中国集成电路设计创新大会暨IC应用博览会
China IC Design Innovation
Conference and IC Application Expo
ICDIA 2022议程
Agenda
2022年8月25日,星期四
Thursday, August 25, 2022
高峰论坛
Top Forum
地点:无锡太湖国际博览中心一楼B3馆A区
Venue: Hall B3-A, 1F, Wuxi Taihu International Expo Center
时间 Time
|
内容 Contents
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主持人:程晋格,中国集成电路设计创新联盟秘书长
Moderator: Jinge
Cheng, General Secretary, ICDIA
|
开幕式
Opening Ceremony
|
08:30-09:00
|
无锡市政府领导致辞
Address, Leader of Wuxi Municipal People's
Government
科技部领导致辞
Address, Leader of MOST
中国集成电路设计创新联盟领导致辞
Address, Leader of ICDIA
无锡经开区领导致辞
Address, Leader of Wuxi Economic development Zone
|
高峰论坛
Top Forum
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09:00-09:25
|
走出中国集成电路特色创新之路
Out of a Chinese Characteristic Innovation Road of the Integrated
Circuits
— 叶甜春,国家02专项技术总师、中国集成电路创新联盟副理事长兼秘书长
-
Tianchun Ye, Leader
of the Panel of National Major Program 02 of Science and Technology, Secretary
General of China Integrated Circuit Innovation Alliance
|
09:25-09:50
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高速列车控制系统自主化之路
Road to Independent
Development of High-Speed Train Control System
— 丁荣军,中国工程院院士、轨道交通牵引电传动和网络控制专家
— Rongjun Ding, Academician of the Chinese Academy of Engineering, Expert
in Electric Drive and Network Control for Rail Transit Traction
|
09:50-10:15
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打造5G高协同创新链,共筑强根基产业链
Building a Highly Collaborative 5G Innovation Chain to
Consolidate the Industrial Chain
— 王晓云,国家03专项技术副总师、中国移动通信集团有限公司技术部总经理
-
Xiaoyun Wang, GM of
Technical Department, China Mobile Communications Group Co., Ltd.
|
10:15-10:40
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资本推动中国芯片设计业由量变走向质变
Capital Promotes the Transformation of China's Chip Design
Industry from “quantitative change” to “qualitative change”
— 孙玉望,中芯聚源股权投资管理(上海)有限公司合伙人兼总裁
-
Yuwang Sun, Partner & President, China Fortune-Tech Capital
Co., Ltd.
|
10:40-11:05
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从应用系统角度看芯片设计发展新模式
The Evolution of
IC Design Model from Application Scenario Perspective
— 周晨,紫光展锐科技有限公司执行副总裁
-
Eric Zhou, EVP,
UNISOC Technologies Co., Ltd.
|
11:05-11:30
|
TBD
— 陈伟,矽力杰董事长兼总经理
- Wei Chen, President & GM, Silergy Corp.
|
11:30-11:55
|
集成电路设计新时期的一点思考
Some Thoughts on the New Era of
Integrated Circuit Design
— 杨军,国家01专项专家,东南大学国家专用集成电路系统工程技术研究中心教授
-
Jun Yang, Expert of National
Science and Technology Major Project 01, Professor of the National ASIC
System Engineering Research Center of Southeast University
|
12:00-13:00
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午餐 Lunch
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主持人:时龙兴教授,中国集成电路设计创新联盟专家组组长
Moderator: Prof. Longxing Shi, Head of the ICDIA Expert Group
|
13:00-13:20
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浅谈从IP到EDA2.5发展
A Brief Introduction to the Development
from IP to EDA2.5
—
何薇玲,上海芯联芯智能科技有限公司创始人暨董事长、源创芯动科技(宁波)有限公司创始人暨董事长
-
Rosemary W. Ho, Chairman and CEO, CIP United Co., Shanghai, Chairman
and CEO, Intelligent Neocore Limited, NingBo
|
13:20-13:40
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国产先进工艺完整IP解决方案赋能产业数字化
Complete
IP Solutions for Domestic Advanced Technology Empower Industrial Digitization
— 刘好朋,芯耀辉科技有限公司技术支持总监
-
Haopeng Liu,
Technical Support Director, Akrostar Technology Co., Ltd.
|
13:40-14:00
|
立足产业创新,构建多元化异构计算平台
Create a
Diversified and Heterogeneous Computing Platform on the Basis of Indigenous
Innovation
—
刘澍,安谋科技产品研发负责人
-
William Liu, Head of Product Development, Arm Technology (China) Co.,
Ltd.
|
14:00-14:20
|
芯启源的EDA创新之路
EDA
Innovation from Corigine
—
裘烨敏,芯启源电子科技有限公司EDA & IP销售总经理
-
Yemin Qiu, EDA & IP Sales GM, Corigine
|
14:20-14:40
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创新+应用——打造国产EDA发展优势
Innovation
+ Application – Building up the Strength of Domestic EDA
-
郭继旺,北京华大九天科技股份有限公司副总经理
-
Jiwang Guo, Vice GM, Empyrean Technology Co., Ltd.
|
14:40-15:00
|
云豹DPU推动数据中心变革
JaguarMicro's
DPU Drives Data Center Transformation
—
张学利,云豹智能联合创始人&COO
-
Henry Zhang, Co-founder & COO, JaguarMicro
|
15:00-15:20
|
EDA上云之路的探索与实践
Design Chip in the Cloud – A
Reality or Fairy Tale?
— 王琦博士,英诺达(成都)电子科技有限公司创始人、董事长兼总经理
-
Dr. Qi Wang, Founder,
Chairman and CEO, Ennocad (Chengdu) Electronics Technology Co., Ltd.
|
15:20-15:40
|
茶歇,交流 Coffee Break
|
15:40-16:00
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先进工艺下国产高端IP的突破和芯片定制量产
The
Breakthrough of Domestic High-End IP and Custom ASIC in Advanced Process
Nodes
— 高专,芯动科技有限公司VP/技术总监
-
Zachary Gao,
VP/Technical Director, INNOSILICON Technology Ltd.
|
16:00-16:20
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国产一站式高端IP解决方案加速中国芯片国产化进程
High-end IP Solutions Accelerate
the Process of Localization of Chinese Chips
— 王晓阳,奎芯科技联合创始人兼产品副总裁
-
Sean Wang, Product VP,
M Square
|
16:20-16:40
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后摩尔时代超大规模芯片设计挑战与EDA解决方案
VLSI Design Challenges and EDA
Solutions in the Post-Moore Era
— 贺青,杭州行芯科技有限公司董事长兼总经理
-
Qing He, Chairman and
CEO, Hangzhou Phlexing Technology Co., Ltd.
|
16:40-17:00
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先进软件工具助力中国半导体设计公司的研发运营一体化(DevOps)实践
Advanced Software Tools Ensures
the Practice of R&D and Operation Integration (DevOps) for Semiconductor
Design Company in China
— 何为,上海孤波科技有限公司CEO
-
Pearl He, CEO, Shanghai
Gubo Technology Co., Ltd.
|
17:00-17:20
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车用电子元件封装解决方案
Packaging Solutions in Automotive
Devices
— 林少羽,日月光工程整合处处长
-
Aronson Lin, Director
of Central Development Engineering, ASE
|
17:20-17:40
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AI与云计算在内存- CPU互连方面所面临的挑战及其解决方案
Challenges and Solutions of
Memory- CPU Interconnection in AI and Cloud Computing
— 杨崇和,澜起科技董事长兼CEO
-
Howard Yang, Chairman
and CEO, Montage Technology Co., Ltd.
|
17:40-18:00
|
中国家电行业与芯片行业融合发展
Integrated Development of China's
Household Appliances Industry and Chip Industry
— 肖鹏,中国家用电器研究院部长
-
Peng Xiao, Director, China Household Electrical Appliance
Research Institute
|
18:30-20:30
|
晚餐 Dinner
地点:无锡君来世尊酒店一楼香樟苑、兰花厅B
Venue: Camphor Western Restaurant & Lan Ballroom B, 1F, Worldhotel
Grand Juna Wuxi
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第九届汽车电子创新论坛
The 9th Auto Electronic Innovation
Forum(AEIF 2022)
2022年8月25日,星期四
Thursday, August 25, 2022
(一)汽车芯片供需对接会
I: The Automotive Chips
Supply - Demand Matchmaking Conference
(定向邀请汽车芯片、整车、零部件企业)
(Fixed
invitation of automotive chips, automobile and parts enterprises)
地点:无锡君来世尊酒店一楼兰花厅A
Venue: Lan Ballroom A, 1F, Worldhotel Grand Juna Wuxi
时间Time
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内容Contents
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主持人:邹广才,国家新能源汽车技术创新中心副总经理,
中国汽车芯片产业创新战略联盟副秘书长
Moderator: Guangcai Zou, Vice Director & GM of National New
Energy Vehicle
Technology Innovation Center, Vice Secretary-General
of
China Automotive Chip Industry
Innovation Strategic Alliance
|
13:30-13:50
|
《汽车电子芯片创新产品目录》(2022)发布解读
Interpretation of Innovation Product Catalog of Automotive
Electronic Chips (2022)
— 陈大为,中国电子技术标准化研究院副总工程师
-
Dawei Chen, Deputy Chief Engineer of China Electronics Standardization
Institute
|
13:50-14:10
|
中国汽车芯片产业发展现状和主动应对
Development Status and Active Response of China's Automotive Chip
Industry
— 原诚寅,国家新能源汽车技术创新中心主任/总经理,中国汽车芯片产业创新战略联盟秘书长
-
Chengyin Yuan, Director & GM of National New Energy Vehicle
Technology Innovation Center, Secretary-General of China Automotive Chip
Industry Innovation Strategic Alliance
|
汽车芯片创新产品路演
Automotive Chip Innovation Roadshow
|
14:10-14:20
|
产品+生态,持续提升国产车规MCU创新发展“芯”动能
Product + Ecology - Chip as a Driving Force in Developing Domestic
Automotive-Grade MCUs
—
涂超平,合肥杰发科技有限公司产品经理
-
Chaoping Tu, Product
Manager, AutoChips Inc.
|
14:20-14:30
|
KungFu内核汽车级MCU的布局和应用
Layout and Application of
KungFu Core Automotive MCUs
— 卢恒洋,上海芯旺微电子技术有限公司FAE总监
-
Hengyang Lu, FAE Director,
Shanghai ChipON Micro-Electronic Co., Ltd.
|
14:30-14:40
|
芯擎科技7nm高算力智能座舱芯片的进阶之路
The Development of Siengine
7nm Smart Cockpit Chip with High Computing Power
— 孙东,芯擎科技战略业务发展高级总监
-
Dong Sun, Senior Director of
Strategic Business Development, Siengine Technology
|
14:40-14:50
|
国产车规照明控制芯片系统集成创新
Innovative Integration of
Domestic Automotive-Grade Lighting Control SoC
— 李琛琳,英迪芯市场产品总监
-
Chenlin Li, Marketing Product
Director, Indiemicro
|
14:50-15:00
|
芯力特全系列车载CAN、LIN收发器芯片与应用方案
Sit’s Full Range Automotive
CAN and LIN Transceiver Chips and Applications
— 王闰星,湖南芯力特电子科技有限公司汽车电子业务总监
-
Runxing Wang, Director of
Automotive Electronics Business, Sit Electronic Technology Co., Ltd.
|
15:00-15:10
|
聚焦车规模拟芯片,助力国产替代
Developing Automotive-Grade
Analog Chips for Domestic Substitution
— 王海军,赛卓电子科技(上海)股份有限公司市场副总
-
Haijun Wang, Vice President of
Marketing, Semiment Technology (Shanghai) Co., Ltd.
|
15:10-15:20
|
复微芯助力汽车安全、便捷、舒适新体验
Fudan Microeletronics Chips Enable Safe, Convenient and Comfort Mobility Experience
— 段永刚,上海复旦微电子集团股份有限公司北京分公司总经理
-
Yonggang Duan, GM of Beijing
Fudan Microeletronics Technology Co., Ltd.
|
15:20-15:40
|
茶歇,交流 Coffee Break
|
15:40-15:50
|
国芯汽车电子MCU在车身及动力领域的突破性发展
Breakthroughs of C*Core
Technology Automotive Electronic MCUs in Bodywork Control and Power System
— 蒋斌,苏州国芯科技股份有限公司副总
-
Bin Jiang, VP, C*Core Technology
Co., Ltd.
|
15:50-16:00
|
瓴芯车规级芯片质量管理体系与电源类产品介绍
Introduction to
QMS of LEN Automotive-Grade Chips and Regulators
— 张强,瓴芯电子科技(无锡)有限公司技术总监
- Qiang Zhang, Technical Director, LEN
Technology Ltd.
|
16:00-16:10
|
国产芯片助力汽车智能安全升级
Domestic Chips
Empower Smart and Safe Upgrading of Automobiles
— 程维,国民技术股份有限公司市场总监
-
Wei Cheng, Marketing Director, Nations Technologies Inc.
|
16:10-16:20
|
汽车RFID无源芯片的最新技术及应用
Latest Technologies and
Applications of Automotive RFID Passive Chips
— 杨林丽,上海坤锐电子科技有限公司副总
-
Linli Yang, VP, Shanghai Quanray
Electronics Co., Ltd.
|
16:20-16:30
|
数明隔离与驱动产品助力新能源汽车应用
Application of SILLUMIN Isolators
and Drivers in Electric Vehicles
— 焦连胜,数明半导体汽车市场总监
-
Liansheng Jiao, Automobile
Marketing Director, Sillumin Semiconductor Co., Ltd.
|
16:30-16:40
|
肩负国家使命,聚焦国产汽车芯片,助推汽车高质量发展
Advancing Domestic Chips for
High Quality Development of Automotive Industry as a National Mission
— 王胜,无锡华普微电子有限公司总经理
-
Sheng Wang, GM, Wuxi Huapu
Microelectronics Co., Ltd.
|
16:40-16:50
|
汽车国产芯片应用
Application of
Domestic Automotive Chips
— 强玉霖,芜湖伯特利汽车安全系统股份有限公司电子硬件总工程师
-
Yulin Qiang, Chief
Engineer of Electronic Hardware, Bethel Automotive Safety Systems Co., Ltd.
|
16:50-17:10
|
芯片替代实践小结
Summary of Domestic Substitution of Chips
— 张海涛,上汽集团技术中心电子电器部执行总监
-
Haitao Zhang,
Executive Director of Electronic and Electrical Department, SAIC Technology
Center
|
17:10-17:30
|
东风车用芯片需求短缺-应对-挑战
Dongfeng Automotive
Chips: Demand Shortage, Response and Challenges
—
雷鹏,东风汽车技术中心智能软件中心主任工程师
-
Peng Lei, Chief
Engineer of Intelligent Software Center, Dongfeng Motor Technology Center
|
17:30-17:50
|
总结发言
Concluding Remarks
|
18:30-20:30
|
晚餐 Dinner
地点:无锡君来世尊酒店一楼香樟苑、兰花厅B
Venue: Camphor Western Restaurant & Lan Ballroom B, 1F, Worldhotel
Grand Juna Wuxi
|
2022年8月26日上午,星期五
Friday, August 26 , 2022
(二)汽车电子创新高峰论坛
II: Automotive
Electronics Innovation Summit
地点:无锡太湖国际博览中心B3馆A区
Venue:
Hall B3-A, Wuxi Taihu International Expo Center
时 间
Time
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内 容
Contents
|
演讲人
Lecturer
|
主持人:梁元聪,上海市汽车工程学会秘书长
Moderator: Yuancong Liang, Secretary-General,
SAES
|
08:30-08:50
|
汽车芯片本土化思考与建议
Automotive Chip Localization Thinking and Suggestions
— 陈大为,中国电子技术标准化研究院副总工程师
-
David Chen, Deputy
Chief Engineer, China
Electronics Technology Standardization Institute
|
08:50-09:10
|
突破瓶颈的尝试--上汽车规级芯片AEC-Q100
联合认证确认平台
Endeavor to Break the Bottleneck--Joint Confirmation Platform for
Automotive Chips AEC-Q100 Certification within SAIC Group
— 卢万成,联合汽车电子有限公司副总工程师,上海市汽车工程学会电器电子专委会副主任
-
Wancheng Lu, UAES, Vice Chief Engineer, Shanghai Society of Automotive
Engineers, Vice Director of EE committee
|
09:10-09:30
|
汽车主机企业对芯片供应链本土化的思考
Sharing the Thoughts
on Localization of Chip Supply Chain in Automobile OEMs
—
张海涛,上汽集团技术中心电子电器部执行总监
—
Zhang Haitao, E&E
Dept. Director, SAIC Motor R&D Innovation Headquarters
|
09:30-09:50
|
本土车规级芯片的应用实战
Practical
Application of Domestic Vehicle Class Chip
—
袁晓岗,华域视觉科技(上海)有限公司创新孵化高级经理
-
Xiaogang Yuan, Senior
Manager of Innovation Incubation, Hasco Vision Technology Co., Ltd.
|
09:50-10:10
|
以国产自主可控车规处理器IP和设计服务助力汽车芯片国产化
Supporting Automotive Chips Development with Independently
and Controllable Automotive-grade Processor IP and Design Services
—
王炳立,上海芯联芯智能科技有限公司高级销售总监,兼任源创芯动(宁波)有限公司总经理
-
Bingli Wang, Senior
Sales Director & GM of Neocore, CIP United Co.
|
10:10-10:30
|
DPU在智能驾驶中的应用
Application of DPU in Intelligent
Driving
— 胡侃,芯启源电子科技有限公司产品市场总监
-
Kan Hu, Product
Marketing Director, Corigine
|
10:30-10:50
|
芯原车规级功能安全IP解决方案
VeriSilicon Functional Safety IP
Solution for Automotive
— 张慧明,芯原微电子(上海)股份有限公司IP解决方案副总裁
-
Huiming Zhang, Vice
President, IP Solutions, VeriSilicon Microelectronics (Shanghai) Co., Ltd.
|
10:50-11:10
|
半导体IP与高性能汽车电子芯片一站式解决方案
One-Stop
Solution for IP and Automotive Chips
—
何颖,芯动科技有限公司产品总监/首席SoC架构师
-
Huck He, Product Director/ Chief SoC Architect, INNOSILICON
Technology Ltd.
|
11:10-11:30
|
智能汽车SoC芯片及高速总线测试方案
Automotive SoC and High Speed IO
Chipset Test Solutions
—
阳任平,是德科技中国区IC行业经理
-
Renping Yang, Greater China IC Industry Manager, Keysight
|
11:30-11:50
|
汽车电子设备的预测性维护
Predictive
Maintenance for Automotive Electronics
— 刘兴刚,以色列商博谛安科技技术销售经理
-
Jack Liu, Technical Sales
Manager, proteanTecs
|
11:50-12:00
|
上海汽车行业车规级芯片可靠性认证平台首家认证确认结果发布及颁证仪式
The first certification result
release and presentation ceremony of the automotive-grade chip reliability
certification platform of Shanghai automotive industry
|
12:00-12:10
|
2022汽车电子创新奖颁奖仪式
2022 Automotive Electronic
Innovation Award Ceremony
|
12:10-13:20
|
午餐 Lunch
|
2022年8月26日下午,星期五
Friday, August 26, 2022
(三)汽车芯片与产业生态
III:Automotive Chips and Industrial Ecology
地点:无锡太湖国际博览中心B3馆A区
Venue:
Hall B3-A, Wuxi Taihu International Expo Center
时 间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
主持人:卢万成,联合汽车电子有限公司副总工
Moderator: Wancheng
Lu, Deputy Engineer, United Automotive
Electronic Systems
Co., Ltd.
|
13:20-13:40
|
基于DNS芯片的电动汽车BMS解决方案
BMS Solution for Electric Vehicle Based on DNS IC
|
程姣姣,大唐恩智浦半导体(徐州)有限公司销售经理
Michelle Cheng, Sales Manager, Datang NXP Semiconductors Xuzhou
Co., Ltd.
|
13:40-14:00
|
车规芯片的功能安全解决方案
Functional Safety
Solution for Automotive IC
|
游余新,西门子EDA 技术顾问
Yuxin You, Technical Consultant, Siemens EDA
|
14:00-14:20
|
探索集成电路先进封装发展新趋势Explore the Development
Trend of Integrated Circuit Advanced Packaging
|
彭勇,池州华宇电子科技股份有限公司董事长兼总经理
Peter-Peng, GM, Chizhou HISEMI Electronics
Technology Co., Ltd.
|
14:20-14:40
|
复微芯助力汽车安全、便捷、舒适新体验
Fudan Micro Helps New
Car Experience of Security, Convenience and Comfort
|
段永刚,上海复旦微电子集团股份有限公司北京分公司总经理
Yonggang Duan, GM of
Beijing Branch, Shanghai Fudan
Microelectronics Group Co., Ltd.
|
14:40-15:00
|
国民技术车规级产品及应用分享
Nations Automotive Grade MCU and Application Sharing
|
程维,国民技术股份有限公司市场总监
Wei Cheng, Marketing Director, Nations Technologies Inc.
|
15:00-15:20
|
如何使用Altair Simulation方案加速从设计到制造全过程的产品研究
How to Accelerate Your Product Research from Design to
Manufacturing Process Based on Altair Simulation
|
焦金龙,Altair中国高频电磁EMC技术专家
Jinlong Jiao, High Frequency Electromagnetic EMC Technical Expert,
Altair Engineering Inc.
|
15:20-15:40
|
茶歇,交流 Coffee Break
|
15:40-16:00
|
国产车规级功能安全芯片的布局与发展
Layout and Development
of Automotive Functional Safety MCU
|
涂超平,合肥杰发科技有限公司产品经理
Chaoping Tu, Product Manager, AutoChips Inc.
|
16:00-16:20
|
车载电子元器件质量检验及分析案例介绍
Vehicle Electronic Components Quality Inspection and Case Analysis
|
赵巍,广州广电计量检测股份有限公司DPA技术经理
Wei Zhao, DPA Technical Manager, Guangzhou GRG Metrology
& Test Co., Ltd.
|
16:20-16:40
|
端云一体赋能汽车智能——北斗高精度定位应用
"Terminals+Cloud"
Solution Impowers the Automotive Intelligence - BeiDou High-precision
Positioning Application
|
邬泳,千寻位置网络有限公司总监
Yong Wu, R&D Director, Qianxun Spatial Intelligence Inc.
|
16:40-17:00
|
芯旺车规芯片在车身控制域的应用
The Application of
ChipON’s Automotive-grade Chip in Body Control Domain
|
卢恒洋,上海芯旺微电子技术有限公司FAE总监
Ethan
Lu, FAE Director, ChipON
|
17:00-17:20
|
以EDA视角看汽车半导体市场动态
Automotive Dynamics – An EDA Perspective
|
许克龙,Cadence产品经理
Clone Xu, Account Technical
Executive, Cadence
|
17:20-17:40
|
赛卓电子以创新助力智能底盘芯片国产化
Semiment Supports IC Localization
of Smart Vehicle Chassis Solution with Innovation
|
王海军,赛卓电子科技(上海)股份有限公司市场副总
Haijun Wang, VP Marketing, Semiment Technology Co., Ltd.
|
18:00-20:00
|
晚餐 Dinner
地点:无锡君来世尊酒店一楼香樟苑
Venue: Camphor Western Restaurant, 1F, Worldhotel
Grand Juna Wuxi
|
2022年8月26日上午,星期五
Friday, August 26, 2022
第五届人工智能与物联网创新论坛
The 5th AIoT Innovation Forum
地点:无锡太湖国际博览中心一楼B3馆C区
Venue:
Hall B3-C, Wuxi Taihu International Expo Center 1F
时
间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
主持人:徐璐琦,中国半导体行业协会集成电路设计分会副秘书长
Moderator: Luqi Xu,
Vice General Secretary, CSIA-ICCAD
|
08:40-09:00
|
EDA 2.0助力解决AIoT芯片的原型验证挑战
EDA 2.0 Support to Solve AIoT Design Challenges in Prototyping
Verification
|
杨晔,芯华章科技产品与业务规划总监
Luke Yang, Product and Business Planning Director, XEPIC
|
09:00-09:20
|
云原生DPU芯片的创新与应用 Innovation and Application of Cloud Native DPU Chip
|
Frey Li, 云豹智能产品市场负责人
Frey Li, Head of Products and
Marketing, JaguarMicro
|
09:20-09:40
|
利用标准化的功耗测量验证方案进行芯片功耗表现优化
Optimize Semiconductor Power
Efficiency with a Standard Solution for Power and Performance Validation
|
周文昊,上海恩艾仪器有限公司亚太区半导体业务发展经理
Wenhao Zhou, Principal BDM -
Semiconductor, National Instruments
|
09:40-10:00
|
芯原大健康芯片设计平台与软件解决方案
VeriSilicon Health SoC Design
Paltform and Software Solution
|
汪志伟,芯原微电子(上海)股份有限公司高级副总裁、系统平台解决方案和设计IP事业部总经理
Wiseway Wang, Senior Vice President,
GM of System Platform Solution Division and Design IP Division, VeriSilicon
Microelectronics (Shanghai) Co., Ltd.
|
10:00-10:20
|
AI技术提升消费领域新体验
AI Enhance New Experience in the Consumer
Field
|
王文兵,爱芯元智新业务中心总经理
Sander Wang, GM of New Product Center,
Axera
|
10:20-10:40
|
存算一体助力AIoT大算力低功耗
Computing-in-Memory, Engine of AIoT
|
詹慕航,北京知存科技有限公司BD副总
Harry Zhan, BD VP, Witmem
|
10:40-11:00
|
DSA设计联合完备的部署方案助力端侧人工智能芯片在AIoT时代的成功落地
The Union of DSA Design and Complete
Deployment Solution Helps End Side AI chip’s Success Landing in AIoT Era
|
仇健乐,时擎智能科技(上海)有限公司研发副总裁
Jianle Qiu, R&D VP, Timesintelli
Technology
|
11:00-11:20
|
ADA感存算一体化平台使能超低功耗常启端侧智能物联节点
ADA Platform for Integration of
Perception-Storage-Computing to enable Ultra-low Power Always-on End-point
AIoT Nodes
|
郑宏钊,深圳市九天睿芯科技有限公司产品解决方案总监
Hongzhao Zheng, Product Solution
Manager, Reexen Co., Ltd.
|
11:20-11:40
|
数字空间的未来制造解决方案
Future Manufacturing Solutions in Digital
Space
|
王峰,无锡雪浪数制科技有限公司创始人、董事长&CEO
Feng Wang, Chairman, CEO &
founder of Wuxi Xuelang Industrial Intelligence Technology Co., Ltd.
|
11:40-12:00
|
高能效端侧神经网络训练加速器设计
High-Energy-Efficiency Neural Network
Training Accelerator for Edge Computing
|
王中风,国家“千人计划”特聘专家、南京大学教授、IEEE Fellow
Zhongfeng Wang, Professor, Nanjing
University, IEEE Fellow
|
12:00-13:30
|
自助午餐 Buffet Lunch
|
2022年8月26日下午,星期五
Friday, August 26, 2022
(四)智能网联与自动驾驶
IV:Intelligent Connected and Autonomous
地点:无锡太湖国际博览中心B3馆C区
Venue:
Hall B3-C, Wuxi Taihu International Expo Center
时
间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
主持人:莫永聪,上海市汽车工程学会汽车电子专委会副主任
Moderator: Yongcong Mo,
Deputy Director of the Automotive Electronics Committee, the Shanghai Society
of Automotive Engineers
|
13:20-13:40
|
智能网联控制系统与芯片国产化探索
Research on
Intelligent Networked Control System and Chip Localization
|
罗来军,联创汽车电子有限公司总工程师
Laijun Luo, Chief Engineer, Dias Automotive Electronic System
Co., Ltd.
|
13:40-14:00
|
汽车智能网联应用开发对芯片的促进
The Promotion of
Automotive Intelligent Application Development to IC
|
李志刚,无锡车联天下信息技术有限公司 首席技术官
Zhigang Li, CTO, Autolink Information
Technology Co., Ltd.
|
14:00-14:20
|
国产汽车电子关键技术突破与应用
Breakthrough and
Application of Key Technology of Domestic Automotive Electronics
|
肖佐楠,苏州国芯科技股份有限公司总经理
Joe Xiao, CEO, C*Core
Technology Co., Ltd.
|
14:20-14:40
|
高性能智能驾驶计算平台
High Performance Autonomous Driving
Computing Platform
|
肖丹,北京核芯达科技有限公司汽车智能座舱VP
Dany Xiao, VP of Automotive Intelligent Cockpit, Beijing He Xin Da
Science and Technology Co., Ltd.
|
14:40-15:00
|
AI识别技术在先进制造过程追溯中的创新应用
Innovation
Application of AI Recognition Technology in Advanced Manufacturing Process
Traceability
|
姚奇,博世智能科技PUT产品负责人
Roger
Yao, Product Owner of PUT, Bosch-Smartlife
|
15:00-15:20
|
NFC在汽车电子中的应用 — NFC数字车钥匙
NFC for Automotive
- Digital Key System
|
王鹏飞,意法半导体亚太区MMS市场及应用部产品市场经理
Pengfei Wang, Product Marketing Section Manager
of Market & Application-MMS Asia Pacific,
STMicroelectronics (China) Investment Co., Ltd.
|
15:20-15:40
|
瑞萨电子自动驾驶解决方案
Renesas ADAS
Solution
|
应毅辰,瑞萨电子副经理
Cross Ying, Supervisor,
Renesas
|
15:40-16:00
|
英博超算在智能驾驶领域的方案和实践
Design and
Practices of Unlimited AI in Intelligent Driving
|
田锋,英博超算(南京)科技有限公司总经理
Feng
Tian, GM, Unlimited AI Co., Ltd.
|
16:00-16:20
|
高清车载微型显示器——豪威集团为AR HUD显示提供新选择
LCOS - OmniVision Group Providing New Choice for AR HUD
|
李飞,豪威集团-上海韦尔半导体股份有限公司市场经理
Eagle
Li, Sr BD Manager, OmniVision Group – Will Semiconductor Co., Ltd.
|
16:20-16:40
|
基于高功率技术深度融入ADAS系统的超级电容冗余电源
Supercapacitor Backup
Power Supply Based on High Power Technology Integrated ADAS System
|
孙伟,烯晶碳能电子科技无锡有限公司,CTO
Wei Sun, CTO, GMCC
|
16:40-17:00
|
茶歇,观展交流 Coffee Break
|
18:00-20:00
|
晚餐 Dinner
地点:无锡君来世尊酒店一楼香樟苑
Venue: Camphor Western Restaurant, 1F, Worldhotel
Grand Juna Wuxi
|
2022年8月26日,星期五
Friday, August 26, 2022
IC设计创新论坛
IC Design Innovation Forum
地点:无锡君来世尊酒店一楼兰花厅A
Venue: Lan Ballroom A, 1F, Worldhotel
Grand Juna Wuxi
时 间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
主持人:孙芹,中关村芯园(北京)有限公司副总经理
Moderator: Qin Sun, VP,
Beijing ICC
|
09:00-09:20
|
打造泛模拟芯片设计制造协同发展生态
Create A
Collaborative Development of Ecology for Analog Related Chip Design And
Manufacturing
|
刘晓明,北京华大九天科技股份有限公司产品总监
Michael Liu, Product
Director, Empyrean Technology Co., Ltd.
|
09:20-09:40
|
IP助力汽车电子
IP Makes Automotive Electronics
Smarter
|
钟香建,芯耀辉科技有限公司IP产品市场和销售总监
Xiangjian Zhong, IP Product Marketing and Sales Director,
Akrostar Technology Co., Ltd.
|
09:40-10:00
|
面向未来物联网的高密度、高可靠、高安全计算平台
High Density, High Robust, High Security Computing for future
IoT
|
邹伟,安谋科技解决方案总监
James Zou, Director of Solution
Architect, Arm Technology (China) Co., Ltd.
|
10:00-10:20
|
先进工艺下超大规模芯片RC参数提取EDA前沿技术
Cutting-edge EDA
Technology of VLSI RC Extraction at Advanced Process Nodes
|
崔晓亮,杭州行芯科技有限公司产品总监
Xiaoliang Cui, Product Director, Hangzhou Phlexing Technology
Co., Ltd.
|
10:20-10:40
|
智能化系统级SoC验证解决方案
A Intelligent System
Level SoC Verification Solution
|
杨秀侠,英诺达(成都)电子科技有限公司项目管理总监
Xiuxia Yang, Project
Management Director, Ennocad (Chengdu) Electronics Technology Co., Ltd.
|
10:40-11:00
|
高速互联IP赋能数据中心算力池
High-speed IP Empowers
Data Center Calculation Power
|
唐睿,奎芯科技市场及战略部副总裁
Rui Tang, Marketing
& Strategy VP, M Square
|
11:00-11:20
|
基于混合云的IC设计仿真平台
IC Design and
Simulation Platform Based on Hybrid Cloud
|
邓世友,紫光云技术有限公司芯片云业务部长
Shiyou DENG, Head of IC Design Cloud Department, UniCloud Tech
Co., Ltd.
|
11:20-11:40
|
破局之路——IC设计型公司管理方案分享
The Policy of Breaking Current
Situations - IC Design Company Management Scheme Sharing
|
耿俊强,鼎捷软件股份有限公司IC设计行业专家
Junqiang Geng, IC Design Industry
Expert, Digiwin Software Co., Ltd.
|
11:40-12:00
|
RISC-V芯片的设计效率提升
Improving Design Productivity
for RISC-V Based IC
|
陈维嵬,西门子EDA OneSpin应用工程师
Weiwei Chen, OneSpin
Application Engineer, Siemens EDA
|
12:00-13:30
|
午餐 Lunch
|
主持人:何卫,中国集成电路设计创新联盟副理事长
Moderator: Wei He,
Vice General Director, ICDIA
|
13:30-13:50
|
玄铁处理器开源,构建RISC-V芯片普惠生态
The Open Source of
Xuantie series Processors: Building an Inclusive RISC-V Chip Eco-system
|
陈炜,平头哥CPU技术运营负责人Wei Chen, Head of CPU Technology Operation, T-head
|
13:50-14:10
|
国产EDA在先进封装领域的机遇和挑战
Opportunities and Challenges in the Field of Advanced
Packaging of The Domestic EDA
|
张建超,芯瑞微(上海)电子科技有限公司SIP事业部总经理
Jianchao Zhang, GM of SIP Division, PHYSIM Electronic
Technology Co,, Ltd.
|
14:10-14:30
|
开启RISC-V在高性能应用场景的时代
RISC-V is Moving to
High-performance Application
|
周杰,上海赛昉科技有限公司资深销售总监
Jay Zhou, Senior Sales Director, Shanghai StarFive Technology
Co., Ltd.
|
14:30-14:50
|
智能融合技术提升复杂SoC芯片的验证效率
Intelligent Fusion
Technology Improves Verification Efficiency for Complex SoC Chips
|
郭正,芯华章科技资深产品市场经理
Justin Guo, Senior
Product Marketing Manager, XEPIC
|
14:50-15:10
|
汽车电子系统架构设计案例分享:整车电气系统、电池管理、功能安全
Genesis Architecture
Design Solution For Automotive Applications
|
梁琪,国微思尔芯产品经理
Cindy
Liang, PM, S2C
|
15:10-15:30
|
茶歇,交流 Coffee Break
|
15:30-15:50
|
构建物联网芯片体系,共赢RISC-V产业合作新生态
Build IoT Chip Product System and Win-Win RISC-V Industrial
Cooperation Ecology
|
乔文平,芯昇科技有限公司产品总监
Vince Qiao, Product Director, Xinsheng
Technology Co., Ltd.
|
15:50-16:10
|
CerebrusTM 智能芯片的探索引擎
CerebrusTM Intelligent Chip Explorer
|
刘淼,上海楷登电子科技有限公司产品工程高级资深总监
Miao Liu, Product
Engineering Sr. Group Director, Cadence Design System
|
16:10-16:30
|
志翔科技为IC企业构建安全高效的研发环境
ZShield:Secure the Workplace for IC Company
|
何轶,志翔科技解决方案总监
Yi He, Director of Industry
Solution, Zshield Inc.
|
16:30-16:50
|
芯思原探索国产化IP的实践
Practice of VeriSyno in Exploring Localized IP
|
丛姗姗,芯思原微电子有限公司销售市场副总裁
Shanshan Cong, Vice President of Sales & Marketing, VeriSyno
Microelectronics Co., Ltd.
|
16:50-17:10
|
5G基站核心芯片国产化前景展望
Outlook on the Localization Process of 5G Base Station Chips
|
王勇,北京力通通信公司营销部总经理
Nelson Wang, GM of Sales & Marketing ,
Beijing Zealync Communication Co., Ltd.
|
17:10-17:30
|
信息安全IC在物联网中的应用
Application of Information Security IC in Internet of Things
|
张昊,无锡安可芯信息技术有限公司总经理
Hao Zhang, GM, Wuxi Advanced Chip Information
Technology Co., Ltd.
|
18:00-20:00
|
晚餐 Dinner
地点:无锡君来世尊酒店一楼香樟苑
Venue: Camphor Western Restaurant, 1F, Worldhotel
Grand Juna Wuxi
|
2022年8月26日上午,星期五
Friday, August 26, 2022
2022存储创新暨
无锡集成电路产业合作论坛
2022 Storage
Innovations and Wuxi IC Industry Cooperation Forum
地点:无锡君来世尊酒店一楼梅花厅
Venue: Mei
Ballroom, 1F, Worldhotel Grand Juna Wuxi
主持人:秦艳,无锡经开区管委会副主任
Moderator: Yan Qin, Deputy Director of
Management Committee of Wuxi Economic Development Zone
|
08:50-09:10
|
无锡经开区党工委书记、管委会主任杨建平致辞
Address by Jianping Yang, Secretary
of CPC Working Wuxi Economic Development Zone,
Director of Administrative Committee
|
中国半导体行业协会集成电路设计分会理事长魏少军教授致辞
Address by Prof. Shaojun Wei, General
Director of CSIA-ICCAD
|
09:10-09:20
|
无锡经开区集成电路及存储产业投资环境推介
Introduction to Investment in WEDZ IC
and Storage Industry
— 无锡经开区招商中心副主任、太湖湾信息技术产业园管理中心主任陈建军Jianjun Chen, Deputy Director of WEDZ Investment Promotion
Center and Director of Taihu Bay Information Technology Park Management
Center
|
09:20-09:30
|
签约揭牌
Signing Ceremony
1、 无锡半导体存储产业生态圈首批合作伙伴签约
Signing
of first batch of cooperation agreements with Wuxi semiconductor storage
industry ecosystem
2、 无锡经开区集成电路企业合作意向签约
Signing
of LOI for cooperation with WEDZ IC companies
3、 重大项目签约
Signing
of agreements for major projects
|
09:30-09:50
|
内存产品演进和新一代产品
Dynamic
Random Access Memory Evolution and New Generation Products
- 李红文,长鑫存储技术有限公司副总裁
-
Hongwen Li, Vice President, ChangXin Memory Technologies, Inc.
|
09:50-10:10
|
引领存储创“芯”,共迎生态新机遇
Lead
Storage Innovation and Jointly Meet New Ecological Opportunities
— 陈磊,东芯半导体股份有限公司副总经理
-
Lei Chen, Vice GM, Dosilicon Co., Ltd.
|
10:10-10:30
|
存储封装工艺创新与挑战—贺利氏解决方案
Innovation
and Challenge in Memory Product assembly – Heraeus’s Solution
—
刘锡锋,贺利氏电子业务开发经理
—
Locker Liu, Business Development Manager, Heraeus Electronics
|
10:30-10:50
|
探索存储解决方案 IDM 的新机遇
Exploring Growth Opportunities for
Storage Solution IDM
— 韦浩,联和存储科技(江苏)有限公司副总裁
— Harry, Operation VP, UMT
|
10:50-11:10
|
群雄并起,存储行业的现状与机遇
The
current situation and opportunities of the memory industry
— 王超,至讯创新科技(无锡)有限公司首席运营官
-
Ray Wang, COO, UNIM Innovation (Wuxi) Co., Ltd.
|
11:10-11:30
|
“存储”创“芯”,打造国产化存储之崛起
Innovative
Chips for Storage, Rise of Domestic Storage Solutions
— 张志勇,合肥大唐存储科技有限公司安全产品线总监
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Zhiyong Zhang, Director of Safety Product Line, Hefei DATANG
Storage Technology Co., Ltd.
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11:30-12:10
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圆桌论坛:存储器关键技术创新与生态构建
Panel Discussion: Key Memory Technologies
Innovation and Ecosystem Construction
主持人:陈军宁教授,中国集成电路设计创新联盟专家组专家
Moderator: Prof. Junning Chen, Expert of ICDIA
1、 制约我国主流半导体存储器产业发展的主要瓶颈
Main bottlenecks restricting the development of mainstream
semiconductor memory industry in China
2、 新型半导体存储器的机遇与挑战
Opportunities and challenges of new semiconductor memories
3、 发展我国新型半导体存储器技术创新思路
Innovative ideas for developing new semiconductor memory
technologies in China
4、 资本如何助力存储器产业创新
How can capital boost innovation in the memory industry?
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12:10-13:30
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午餐 Lunch
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