时间 Time

内容  Contents

主持人：程晋格，中国集成电路设计创新联盟秘书长

Moderator: Jinge Cheng, General Secretary, ICDIA

开幕式

Opening Ceremony

08:30-09:00

无锡市政府领导致辞

Address, Leader of Wuxi Municipal People's Government

科技部领导致辞

Address, Leader of MOST

中国集成电路设计创新联盟领导致辞

Address, Leader of ICDIA

无锡经开区领导致辞

Address, Leader of Wuxi Economic development Zone

高峰论坛

Top Forum

09:00-09:25

走出中国集成电路特色创新之路

Out of a Chinese Characteristic Innovation Road of the Integrated Circuits

—      叶甜春，国家02专项技术总师、中国集成电路创新联盟副理事长兼秘书长

-        Tianchun Ye, Leader of the Panel of National Major Program 02 of Science and Technology, Secretary General of China Integrated Circuit Innovation Alliance

09:25-09:50

高速列车控制系统自主化之路

Road to Independent Development of High-Speed Train Control System

—      丁荣军，中国工程院院士、轨道交通牵引电传动和网络控制专家

—      Rongjun Ding, Academician of the Chinese Academy of Engineering, Expert in Electric Drive and Network Control for Rail Transit Traction

09:50-10:15

打造5G高协同创新链，共筑强根基产业链

Building a Highly Collaborative 5G Innovation Chain to Consolidate the Industrial Chain

—      王晓云，国家03专项技术副总师、中国移动通信集团有限公司技术部总经理

-        Xiaoyun Wang, GM of Technical Department, China Mobile Communications Group Co., Ltd.

10:15-10:40

资本推动中国芯片设计业由量变走向质变

Capital Promotes the Transformation of China's Chip Design Industry from “quantitative change” to “qualitative change”

—      孙玉望，中芯聚源股权投资管理（上海）有限公司合伙人兼总裁

-        Yuwang Sun, Partner & President, China Fortune-Tech Capital Co., Ltd.

10:40-11:05

从应用系统角度看芯片设计发展新模式

The Evolution of IC Design Model from Application Scenario Perspective

—      周晨，紫光展锐科技有限公司执行副总裁

-        Eric Zhou, EVP, UNISOC Technologies Co., Ltd.

11:05-11:30

TBD

—      陈伟，矽力杰董事长兼总经理

-       Wei Chen, President & GM, Silergy Corp.

11:30-11:55

集成电路设计新时期的一点思考

Some Thoughts on the New Era of Integrated Circuit Design

—      杨军，国家01专项专家，东南大学国家专用集成电路系统工程技术研究中心教授

-        Jun Yang, Expert of National Science and Technology Major Project 01, Professor of the National ASIC System Engineering Research Center of Southeast University

12:00-13:00

午餐 Lunch

主持人：时龙兴教授，中国集成电路设计创新联盟专家组组长

Moderator: Prof. Longxing Shi, Head of the ICDIA Expert Group

13:00-13:20

浅谈从IP到EDA2.5发展

A Brief Introduction to the Development from IP to EDA2.5

—      何薇玲，上海芯联芯智能科技有限公司创始人暨董事长、源创芯动科技（宁波）有限公司创始人暨董事长

-        Rosemary W. Ho, Chairman and CEO, CIP United Co., Shanghai, Chairman and CEO, Intelligent Neocore Limited, NingBo

13:20-13:40

国产先进工艺完整IP解决方案赋能产业数字化

Complete IP Solutions for Domestic Advanced Technology Empower Industrial Digitization

—      刘好朋，芯耀辉科技有限公司技术支持总监

-        Haopeng Liu, Technical Support Director, Akrostar Technology Co., Ltd.

13:40-14:00

立足产业创新，构建多元化异构计算平台

Create a Diversified and Heterogeneous Computing Platform on the Basis of Indigenous Innovation

—      刘澍，安谋科技产品研发负责人

-        William Liu, Head of Product Development, Arm Technology (China) Co., Ltd.

14:00-14:20

芯启源的EDA创新之路

EDA Innovation from Corigine

—      裘烨敏，芯启源电子科技有限公司EDA & IP销售总经理

-        Yemin Qiu, EDA & IP Sales GM, Corigine

14:20-14:40

创新+应用——打造国产EDA发展优势

Innovation + Application – Building up the Strength of Domestic EDA

-        郭继旺，北京华大九天科技股份有限公司副总经理

-        Jiwang Guo, Vice GM, Empyrean Technology Co., Ltd.

14:40-15:00

云豹DPU推动数据中心变革

JaguarMicro's DPU Drives Data Center Transformation

—      张学利，云豹智能联合创始人&COO

-        Henry Zhang, Co-founder & COO, JaguarMicro

15:00-15:20

EDA上云之路的探索与实践

Design Chip in the Cloud – A Reality or Fairy Tale?

—      王琦博士，英诺达（成都）电子科技有限公司创始人、董事长兼总经理

-        Dr. Qi Wang, Founder, Chairman and CEO, Ennocad (Chengdu) Electronics Technology Co., Ltd.

15:20-15:40

茶歇，交流 Coffee Break

15:40-16:00

先进工艺下国产高端IP的突破和芯片定制量产

The Breakthrough of Domestic High-End IP and Custom ASIC in Advanced Process Nodes

—      高专，芯动科技有限公司VP/技术总监

-        Zachary Gao, VP/Technical Director, INNOSILICON Technology Ltd.

16:00-16:20

国产一站式高端IP解决方案加速中国芯片国产化进程

High-end IP Solutions Accelerate the Process of Localization of Chinese Chips

—      王晓阳，奎芯科技联合创始人兼产品副总裁

-        Sean Wang, Product VP, M Square

16:20-16:40

后摩尔时代超大规模芯片设计挑战与EDA解决方案

VLSI Design Challenges and EDA Solutions in the Post-Moore Era

—      贺青，杭州行芯科技有限公司董事长兼总经理

-        Qing He, Chairman and CEO, Hangzhou Phlexing Technology Co., Ltd.

16:40-17:00

先进软件工具助力中国半导体设计公司的研发运营一体化（DevOps）实践

Advanced Software Tools Ensures the Practice of R&D and Operation Integration (DevOps) for Semiconductor Design Company in China

—      何为，上海孤波科技有限公司CEO

-        Pearl He, CEO, Shanghai Gubo Technology Co., Ltd.

17:00-17:20

车用电子元件封装解决方案

Packaging Solutions in Automotive Devices

—      林少羽，日月光工程整合处处长

-        Aronson Lin, Director of Central Development Engineering, ASE

17:20-17:40

AI与云计算在内存- CPU互连方面所面临的挑战及其解决方案

Challenges and Solutions of Memory- CPU Interconnection in AI and Cloud Computing

—      杨崇和，澜起科技董事长兼CEO

-        Howard Yang, Chairman and CEO, Montage Technology Co., Ltd.

17:40-18:00

中国家电行业与芯片行业融合发展

Integrated Development of China's Household Appliances Industry and Chip Industry

—      肖鹏，中国家用电器研究院部长

-        Peng Xiao, Director, China Household Electrical Appliance Research Institute

18:30-20:30

晚餐 Dinner

地点：无锡君来世尊酒店一楼香樟苑、兰花厅B

Venue: Camphor Western Restaurant & Lan Ballroom B, 1F, Worldhotel Grand Juna Wuxi

时间Time

内容Contents

主持人：邹广才，国家新能源汽车技术创新中心副总经理，

中国汽车芯片产业创新战略联盟副秘书长

Moderator: Guangcai Zou, Vice Director & GM of National New Energy Vehicle

Technology Innovation Center, Vice Secretary-General of

China Automotive Chip Industry Innovation Strategic Alliance

13:30-13:50

《汽车电子芯片创新产品目录》（2022）发布解读

Interpretation of Innovation Product Catalog of Automotive Electronic Chips (2022)

—  陈大为，中国电子技术标准化研究院副总工程师

-        Dawei Chen, Deputy Chief Engineer of China Electronics Standardization Institute

13:50-14:10

中国汽车芯片产业发展现状和主动应对

Development Status and Active Response of China's Automotive Chip Industry

—  原诚寅，国家新能源汽车技术创新中心主任/总经理，中国汽车芯片产业创新战略联盟秘书长

-        Chengyin Yuan, Director & GM of National New Energy Vehicle Technology Innovation Center, Secretary-General of China Automotive Chip Industry Innovation Strategic Alliance

汽车芯片创新产品路演

Automotive Chip Innovation Roadshow

14:10-14:20

产品+生态，持续提升国产车规MCU创新发展“芯”动能

Product + Ecology - Chip as a Driving Force in Developing Domestic Automotive-Grade MCUs

—  涂超平，合肥杰发科技有限公司产品经理

-        Chaoping Tu, Product Manager, AutoChips Inc.

14:20-14:30

KungFu内核汽车级MCU的布局和应用

Layout and Application of KungFu Core Automotive MCUs

—  卢恒洋，上海芯旺微电子技术有限公司FAE总监

-        Hengyang Lu, FAE Director, Shanghai ChipON Micro-Electronic Co., Ltd.

14:30-14:40

芯擎科技7nm高算力智能座舱芯片的进阶之路

The Development of Siengine 7nm Smart Cockpit Chip with High Computing Power

—  孙东，芯擎科技战略业务发展高级总监

-        Dong Sun, Senior Director of Strategic Business Development, Siengine Technology

14:40-14:50

国产车规照明控制芯片系统集成创新

Innovative Integration of Domestic Automotive-Grade Lighting Control SoC

—  李琛琳，英迪芯市场产品总监

-        Chenlin Li, Marketing Product Director, Indiemicro

14:50-15:00

芯力特全系列车载CAN、LIN收发器芯片与应用方案

Sit’s Full Range Automotive CAN and LIN Transceiver Chips and Applications

—   王闰星，湖南芯力特电子科技有限公司汽车电子业务总监

-        Runxing Wang, Director of Automotive Electronics Business, Sit Electronic Technology Co., Ltd.

15:00-15:10

聚焦车规模拟芯片，助力国产替代

Developing Automotive-Grade Analog Chips for Domestic Substitution

—   王海军，赛卓电子科技（上海）股份有限公司市场副总

-        Haijun Wang, Vice President of Marketing, Semiment Technology (Shanghai) Co., Ltd.

15:10-15:20

复微芯助力汽车安全、便捷、舒适新体验

Fudan Microeletronics Chips Enable Safe, Convenient and Comfort Mobility Experience

—   段永刚，上海复旦微电子集团股份有限公司北京分公司总经理

-        Yonggang Duan, GM of Beijing Fudan Microeletronics Technology Co., Ltd.

15:20-15:40

茶歇，交流 Coffee Break

15:40-15:50

国芯汽车电子MCU在车身及动力领域的突破性发展

Breakthroughs of C*Core Technology Automotive Electronic MCUs in Bodywork Control and Power System

—  蒋斌，苏州国芯科技股份有限公司副总

-        Bin Jiang, VP, C*Core Technology Co., Ltd.

15:50-16:00

瓴芯车规级芯片质量管理体系与电源类产品介绍

Introduction to QMS of LEN Automotive-Grade Chips and Regulators

—   张强，瓴芯电子科技（无锡）有限公司技术总监  

-   Qiang Zhang, Technical Director, LEN Technology Ltd.

16:00-16:10

国产芯片助力汽车智能安全升级

Domestic Chips Empower Smart and Safe Upgrading of Automobiles

—   程维，国民技术股份有限公司市场总监

-        Wei Cheng, Marketing Director, Nations Technologies Inc.

16:10-16:20

汽车RFID无源芯片的最新技术及应用

Latest Technologies and Applications of Automotive RFID Passive Chips

—  杨林丽，上海坤锐电子科技有限公司副总

-        Linli Yang, VP, Shanghai Quanray Electronics Co., Ltd.

16:20-16:30

数明隔离与驱动产品助力新能源汽车应用

Application of SILLUMIN Isolators and Drivers in Electric Vehicles

—  焦连胜，数明半导体汽车市场总监

-        Liansheng Jiao, Automobile Marketing Director, Sillumin Semiconductor Co., Ltd.

16:30-16:40

肩负国家使命，聚焦国产汽车芯片，助推汽车高质量发展  

Advancing Domestic Chips for High Quality Development of Automotive Industry as a National Mission

—  王胜，无锡华普微电子有限公司总经理

-        Sheng Wang, GM, Wuxi Huapu Microelectronics Co., Ltd.

16:40-16:50

汽车国产芯片应用

Application of Domestic Automotive Chips

—  强玉霖，芜湖伯特利汽车安全系统股份有限公司电子硬件总工程师

-        Yulin Qiang, Chief Engineer of Electronic Hardware, Bethel Automotive Safety Systems Co., Ltd.

16:50-17:10

芯片替代实践小结

Summary of Domestic Substitution of Chips

—  张海涛，上汽集团技术中心电子电器部执行总监

-        Haitao Zhang, Executive Director of Electronic and Electrical Department, SAIC Technology Center

17:10-17:30

东风车用芯片需求短缺-应对-挑战

Dongfeng Automotive Chips: Demand Shortage, Response and Challenges

—  雷鹏，东风汽车技术中心智能软件中心主任工程师

-        Peng Lei, Chief Engineer of Intelligent Software Center, Dongfeng Motor Technology Center

17:30-17:50

总结发言

Concluding Remarks

18:30-20:30

晚餐 Dinner

地点：无锡君来世尊酒店一楼香樟苑、兰花厅B

Venue: Camphor Western Restaurant & Lan Ballroom B, 1F, Worldhotel Grand Juna Wuxi

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演讲人

Lecturer

主持人：梁元聪，上海市汽车工程学会秘书长

Moderator: Yuancong Liang, Secretary-General, SAES

08:30-08:50

汽车芯片本土化思考与建议

Automotive Chip Localization Thinking and Suggestions

—  陈大为，中国电子技术标准化研究院副总工程师

-        David Chen, Deputy Chief Engineer, China Electronics Technology Standardization Institute

08:50-09:10

突破瓶颈的尝试--上汽车规级芯片AEC-Q100 联合认证确认平台

Endeavor to Break the Bottleneck--Joint Confirmation Platform for Automotive Chips AEC-Q100 Certification within SAIC Group

—  卢万成，联合汽车电子有限公司副总工程师,上海市汽车工程学会电器电子专委会副主任

-        Wancheng Lu, UAES, Vice Chief Engineer, Shanghai Society of Automotive Engineers, Vice Director of EE committee

09:10-09:30

汽车主机企业对芯片供应链本土化的思考

Sharing the Thoughts on Localization of Chip Supply Chain in Automobile OEMs

—  张海涛，上汽集团技术中心电子电器部执行总监

—  Zhang Haitao, E&E Dept. Director, SAIC Motor R&D Innovation Headquarters

09:30-09:50

本土车规级芯片的应用实战

Practical Application of Domestic Vehicle Class Chip

—  袁晓岗，华域视觉科技（上海）有限公司创新孵化高级经理

-        Xiaogang Yuan, Senior Manager of Innovation Incubation, Hasco Vision Technology Co., Ltd.

09:50-10:10

以国产自主可控车规处理器IP和设计服务助力汽车芯片国产化

Supporting Automotive Chips Development with Independently and Controllable Automotive-grade Processor IP and Design Services

—  王炳立，上海芯联芯智能科技有限公司高级销售总监，兼任源创芯动（宁波）有限公司总经理

-        Bingli Wang, Senior Sales Director & GM of Neocore, CIP United Co.

10:10-10:30

DPU在智能驾驶中的应用

Application of DPU in Intelligent Driving

—  胡侃，芯启源电子科技有限公司产品市场总监

-        Kan Hu, Product Marketing Director, Corigine

10:30-10:50

芯原车规级功能安全IP解决方案

VeriSilicon Functional Safety IP Solution for Automotive

—  张慧明，芯原微电子（上海）股份有限公司IP解决方案副总裁

-        Huiming Zhang, Vice President, IP Solutions, VeriSilicon Microelectronics (Shanghai) Co., Ltd.

10:50-11:10

半导体IP与高性能汽车电子芯片一站式解决方案

One-Stop Solution for IP and Automotive Chips

—  何颖，芯动科技有限公司产品总监/首席SoC架构师

-        Huck He, Product Director/ Chief SoC Architect, INNOSILICON Technology Ltd.

11:10-11:30

智能汽车SoC芯片及高速总线测试方案

Automotive SoC and High Speed IO Chipset Test Solutions

—  阳任平，是德科技中国区IC行业经理

-        Renping Yang, Greater China IC Industry Manager, Keysight

11:30-11:50

汽车电子设备的预测性维护

Predictive Maintenance for Automotive Electronics

—  刘兴刚，以色列商博谛安科技技术销售经理

-        Jack Liu, Technical Sales Manager, proteanTecs

11:50-12:00

上海汽车行业车规级芯片可靠性认证平台首家认证确认结果发布及颁证仪式

The first certification result release and presentation ceremony of the automotive-grade chip reliability certification platform of Shanghai automotive industry

12:00-12:10

2022汽车电子创新奖颁奖仪式   

2022 Automotive Electronic Innovation Award Ceremony

12:10-13:20

午餐 Lunch

时  间

Time

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演讲人

Lecturer

主持人：卢万成，联合汽车电子有限公司副总工

Moderator: Wancheng Lu, Deputy Engineer, United Automotive

Electronic Systems Co., Ltd.

13:20-13:40

基于DNS芯片的电动汽车BMS解决方案

BMS Solution for Electric Vehicle Based on DNS IC

程姣姣，大唐恩智浦半导体（徐州）有限公司销售经理

Michelle Cheng, Sales Manager, Datang NXP Semiconductors Xuzhou Co., Ltd.

13:40-14:00

车规芯片的功能安全解决方案

Functional Safety Solution for Automotive IC

游余新，西门子EDA 技术顾问

Yuxin You, Technical Consultant, Siemens EDA

14:00-14:20

探索集成电路先进封装发展新趋势Explore the Development Trend of Integrated Circuit Advanced Packaging

彭勇，池州华宇电子科技股份有限公司董事长兼总经理

Peter-Peng, GM, Chizhou HISEMI Electronics Technology Co., Ltd.

14:20-14:40

复微芯助力汽车安全、便捷、舒适新体验

Fudan Micro Helps New Car Experience of Security, Convenience and Comfort

段永刚，上海复旦微电子集团股份有限公司北京分公司总经理

Yonggang Duan, GM of Beijing Branch,  Shanghai Fudan Microelectronics Group Co., Ltd.

14:40-15:00

国民技术车规级产品及应用分享

Nations Automotive Grade MCU and Application Sharing

程维，国民技术股份有限公司市场总监

Wei Cheng, Marketing Director, Nations Technologies Inc.

15:00-15:20

如何使用Altair Simulation方案加速从设计到制造全过程的产品研究

How to Accelerate Your Product Research from Design to Manufacturing Process Based on Altair Simulation

焦金龙，Altair中国高频电磁EMC技术专家

Jinlong Jiao, High Frequency Electromagnetic EMC Technical Expert, Altair Engineering Inc.

15:20-15:40

茶歇，交流 Coffee Break

15:40-16:00

国产车规级功能安全芯片的布局与发展

Layout and Development of Automotive Functional Safety MCU

涂超平，合肥杰发科技有限公司产品经理

Chaoping Tu, Product Manager,   AutoChips Inc. 

16:00-16:20

车载电子元器件质量检验及分析案例介绍

Vehicle Electronic Components Quality Inspection and Case Analysis

赵巍，广州广电计量检测股份有限公司DPA技术经理

Wei Zhao, DPA Technical Manager, Guangzhou GRG Metrology & Test Co., Ltd.

16:20-16:40

端云一体赋能汽车智能——北斗高精度定位应用

"Terminals+Cloud" Solution Impowers the Automotive Intelligence - BeiDou High-precision Positioning Application

邬泳，千寻位置网络有限公司总监

Yong Wu, R&D Director, Qianxun Spatial Intelligence Inc.

16:40-17:00

芯旺车规芯片在车身控制域的应用

The Application of ChipON’s Automotive-grade Chip in Body Control Domain

卢恒洋，上海芯旺微电子技术有限公司FAE总监

Ethan Lu, FAE Director, ChipON

17:00-17:20

以EDA视角看汽车半导体市场动态

Automotive Dynamics – An EDA Perspective

许克龙，Cadence产品经理

Clone Xu, Account Technical Executive, Cadence

17:20-17:40

赛卓电子以创新助力智能底盘芯片国产化

Semiment Supports IC Localization of Smart Vehicle Chassis Solution with Innovation

王海军，赛卓电子科技（上海）股份有限公司市场副总

Haijun Wang, VP Marketing, Semiment Technology Co., Ltd.

18:00-20:00

晚餐 Dinner

地点：无锡君来世尊酒店一楼香樟苑

Venue: Camphor Western Restaurant, 1F, Worldhotel Grand Juna Wuxi

时  间

Time

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Contents

演讲人

Lecturer

主持人：徐璐琦，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Luqi Xu, Vice General Secretary, CSIA-ICCAD

08:40-09:00

EDA 2.0助力解决AIoT芯片的原型验证挑战

EDA 2.0 Support to Solve AIoT Design Challenges in Prototyping Verification

杨晔，芯华章科技产品与业务规划总监

Luke Yang, Product and Business Planning Director, XEPIC

09:00-09:20

云原生DPU芯片的创新与应用 Innovation and Application of Cloud Native DPU Chip

Frey Li, 云豹智能产品市场负责人

Frey Li, Head of Products and Marketing, JaguarMicro

09:20-09:40

利用标准化的功耗测量验证方案进行芯片功耗表现优化

Optimize Semiconductor Power Efficiency with a Standard Solution for Power and Performance Validation

周文昊，上海恩艾仪器有限公司亚太区半导体业务发展经理

Wenhao Zhou, Principal BDM - Semiconductor, National Instruments

09:40-10:00

芯原大健康芯片设计平台与软件解决方案

VeriSilicon Health SoC Design Paltform and Software Solution

汪志伟，芯原微电子（上海）股份有限公司高级副总裁、系统平台解决方案和设计IP事业部总经理

Wiseway Wang, Senior Vice President, GM of System Platform Solution Division and Design IP Division, VeriSilicon Microelectronics (Shanghai) Co., Ltd.

10:00-10:20

AI技术提升消费领域新体验

AI Enhance New Experience in the Consumer Field

王文兵，爱芯元智新业务中心总经理

Sander Wang, GM of New Product Center, Axera

10:20-10:40

存算一体助力AIoT大算力低功耗

Computing-in-Memory, Engine of AIoT

詹慕航，北京知存科技有限公司BD副总

Harry Zhan, BD VP, Witmem

10:40-11:00

DSA设计联合完备的部署方案助力端侧人工智能芯片在AIoT时代的成功落地

The Union of DSA Design and Complete Deployment Solution Helps End Side AI chip’s Success Landing in AIoT Era

仇健乐，时擎智能科技（上海）有限公司研发副总裁

Jianle Qiu, R&D VP, Timesintelli Technology

11:00-11:20

ADA感存算一体化平台使能超低功耗常启端侧智能物联节点

ADA Platform for Integration of Perception-Storage-Computing to enable Ultra-low Power Always-on End-point AIoT Nodes

郑宏钊，深圳市九天睿芯科技有限公司产品解决方案总监

Hongzhao Zheng, Product Solution Manager, Reexen Co., Ltd.

11:20-11:40

数字空间的未来制造解决方案

Future Manufacturing Solutions in Digital Space

王峰，无锡雪浪数制科技有限公司创始人、董事长&CEO

Feng Wang, Chairman, CEO & founder of Wuxi Xuelang Industrial Intelligence Technology Co., Ltd.

11:40-12:00

高能效端侧神经网络训练加速器设计

High-Energy-Efficiency Neural Network Training Accelerator for Edge Computing

王中风，国家“千人计划”特聘专家、南京大学教授、IEEE Fellow

Zhongfeng Wang, Professor, Nanjing University, IEEE Fellow

12:00-13:30

自助午餐 Buffet Lunch

时  间

Time

内    容

Contents

演讲人

Lecturer

主持人：莫永聪，上海市汽车工程学会汽车电子专委会副主任

Moderator: Yongcong Mo, Deputy Director of the Automotive Electronics Committee, the Shanghai Society of Automotive Engineers

13:20-13:40

智能网联控制系统与芯片国产化探索

Research on Intelligent Networked Control System and Chip Localization

罗来军，联创汽车电子有限公司总工程师

Laijun Luo, Chief Engineer, Dias Automotive Electronic System Co., Ltd.

13:40-14:00

汽车智能网联应用开发对芯片的促进

The Promotion of Automotive Intelligent Application Development to IC

李志刚，无锡车联天下信息技术有限公司 首席技术官

Zhigang Li, CTO, Autolink Information Technology Co., Ltd.

14:00-14:20

国产汽车电子关键技术突破与应用

Breakthrough and Application of Key Technology of Domestic Automotive Electronics

肖佐楠，苏州国芯科技股份有限公司总经理

Joe Xiao, CEO, C*Core Technology Co., Ltd.

14:20-14:40

高性能智能驾驶计算平台

High Performance Autonomous Driving Computing Platform

肖丹，北京核芯达科技有限公司汽车智能座舱VP

Dany Xiao, VP of Automotive Intelligent Cockpit, Beijing He Xin Da Science and Technology Co., Ltd.

14:40-15:00

AI识别技术在先进制造过程追溯中的创新应用

Innovation Application of AI Recognition Technology in Advanced Manufacturing Process Traceability

姚奇，博世智能科技PUT产品负责人

Roger Yao, Product Owner of PUT, Bosch-Smartlife

15:00-15:20

NFC在汽车电子中的应用 — NFC数字车钥匙

NFC for Automotive - Digital Key System

王鹏飞，意法半导体亚太区MMS市场及应用部产品市场经理

Pengfei Wang, Product Marketing Section Manager of Market & Application-MMS Asia Pacific,

STMicroelectronics (China) Investment Co., Ltd.

15:20-15:40

瑞萨电子自动驾驶解决方案

Renesas ADAS Solution

应毅辰，瑞萨电子副经理

Cross Ying, Supervisor, Renesas            

15:40-16:00

英博超算在智能驾驶领域的方案和实践

Design and Practices of Unlimited AI in Intelligent Driving

田锋，英博超算（南京）科技有限公司总经理

Feng Tian, GM, Unlimited AI Co., Ltd.

16:00-16:20

高清车载微型显示器——豪威集团为AR HUD显示提供新选择

LCOS - OmniVision Group Providing New Choice for AR HUD

李飞，豪威集团-上海韦尔半导体股份有限公司市场经理

Eagle Li, Sr BD Manager, OmniVision Group – Will Semiconductor Co., Ltd.

16:20-16:40

基于高功率技术深度融入ADAS系统的超级电容冗余电源

Supercapacitor Backup Power Supply Based on High Power Technology Integrated ADAS System

孙伟，烯晶碳能电子科技无锡有限公司，CTO

Wei Sun, CTO, GMCC

16:40-17:00

茶歇，观展交流 Coffee Break

18:00-20:00

晚餐 Dinner

地点：无锡君来世尊酒店一楼香樟苑

Venue: Camphor Western Restaurant, 1F, Worldhotel Grand Juna Wuxi

时  间

Time

内    容

Contents

演讲人

Lecturer

主持人：孙芹，中关村芯园（北京）有限公司副总经理

Moderator: Qin Sun, VP, Beijing ICC

09:00-09:20

打造泛模拟芯片设计制造协同发展生态

Create A Collaborative Development of Ecology for Analog Related Chip Design And Manufacturing

刘晓明，北京华大九天科技股份有限公司产品总监

Michael Liu, Product Director, Empyrean Technology Co., Ltd.

09:20-09:40

IP助力汽车电子

IP Makes Automotive Electronics Smarter

钟香建，芯耀辉科技有限公司IP产品市场和销售总监

Xiangjian Zhong, IP Product Marketing and Sales Director, Akrostar Technology Co., Ltd.

09:40-10:00

面向未来物联网的高密度、高可靠、高安全计算平台

High Density, High Robust, High Security Computing for future IoT

邹伟，安谋科技解决方案总监

James Zou, Director of Solution Architect, Arm Technology (China) Co., Ltd.

10:00-10:20

先进工艺下超大规模芯片RC参数提取EDA前沿技术

Cutting-edge EDA Technology of VLSI RC Extraction at Advanced Process Nodes

崔晓亮，杭州行芯科技有限公司产品总监

Xiaoliang Cui, Product Director, Hangzhou Phlexing Technology Co., Ltd.

10:20-10:40

智能化系统级SoC验证解决方案

A Intelligent System Level SoC Verification Solution

杨秀侠，英诺达（成都）电子科技有限公司项目管理总监

Xiuxia Yang, Project Management Director, Ennocad (Chengdu) Electronics Technology Co., Ltd.

10:40-11:00

高速互联IP赋能数据中心算力池

High-speed IP Empowers Data Center Calculation Power

唐睿，奎芯科技市场及战略部副总裁

Rui Tang, Marketing & Strategy VP, M Square

11:00-11:20

基于混合云的IC设计仿真平台

IC Design and Simulation Platform Based on Hybrid Cloud

邓世友，紫光云技术有限公司芯片云业务部长

Shiyou DENG, Head of IC Design Cloud Department, UniCloud Tech Co., Ltd.

11:20-11:40

破局之路——IC设计型公司管理方案分享

The Policy of Breaking Current Situations - IC Design Company Management Scheme Sharing

耿俊强，鼎捷软件股份有限公司IC设计行业专家

Junqiang Geng, IC Design Industry Expert, Digiwin Software Co., Ltd.

11:40-12:00

RISC-V芯片的设计效率提升

Improving Design Productivity for RISC-V Based IC

陈维嵬，西门子EDA OneSpin应用工程师

Weiwei Chen, OneSpin Application Engineer, Siemens EDA

12:00-13:30

午餐 Lunch

主持人：何卫，中国集成电路设计创新联盟副理事长

Moderator: Wei He, Vice General Director, ICDIA

13:30-13:50

玄铁处理器开源，构建RISC-V芯片普惠生态

The Open Source of Xuantie series Processors: Building an Inclusive RISC-V Chip Eco-system

陈炜，平头哥CPU技术运营负责人Wei Chen, Head of CPU Technology Operation, T-head

13:50-14:10

国产EDA在先进封装领域的机遇和挑战

Opportunities and Challenges in the Field of Advanced Packaging of The Domestic EDA

张建超，芯瑞微（上海）电子科技有限公司SIP事业部总经理

Jianchao Zhang, GM of SIP Division, PHYSIM Electronic Technology Co,, Ltd.

14:10-14:30

开启RISC-V在高性能应用场景的时代

RISC-V is Moving to High-performance Application

周杰，上海赛昉科技有限公司资深销售总监

Jay Zhou, Senior Sales Director, Shanghai StarFive Technology Co., Ltd.

14:30-14:50

智能融合技术提升复杂SoC芯片的验证效率

Intelligent Fusion Technology Improves Verification Efficiency for Complex SoC Chips

郭正，芯华章科技资深产品市场经理

Justin Guo, Senior Product Marketing Manager, XEPIC

14:50-15:10

汽车电子系统架构设计案例分享：整车电气系统、电池管理、功能安全

Genesis Architecture Design Solution For Automotive Applications

梁琪，国微思尔芯产品经理

Cindy Liang, PM, S2C

15:10-15:30

茶歇，交流 Coffee Break

15:30-15:50

构建物联网芯片体系，共赢RISC-V产业合作新生态

Build IoT Chip Product System and Win-Win RISC-V Industrial Cooperation Ecology

乔文平，芯昇科技有限公司产品总监

Vince Qiao, Product Director, Xinsheng Technology Co., Ltd.

15:50-16:10

Cerebrus^TM 智能芯片的探索引擎

Cerebrus^TM Intelligent Chip Explorer

刘淼，上海楷登电子科技有限公司产品工程高级资深总监

Miao Liu, Product Engineering Sr. Group Director, Cadence Design System

16:10-16:30

志翔科技为IC企业构建安全高效的研发环境

ZShield：Secure the Workplace for IC Company

何轶，志翔科技解决方案总监

Yi He, Director of Industry Solution, Zshield Inc.

16:30-16:50

芯思原探索国产化IP的实践

Practice of VeriSyno in Exploring Localized IP

丛姗姗，芯思原微电子有限公司销售市场副总裁

Shanshan Cong, Vice President of Sales & Marketing, VeriSyno Microelectronics Co., Ltd.

16:50-17:10

5G基站核心芯片国产化前景展望

Outlook on the Localization Process of 5G Base Station Chips

王勇，北京力通通信公司营销部总经理

Nelson Wang, GM of Sales & Marketing , Beijing Zealync Communication Co., Ltd.  

17:10-17:30

信息安全IC在物联网中的应用

Application of Information Security IC in Internet of Things

张昊，无锡安可芯信息技术有限公司总经理

Hao Zhang, GM, Wuxi Advanced Chip Information Technology Co., Ltd.

18:00-20:00

晚餐 Dinner

地点：无锡君来世尊酒店一楼香樟苑

Venue: Camphor Western Restaurant, 1F, Worldhotel Grand Juna Wuxi

主持人：秦艳，无锡经开区管委会副主任

Moderator: Yan Qin, Deputy Director of Management Committee of Wuxi Economic Development Zone

  08:50-09:10

无锡经开区党工委书记、管委会主任杨建平致辞

Address by Jianping Yang, Secretary of CPC Working Wuxi Economic Development Zone, Director of Administrative Committee

中国半导体行业协会集成电路设计分会理事长魏少军教授致辞

Address by Prof. Shaojun Wei, General Director of CSIA-ICCAD

09:10-09:20

无锡经开区集成电路及存储产业投资环境推介

Introduction to Investment in WEDZ IC and Storage Industry

— 无锡经开区招商中心副主任、太湖湾信息技术产业园管理中心主任陈建军Jianjun Chen, Deputy Director of WEDZ Investment Promotion Center and Director of Taihu Bay Information Technology Park Management Center

09:20-09:30

签约揭牌

Signing Ceremony

1、 无锡半导体存储产业生态圈首批合作伙伴签约

Signing of first batch of cooperation agreements with Wuxi semiconductor storage industry ecosystem

2、 无锡经开区集成电路企业合作意向签约

Signing of LOI for cooperation with WEDZ IC companies

3、 重大项目签约

Signing of agreements for major projects

09:30-09:50

内存产品演进和新一代产品

Dynamic Random Access Memory Evolution and New Generation Products

－ 李红文，长鑫存储技术有限公司副总裁

-        Hongwen Li, Vice President, ChangXin Memory Technologies, Inc.

09:50-10:10

引领存储创“芯”，共迎生态新机遇

Lead Storage Innovation and Jointly Meet New Ecological Opportunities

—   陈磊，东芯半导体股份有限公司副总经理

-        Lei Chen, Vice GM, Dosilicon Co., Ltd.

10:10-10:30

存储封装工艺创新与挑战—贺利氏解决方案

Innovation and Challenge in Memory Product assembly – Heraeus’s Solution

—  刘锡锋，贺利氏电子业务开发经理

—  Locker Liu, Business Development Manager, Heraeus Electronics

10:30-10:50

探索存储解决方案 IDM 的新机遇

Exploring Growth Opportunities for Storage Solution IDM

—   韦浩，联和存储科技（江苏）有限公司副总裁

—   Harry, Operation VP, UMT

10:50-11:10

群雄并起，存储行业的现状与机遇

The current situation and opportunities of the memory industry

—   王超，至讯创新科技（无锡）有限公司首席运营官

-        Ray Wang, COO, UNIM Innovation (Wuxi) Co., Ltd.

11:10-11:30

“存储”创“芯”，打造国产化存储之崛起

Innovative Chips for Storage, Rise of Domestic Storage Solutions

—   张志勇，合肥大唐存储科技有限公司安全产品线总监

-        Zhiyong Zhang, Director of Safety Product Line, Hefei DATANG Storage Technology Co., Ltd.

11:30-12:10

圆桌论坛：存储器关键技术创新与生态构建

Panel Discussion: Key Memory Technologies Innovation and Ecosystem Construction

主持人：陈军宁教授，中国集成电路设计创新联盟专家组专家

Moderator: Prof. Junning Chen, Expert of ICDIA

1、  制约我国主流半导体存储器产业发展的主要瓶颈

Main bottlenecks restricting the development of mainstream semiconductor memory industry in China

2、  新型半导体存储器的机遇与挑战

Opportunities and challenges of new semiconductor memories

3、  发展我国新型半导体存储器技术创新思路

Innovative ideas for developing new semiconductor memory technologies in China

4、  资本如何助力存储器产业创新

How can capital boost innovation in the memory industry?

12:10-13:30

午餐 Lunch