, Saturday, 2023
专题论坛（四）
Subject Forum (IV)
地点：广州保利世贸博览馆三层D会议室
Venue: Meeting Room D, 3F, PWTC Expo
|
时 间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
|
|
广州集成电路产业创新发展高峰论坛——广州汽车电子产业协同
Guangzhou IC Industry Innovation and Development Summit——Guangzhou
Automotive Electronics Industry Collaboration
|
|
|
主持人：徐伟，广州市半导体协会副会长
Moderator: Wei Xu,
Vice Chairman, GZSIA
|
|
|
08:30-08:45
|
领导致辞
Address, Leader
|
陈卫，广州市半导体协会会长
Tony Chen, Chairman, GZSIA
广州市工业和信息化局领导
Leader, Guangzhou Municipal Industry and Information
Technology Bureau
|
|
08:45-09:15
|
智能网联技术发展对芯片带来的需求和挑战
Demands and Challenges of Automotive Chips in the Era
of ICV
|
梁伟强，广汽研究院副院长，智能网联技术研发中心主任
WeiQiang Liang, Vice President of GAC R&D Center &
Director of ICV R&D Center
|
|
09:15-09:45
|
产业协调共建国产汽车芯片供应链
Industry Coordination and Co-Construction of Domestic Automobile Chip
Supply Chain
|
赵斌，粤芯半导体技术股份有限公司战略产品与设计服务副总裁
Jeff Zhao, Vice
President of Strategic Products & Design Services, CanSemi Technology Co.,
Ltd.
|
|
09:45-10:15
|
碳化硅器件及模块的汽车类应用前景
The Application Prospect of SiC Devices and Modules in Automobile
|
周晓阳，广东芯聚能半导体有限公司总裁
Gilbert Zhou,
President, Guangdong AccoPower Semiconductor Co., Ltd.
|
|
10:15-10:45
|
车联网中的射频芯片
RF Chips in the Connected Car
|
李阳，广州慧智微电子股份有限公司董事长兼总经理
Yang Li, Chairman &
GM, Smarter Microelectronics Co., Ltd.
|
|
10:45-11:15
|
携手并进，共同打造汽车芯片产业新生态
Together create a new ecology of the automotive chip industry
|
恩云飞，工业和信息化部电子第五研究所总工程师
Yunfei En, Chief
Engineer, The Fifth Institute of Electronics, Ministry of Industry and
Information Technology
|
|
11:15-12:00
|
圆桌会议
Roundtable
主持人：
Moderator:
徐 伟，广州市半导体协会副会长
Wei Xu, Vice Chairman, GZSIA
嘉宾：
Guest:
李 晶，立讯精密汽车电子总经理
Jing Li, GM of Automotive Electronics Division, Luxshare Precision
Industry Co., Ltd.
胡胜发，广州安凯微电子股份有限公司董事长兼总裁
Norman Hu, Chairman & President, Guangzhou Anyka Microelectronics
Co., Ltd.
刘文超，广州概伦电子技术有限公司总经理
Wenchao Liu, GM, Primarius Technologies (Guangzhou)
陆 健，广东晟矽微电子有限公司董事长
Jian Lu, Chairman, Guangdong SinoMCU Microelectronics Co., Ltd.
|
|
12:00-12:05
|
幸运抽奖Lucky Draw
|
|
|
12:05-13:10
|
自助午餐Buffet Lunch
|
|
|
先进封装与测试（二）
Advanced Packaging and Testing (II)
|
|
|
主持人：中国半导体行业协会集成电路设计分会副秘书长
Moderator: Vice General Secretary,
CSIA-ICCAD
|
|
|
13:10-13:30
|
引领科技前沿的测试革新之道
Innovating Testing for Leading the Technological
Frontier
|
葛樑，爱德万测试（中国）管理有限公司业务发展部总监
Ge Liang, SoC Business Development & COE Manager, Advantest
(China) Co., Ltd.
|
|
|
13:30-13:50
|
以创新技术助力半导体封装测试效能升级
Help Semiconductor
Packaging and Test Performance Upgrade with Innovative Technology
|
罗雄科,上海泽丰半导体科技有限公司董事长
Xiongke Luo, Chairman, Shanghai
Zenfocus Semi-Tech Co., Ltd.
|
|
|
13:50-14:10
|
突破传统IC FT & SLT测试的堆叠分选机架构
Break Through Final Test & System Level Test
by Stack-structure Handler
|
吕建坤, 苏州华兴源创科技股份有限公司半导体事业部副总经理
Steve
Lu, VP of Suzhou HYC Semiconductor Business Group
|
|
|
14:10-14:30
|
先进工艺节点为汽车芯片带来的测试挑战和解决方案
Challenges
and Solution for Automotive Chips are with Advanced Nodes
|
张震宇，泰瑞达Complex SOC 事业部亚太区总经理
Fisher
Zhang, General Manager, Complex SOC BU, Asia, Teradyne
|
|
|
14:30-14:50
|
探索一站式先进封装测试赋能Fabless新模式
Empowering
a New Mode of Fabless by Exploring One-stop Advanced Packaging & Testing
|
彭勇，池州华宇电子科技股份有限公司董事长兼总经理
Peter
Peng, GM, Chizhou HISEMI Electronics Technology Co., Ltd.
|
|
|
14:50-15:10
|
|
上海合见工业软件集团有限公司
|
|
|
15:10-15:30
|
集成电路测试技术发展展望
The
Way of Integrated Circuit Testing
|
阚应东，悦芯半导体科技有限公司市场经理
Yingdong Kan, Marketing, TBSTest Technologies Co., Ltd.
|
|
|
15:30-15:50
|
车规芯片测试的趋势和挑战
Trends
and challenges of Automotive Devices Testing
|
杨泽坤，深圳米飞泰克科技股份有限公司测试副总经理
Andy
Yang (Zekun Yang), Vice GM, Shenzhen Mifei Tech Limited
|
|
|
15:50-16:10
|
如何调试 USB4 PHY-logic和边带链路层
How to Debug USB4 PHY-logic and Sideband Link Layers
|
李发存，特励达力科中国区市场经理
Denny Li, Marketing Manager, Teledyne Lecroy
|
|
|
16:10-16:30
|
光纤光谱仪在半导体制程工艺以及消费电子中的应用
Application
of Fiber Optic Spectrometer in Semiconductor Process Technology and Consumer
Electronics
|
王子豪，海洋光学大客户经理
Zihao
Wang, Key Account Manager of South China Manufacturing Industry, Ocean Optics
|
|
|
16:30-16:50
|
新一代MCU动态老化解决方案
|
胡久恒，杭州高坤电子科技有限公司总经理
|
|
|
16:50-17:10
|
半导体测试治具解决方案设计
Design TIPS for
Test
|
施元军，苏州晶晟微纳半导体科技有限公司总经理
Yuanjun
Shi, GM, Suzhou Nanofab Semiconductor Technology Limited
|
|
|
17:10-17:30
|
HDRF2：多端口 RF IC测试的前沿突破
HDRF2: Pushing Boundaries in Multi-Port RF IC Testing
|
李永煌，致茂电子股份有限公司资深经理
Spancer
Lee, Senior Manager, Chroma ATE INC.
|
|
|
17:30-17:50
|
高频射频芯片封装测试解决方案
High Frequency RF Chip Package and Test Solution
|
汪庆喜，冠群信息技术（南京）有限公司工程技术部经理
Qingxi Wang, Engineering Manager, CSSCA Technologies（NanJing）Co.，Ltd.
|
|
|
17:50-17:55
|
幸运抽奖Lucky Draw
|
|
|
18:30-20:00
|
闭幕晚宴及交旗仪式
Closing Banquet and Flag Handover
Ceremony
地点：广州广交会威斯汀酒店宴会厅
Site: Banquet Hall, The Westin Pazhou
|
|
|
|
|
|
|
|
2023年1
1月11日，星期六
Nov.
10, Saturday, 2023
专题论坛（五）
Subject
Forum (V)
地点：广州保利世贸博览馆三层E会议室
Venue: Meeting Room E, 3F, PWTC Expo
|
时
间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
|
EDA与IC设计（一）
EDA and IC Design (I)
|
|
主持人：沈磊，中国半导体行业协会集成电路设计分会副理事长
Moderator: Lei Shen,
Vice General Director, CSIA-ICCAD
|
|
08:40-09:00
|
通过DTCO打造应用驱动得EDA解决方案
|
刘文超，概伦电子副总裁
Wenchao Liu, VP, Primarius Technologies Co., Ltd.
|
|
09:00-09:20
|
加强国产EDA全流程整合，服务先进工艺下的系统级芯片设计
Integrating Domestic EDA Flow to Boost
System Level Design in the Advanced Technology Node
|
陈俊博士，深圳鸿芯微纳技术有限公司研发总监
Jun Chen, R&D Director, Shenzhen
Giga Design Automation Co., Ltd.
|
|
09:20-09:40
|
“量体裁衣”——FARMStudio赋能领域专用处理器设计
"Tailoring your processor"
- FARMStudio Empower Domain-specific Processor Design
|
张卫航，芯易荟（上海）芯片科技有限公司副总裁
Leon Zhang, VP, ChipEasy Technology（Shanghai） Limited
|
|
09:40-10:00
|
更智能、更高效——重构数字实现全流程
More Intelligent
and Efficient - Reconstructing the Entire Process of Digital Implementation
|
邵振，芯行纪科技有限公司资深技术副总裁
Zhen
Shao, Senior Engineering VP, X-Times Design Automation Co., LTD
|
|
10:00-10:20
|
速石科技新一代芯片研发平台——助力半导体企业快速降本增效缩短芯片研发周期
New Generation Chip Design R&D
Platform from Fastone – Increase R&D Efficiency, Shorten R&D Cycle
Time and Reduce TTotal Cost
|
陈琳涛，上海速石信息科技有限公司高级技术总监
Leo Chen, Senior Director, Shanghai
FASTONE Information Technology Co., Ltd.
|
|
10:20-10:40
|
基于敏捷验证，以数字验证全流程解决方案加速芯片创新效率
|
杨晔，芯华章科技资深产品和业务规划总监
Ye Yang, Product and Business Planning Senior Director, XEPIC
|
|
10:40-11:00
|
|
上海合见工业软件集团有限公司
|
|
11:00-11:20
|
EDA助力泛模拟芯片设计-制造协同
A Collaborative EDA
Solution for Analog Related Chip Design and Manufacturing
|
刘晓明，北京华大九天科技股份有限公司高级产品总监
Michael Liu, Senior Product Director, Empyrean Technology
Co., Ltd.
|
|
11:20-11:40
|
|
深圳国微芯科技有限公司
|
|
11:40-12:00
|
芯启源仿真加速和原型验证一体化平台助力芯片设计提供研发效率
Emulation and Prototyping Platform
MimicPro
|
裘烨敏，芯启源电子科技有限公司EDA
& IP销售总经理
Yemin Qiu, EDA & IP Sales GM, Corigine
Electronic Technology Co., Ltd.
|
|
12:00-12:05
|
幸运抽奖 Lucky
Draw
|
|
12:05-13:10
|
自助午餐Buffet Lunch
|
|
主持人：刘娜，中国半导体行业协会集成电路设计分会副秘书长
Moderator: Na Liu,
Vice General Secretary, CSIA-ICCAD
|
|
13:10-13:30
|
OmniArk芯神鼎硬件仿真系统在芯片前端验证领域创新突破
Innovative Breakthroughs in Front-End Chip Verification with
OmniArk Emulation
|
秦英明，思尔芯S2C产品经理
Alex Qin, PM, S2C
|
|
13:30-13:50
|
|
Cadence
|
|
13:50-14:10
|
早期功耗分析助力实现最优设计决策
Early Stage Power Estimation for Optimal Design Decisions
|
戚仲辉，英诺达（成都）电子科技有限公司资深AE
Zhonghui Qi, Senior Application Engineer, EnnoCAD Electronic
Technology Co., Ltd.
|
|
14:10-14:30
|
EDA加速实现汽车智能化
How
Siemens Accelerates Automotive Intelligence
|
牛风举，西门子EDA中国区产品总监
Actel Niu, Product Director, China, Siemens EDA
|
|
14:30-14:50
|
EDA解决方案助力3DIC
Chiplet设计
EDA
Solution for 3DIC Chiplet Design
|
黄晓波，芯和半导体科技（上海）股份有限公司技术市场总监
Xiaobo
Huang, Director of Technical Marketing, Xpeedic
|
|
14:50-15:10
|
芯片-封装-系统协同仿真助力3DIC设计一次性流片成功
CPS Co-Simulation Enable First Time 3DIC Silicon Success
|
张书强，安似科技（上海）有限公司技术总监
Shuqiang Zhang, ACE Director, Ansys
|
|
15:10-15:30
|
加速功能验证收敛，HyperSemu砥砺前行
Accelerating Feature Validation Convergence, HyperSemu Forges
Ahead
|
吕旭东，无锡亚科鸿禹电子有限公司验证产品高级总监
Eric Lv, Senior Chief Product Officer,
HyperSilicon Co., Ltd.
|
|
15:30-15:50
|
提升芯片可靠性：EDA自动化的重要使命
EDA
Automation is Needed to Improve Chip Reliability
|
朱允山，上海伴芯科技有限公司CEO
Yunshan
Zhu, CEO, IC Bench, Inc.
|
|
15:50-16:10
|
霖EDA助力科技革命
Julin Technology’s EDA Software Promote Technological Revolution
Process
|
孙家鑫，巨霖科技（上海）有限公司创始人兼总经理
Jiaxin Sun, Founder and GM, Julin Technology Co., Ltd.
|
|
16:10-16:30
|
赋能半导体，加速芯片设计生产力
Empowering Semiconductors to Accelerate Chip Design
Productivity
|
刘道龙，腾讯云半导体行业首席架构师
Riker Liu, Chief Architect of Tencent Cloud
|
|
16:30-16:50
|
|
杭州智灵瞳
|
|
16:50-17:10
|
面向集成电路及系统应用的新一代EDA平台
New
Generation of EDA Platforms for IC and System Applications
|
王浩，宁波德图科技有限公司华南区总经理
Hao Wang, GM of South China Region, Ningbo
DetooLIC Technology Co., Ltd.
|
|
17:10-17:30
|
可扩展的超大规模并行计算电路仿真平台
A Scalable
Parallel Computing for Circuit Simulation and Design
|
靳超：深圳比昂芯科技有限公司副总裁
Chao
Jin, VP, Shenzhen BTD Technology Co., Ltd.
|
|
17:30-17:50
|
设计汽车芯片功能安全
Design
Function Safety for Automobile ASIC
|
陈晓挺，MathWorks通信、电子和半导体行业市场经理
Vincent Chen, CES Industry Marketing Manager, MathWorks
|
|
17:50-17:55
|
幸运抽奖Lucky Draw
|
|
18:30-20:00
|
闭幕晚宴及交旗仪式
Closing Banquet and Flag Handover
Ceremony
地点：广州广交会威斯汀酒店宴会厅
Site: Banquet Hall,
The Westin Pazhou
|
2023年11月11日，星期六
Nov. 10, Saturday, 2023
专题论坛（六）
Subject Forum (VI)
地点：广州保利世贸博览馆三层F会议室
Venue: Meeting Room F, 3F, PWTC Expo
|
时 间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
|
FOUNDRY与工艺技术
Foundry and Process Technology
|
|
主持人：张力天，中国半导体行业协会集成电路设计分会副理事长
Moderator: Litian Zhang, Vice
General Director, CSIA-ICCAD
|
|
08:40-09:00
|
一体化良率解决方案实践：从设计可制造性优化到彻底的OPC坏点解决策略
HPOTM in action：from design manufacturability optimization
to defect free OPC
|
张生睿， 东方晶源微电子科技（北京）股份有限公司产品总监
Shengrui Zhang, Product Director, Dongfang Jingyuan Electron
Co., Ltd.
|
|
09:00-09:20
|
|
TSMC
|
|
09:20-09:40
|
A Deep
Dive to Tower’s BCD Technology – Enabling Green and Automotive World
|
王敏，Tower
Semiconductor销售&FAE经理
Min Wang,
Sales & FAE Manager, Tower Semiconductor Ltd.
|
|
09:40-10:00
|
联电先进特色工艺及车规平台
UMC
Advanced Specialty Technologies & Auto Platform
|
陈剑波，和舰芯片制造（苏州）股份有限公司销售经理
Snowwolf
Chen, Sales Manager, HeJian Technology (Suzhou) Co., Ltd.
|
|
10:00-10:20
|
华力先进特色工艺平台晶圆代工技术
HLMC
Advanced Specialty Foundry Technologies
|
田明，上海华力微电子有限公司研发总监
Ming
Tian, Senior Director of TD，HLMC
|
|
10:20-10:40
|
荣芯153nm
5-120V全电压BCD解决方案助推电源管理驱动产品升级
Rongsemi
153nm Full Voltage （5-120v） BCD Solution Release and Promote the Upgrade on PMIC Product
Line
|
沈亮，荣芯半导体有限公司市场营销副总裁
Neo
Shen, VP of Marketing & Sales, Rong Semiconductor Co., Ltd.
|
|
10:40-11:00
|
|
华润上华
|
|
11:00-11:20
|
差异化工艺助力手机射频芯片技术演进
Differentiated Technologies Drive Mobile
RF Devices’ Evolution
|
张楷晨博士，格芯半导体科技（上海）有限公司手机无线业务线经理
Calvin Zhang Ph.D, Smart Mobile
Device & Wearable Business Line Manager, GlobalFoundries China
|
|
11:20-11:40
|
X-FAB以模拟工艺连结现实世界
How X-FAB’s
Analog Foundry Technologies Build a Bridge Between the Digital and the Real World
|
卫鹤鸣，X-FAB技术市场经理
Heming WEI, Technical Marketing Manager, X-FAB
|
|
11:40-12:00
|
|
华虹宏力
|
|
12:00-12:05
|
幸运抽奖Lucky Draw
|
|
12:05-13:10
|
自助午餐 Buffet Lunch
|
|
EDA与IC设计（二）
EDA and IC Design (II)
|
|
主持人：曹华锋，中国半导体行业协会集成电路设计分会副秘书长
Moderator: Huafeng Cao, Vice
General Director, CSIA-ICCAD
|
|
13:10-13:30
|
AI设计AI芯片——一个创新的新时代
AI Designing AI Chips – A New Era of Innovation
|
汤木明，新思科技技术总监
Muming Tang, Director of Application Engineering, Synopsys
|
|
13:30-13:50
|
自主可控的数字集成电路物理实现工具助推国产DTCO工艺流程
Self-controlled Physical Implementation Tools of Digital
Integrated Circuit Promote Domestic DTCO Progress
|
杨皓津，上海立芯软件科技有限公司副总经理
Haojin
Yang, VP, Shanghai LEDA Technology Co., Ltd.
|
|
13:50-14:10
|
底层融合赋能签核高维度创新
High-Dimensional Innovation in
Signoff Empowered By Underlying Integration
|
任旭，杭州行芯科技有限公司销售总监
Xu Ren, Sales Director, PHLEXING
Technology Co., Ltd.
|
|
14:10-14:30
|
良率驱动型后端设计EDA智能解决方案
Yield-Driven EDA Intelligent Solution for Back-End Design
|
李江伟，华芯巨数（杭州）微电子有限公司创始人/CEO
Jiangwei Li, Founder/CEO, Huaxin Jusu (Hangzhou) Microelectronics
Co., Ltd.
|
|
14:30-14:50
|
通过快速、高效的寄生参数分析和缩减来确保正确的电路设计
Ensuring Appropriate Circuit Behaviour Through Fast and
Efficient Post-layout Parasitic Exploration and Reduction
|
刘客，Silvaco中国AE经理
Ke Liu, AE Manager, Silvaco China Co., Ltd.
|
|
14:50-15:10
|
Altair先进可视化芯片开发平台及案例介绍
Altair Advanced Visualization Chip Development Platform and
Case Introduction
|
王轶华，Altair企业计算部技术总监
Yihua Wang, Technical Director of Enterprise Computing Group,
Altair
|
|
15:10-15:30
|
超宽带(UWB)芯片射频模拟前端的设计分析与探讨
The Analysis of the Analog Front End of an Ultra-Wideband
Transceiver IC
|
冯琪，苏州芯联成软件有限公司电路工程处经理
Qi Feng, Head of IC Analysis Department, Suzhou Silintech
Company
|
|
15:30-15:50
|
数字电路仿真EDA工具助力国产IC设计
Digital IC Simulation EDA Assisting Domestic IC Design
|
管楠，上海芯思维信息科技有限公司AE Manager
Nan Guan, AE Manager, Shanghai Semisight Information Technology
Co., Ltd.
|
|
15:50-16:10
|
新一代智能化PCB&封装设计工具链及数据综合解决方案
New Generation Intelligent PCB&packaging Design Toolchain
and Data Comprehensive Solution
|
杨飞，宁波为昕科技有限公司CEO
Fei Yang, CEO, Ningbo Vxin Technology Co., Ltd.
|
|
16:10-16:30
|
国产DFT普及实现与自主可控挑战
Domestic DFT Popularization
Realization and Autonomous Control Challenges
|
赵瑜斌，无锡玖熠半导体科技有限公司产品总监
Robin Zhao, Product Director, Wuxi Splendor
Semicondutor Technology Co., Ltd.
|
|
16:30-16:50
|
深耕增量式设计流程应用，赋能EDA发展新动力
|
魏星，奇捷科技（深圳）有限公司CEO
|
|
16:50-17:10
|
一站式集成电路设计云平台——楷领凌云平台
One-stop IC Design Cloud Platform
|
梁璞，上海楷领科技有限公司业务副总裁
Pu Liang, VP of Business Development, Kailing Technology
(Shanghai) Co., Ltd.
|
|
17:10-17:30
|
测试数据分析SaaS助力中小IC设计公司实现科学品控
Test Data Analysis SaaS Helps IC Design SMEs Achieve Efficient
Quality Control
|
郑尊标，杭州芯翼科技有限公司创始人/CEO
Zunbiao Zheng, Founder & CEO, Hangzhou Chipwing Technology
Co., Ltd.
|
|
17:30-17:35
|
幸运抽奖Lucky Draw
|
|
18:30-20:00
|
闭幕晚宴及交旗仪式
Closing Banquet and Flag Handover
Ceremony
地点：广州广交会威斯汀酒店宴会厅
Site: Banquet Hall,
The Westin Pazhou
|
2023年11月11日，星期六
Nov. 10, Saturday, 2023
专题论坛（七）
Subject Forum (VII)
地点：广州保利世贸博览馆三层G会议室
Venue: Meeting Room G, 3F, PWTC Expo
|
时
间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
|
IC设计与创新应用
IC Design & Innovation Application
|
|
主持人：
Moderator:
|
|
08:40-09:00
|
小芯片，大动能，联想凌拓半导体行业高效存储解决方案
Small Chips,
Big Momentum, Lenovo NetApp Storage Solutions for Semiconductor Industry
|
陈毅腾，联想凌拓芯片行业架构师
Yiteng Chen, Semiconductor Industry
Architect, Lenovo NetApp Technology Limited
|
|
09:00-09:20
|
Wi-SUN助推海外智能量测架构项目建设
Wi-SUN
Promotes the Construction of Advanced Metering Infrastructure Developments
|
赵海波，珠海中慧微电子有限公司总经理
Haibo Zhao, CEO, ZhuHai ZhongHui
Microelectronics Co., Ltd.
|
|
09:20-09:40
|
“蚂蚁搬大象”——轻量级DSP从指令到AI应用的进化
"Ants
Carrying Elephants” - Lightweight DSP Evolution from Instructions to AI
Applications
|
范名超，芯易荟（上海）芯片科技有限公司智能芯片方案架构师
Mingchao FAN, NPU Architect, ChipEasy
Technology (Shanghai) Limited
|
|
09:40-10:00
|
从系统级、芯片级寻求突破存储墙
Breaking
Memory Wall in System and Chip Level
|
左丰国，西安紫光国芯半导体股份有限公司副总裁
Fengguo Zuo, VP, Xi‘an UniIC Semiconductors
Co., Ltd.
|
|
10:00-10:20
|
|
地平线
|
|
10:20-10:40
|
安路科技第二代FPSOC器件特色和优势
Anlogic
2nd FPSOC FPGA Introduction
|
邓龙，上海安路信息科技股份有限公司市场部总监
Alex
Deng, Marketing Director, Shanghai Anlogic Infotech Co., Ltd.
|
|
10:40-11:00
|
基于半导体数据特征的一站式数据分析方案
One
Shop Data Analysis Solution Based on Semiconductor Data Features
|
赵明辉，上海喆塔信息科技有限公司产品总监
Minghui Zhao, Product Director, Shanghai
Zetatech Co., Ltd.
|
|
11:00-11:20
|
22nm产品创新突破，助力国产FPGA新发展
Breakthrough
Innovation in 22nm Technology as a Driving Force to the New Development of
China's FPGA Industry
|
王海力，京微齐力（北京）科技股份有限公司CEO
Haili Wang, CEO, Hercules
Microelectronics Co., Ltd.
|
|
11:20-11:40
|
国产FPGA赋能数字底座创新
|
吕喆，深圳市紫光同创电子有限公司市场总监
|
|
11:40-12:00
|
智联新时代，用芯共创数字未来
Creating
a Digital Future Together
|
吴昊，紫光展锐市场总监
Jacky Wu, Marketing Director, UNISOC
|
|
12:00-12:20
|
光纤通信及其专用集成电路
Optical
Fiber Communication and Its ASICs
|
陈永洲，武汉飞思灵微电子有限公司技术总监
YongZhou Chen, Technical Director,
Wuhan Fisilink Microelectronics Technology Co., Ltd.
|
|
12:20-12:25
|
幸运抽奖Lucky Draw
|
|
12:25-13:10
|
自助午餐 Buffet Lunch
|
|
IC设计与创新应用
IC Design & Innovation Application
|
|
主持人：中国半导体行业协会集成电路设计分会副秘书长
Moderator: Vice General Secretary, CSIA-ICCAD
|
|
13:10-13:30
|
|
华登国际（华芯（上海）创业投资
|
|
13:30-13:50
|
全球供应链重构下的中国半导体自主可控及投资机会
|
陈瑜，元禾璞华执行董事
|
|
13:50-14:10
|
|
西门子EDA
|
|
14:10-14:30
|
车规电源芯片的挑战和机遇
|
倪川，瓴芯电子科技（无锡）有限公司CEO
Chuan Ni, CEO, LEN Technology Ltd.
|
|
14:30-14:50
|
存算一体技术开启人工智能计算的新时代
Processing-in-Memory
(PIM) Technology Opens a New Era of Computing
|
杨越，苹芯科技联合创始人兼CEO
Yue Yang，Co founder & CEO of Pimchip
Technology
|
|
14:50-15:10
|
边缘AI芯片部署Transformer模型
Edge
AI SoC Deploy Transformer Model
|
唐琦，爱芯元智半导体（宁波）有限公司AI推理引擎总监
Qi Tang, Director of AI Inference Engine,
AXera Semiconductor (Ningbo) Co., Ltd.
|
|
15:10-15:30
|
兆易创新存储助力新一代智能可穿戴应用
GigaDevice
Memory Drives the Innovation in Smart Wearable Application
|
王欢，兆易创新Flash事业部市场经理
Wing Wang, Marketing Manager of Flash BU, GigaDevice Semiconductor
Inc.
|
|
15:30-15:50
|
“破风®8676”多模态可重构5G射频收发信机芯片
PoFeng
8676 Multi-mode Re-configurable 5G RF Transceiver Chip
|
李男，中国移动通信有限公司研究院无线与终端技术研究所副所长
Nan Li, Deputy Director of Department of Wireless and
Terminal Technology Research, China Mobile Research Institute
|
|
15:50-16:10
|
黑芝麻智能单SoC芯片方案加速汽车智能化转型
Single
SoC Chip Enabling Intelligent Transformation of Automobile
|
张松，黑芝麻智能高级产品市场经理
Song Zhang, Senior Product Marketing Manager of Black Sesame
Technologies Co., Ltd.
|
|
16:10-16:30
|
射频芯片系统集成设计挑战与解决方法
Challenges
and Solutions for System Integration of RF Chip Design
|
胡劼，深圳市中兴微电子技术有限公司模拟设计部部长
Jie Hu, Director of Analog
Design Dept, Sanechips Technology Co., Ltd.
|
|
16:30-16:50
|
|
智芯微
|
|
16:50-17:10
|
国产智能驾驶芯片的挑战和发展
Challenges
and Development of Domestic Autonomous Driving Chips
|
赵敏俊，上海为旌科技有限公司运营副总裁
Michael Zhao，VP of Operations, Shanghai Visinex Technologies Co., Ltd.
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17:10-17:30
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下一代存内计算的发展和应用
The Application and Development for Next
CIM Chip
|
王绍迪，北京知存科技有限公司CEO
Shaodi Wang, CEO, Beijing Zhicun
(Witmem) Technology Co., Ltd.
|
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17:30-17:50
|
数字化时代，IC企业如何构建安全、高效的研发工作环境
How
does IC Company Security Its DEV in the Digital Era
|
何轶，北京志翔科技股份有限公司解决方案总监
Yi He, Director of Industry Solution, Zshield Inc.
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17:50-17:55
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幸运抽奖Lucky Draw
|
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18:30-20:00
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闭幕晚宴及交旗仪式
Closing Banquet and Flag Handover
Ceremony
地点：广州广交会威斯汀酒店宴会厅
Site: Banquet Hall, The Westin Pazhou
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