时间 Time

内容  Contents

开 幕 式

Opening Ceremony

主持人：章金伟，无锡高新区管委会副主任、新吴区人民政府区长

Moderator：Jinwei Zhang, Deputy Director of Wuxi National Hi-tech District, Chief  Executive of Xinwu District, Wuxi

08:30-09:00

无锡市科技厅（待定）

无锡市领导致欢迎辞（拟请杜小刚书记）

Address, Officials of Wuxi City

国家部委领导致辞（科技部重大专项司邱钢副司长）

Address, Officials of National Ministries and Commissions

中国集成电路设计创新联盟领导致辞（理事长魏少军教授）

Address, Officials of ICDIA

无锡高新区领导致辞（拟请崔荣国书记）

高峰论坛（上午）

Top Forum

主持人：程晋格，中国集成电路设计创新联盟秘书长

Moderator: Jinge Cheng, General Secretary, ICDIA

09:00-09:30

以“再全球化”应对“逆全球化”

— 叶甜春，国家02专项技术总师、中国集成电路创新联盟副理事长兼秘书长

Responding to 'Anti-globalization' with 'Re-globalization'

- Tianchun Ye, Leader of the Panel of National Major Program 02 of Science and Technology，Secretary General of China Integrated Circuit Innovation Alliance

09:30-09:55

以架构创新，突破算力“卡脖子”问题

— 尹首一教授，清华大学集成电路学院副院长

Break through the Bottleneck Problem of Computing Power through Architectural Innovation

- Prof. Shouyi Yin, Deputy Dean, School of Integrated Circuits, Tsinghua University

09:55-10:20

从应用中识别到需求和服务于应用

— 谭磊，圣邦微电子(北京)股份有限公司副总经理

Demand Identification from Application and Design Serves Application

- Taylor Tan, VP, SG Micro Corp

10:20-10:45

场景驱动下高端智能家电芯片及生态发展探讨

— 王晔，海尔智家股份有限公司副总裁

Discussions on the Development of High-end Smart Home Appliance Chips and Ecosystem Driven by Scenarios

- Ye Wang, VP, Haier Smart Home Co., Ltd.

10:45-11:10

OS+芯片+AI，智能汽车生态新范式

— 徐强，斑马智行副总裁

OS+Chips+AI New Paradigm of Intelligent Vehicle Ecology

- Qiang Xu, VP, Banma Network Technology Co.,Ltd.

11:10-11:35

从未来移动信息网络体系构架看集成电路发展

— 尤肖虎，东南大学移动通信国家重点实验室主任

Looking at the Development of Integrated Circuits from the Perspective of Future Mobile Information Network Architecture

- Xiaohu You, Director, National Mobile Communications Research Laboratory

11:35-12:00

以应用牵引的电力芯片设计及应用

— 王于波，北京智芯微电子有限公司副总经理

Application-Driven Design and Application of Power Chips

- Yubo Wang, Deputy General Manager, Beijing Smartchip Microelectronics Technology Co., Ltd.

12:00-13:30

午餐 Lunch

高峰论坛（下午）

Top Forum

主持人：任奇伟，中国集成电路设计创新联盟副理事长

Moderator: Qiwei Ren, Vice Chairman, ICDIA

13:30-13:50

支撑芯片发展新态势，助力国产EDA新生态

— 刘海燕，合见工软销售副总裁

Support the New Trend of Chip Development and Assist in the New Ecology of Domestic EDA

— Haiyan Liu, Sales VP, Shanghai UniVista Industrial Software Group Co., Ltd.

13:50-14:10

汽车芯智能，高性能融合计算IP平台赋能智驾未来

The High-performance Integrated Computing Chip IP Platform Empowers China’s Smart Vehicle Industry

— 赵永超，安谋科技智能物联及汽车业务线负责人

- Jason Zhao, Head of AIoT&Auto LoB, Arm Technology (China) Co., Ltd.

14:10-14:30

可靠的接口IP搭建智能汽车神经网络

— 黄浩然，芯耀辉产品市场总监

Reliable Interface IP for Building Intelligent Vehicle Neural Networks

— Haoran Huang, Product Marketing Director, Akrostar Technology Co., Ltd.

14:30-14:50

车用电子的封装发展趋势

— 陈光雄，日月光集团资深副总裁

The Packaging Development Trend of Automotive Electronics

— Scott Chen, Senior VP, ASE

14:50-15:10

聚焦后摩尔时代设计挑战的EDA解决方案

— 贺青，杭州行芯科技有限公司董事长兼总经理

EDA Solutions Tailored for Design Challenges in the Post Moore Era

- Qing He, Chairman and CEO, Hangzhou Phlexing Technology Co., Ltd.

15:10-15:30

茶歇，交流 Coffee Break

15:30-15:50

以Spec管理为核心的硅后自动化测试和研发数据管理实践

— 何为，上海孤波科技有限公司CEO

A Practice of Post-silicon Test Automation and R&D Data Management based on Spec Management

- Pearl He, CEO, Shanghai Gubo Technology Co., Ltd.

15:50-16:10

智能家电对半导体芯片的需求

— 徐鸿，中国家用电器研究院总工程师

The Demand for Semiconductor Chips in Smart Home Appliances

- Hong Xu, Chief Engineer, CHEARI（China Household Electric Appliance Research Institute）

16:10-16:30

最好的创新时代

— 黄庆，华登国际投资集团董事总经理

The Best Era for Innovation

- Dr. Hing Wong, Managing Director, Walden International

16:30-16:50

电机IC解决方案

— 罗先才，华润微集成电路（无锡）有限公司研发副总

Motor IC Solution

— Xiancai Luo, R&D VP, CRMICRO

16:50-17:40

圆桌论坛：创新推动产业升级发展

18:00-20:00

交流晚宴

时  间

Time

内    容

Contents

演讲人

Lecturer

高峰论坛

主持人：梁元聪，上海市汽车工程学会秘书长

Moderator: Yuancong Liang, Secretary-General, SAES

08:30-09:00

视频同步ICDIA开幕式致辞

Video Synchronization ICDIA Opening Ceremony Speech

无锡市领导致欢迎辞（拟请杜小刚书记）

Address, Officials of Wuxi City

国家部委领导致辞（科技部重大专项司邱钢副司长）

Address, Officials of National Ministries and Commissions

中国集成电路设计创新联盟领导致辞（理事长魏少军教授）

Address, Officials of ICIA

无锡高新区领导致辞（拟请崔荣国书记）

09:00-09:20

中国汽车芯片产业发展现状和主动应对

— 原诚寅，国家新能源创新中心总经理，中国汽车芯片创新联盟秘书长 

The Development Status and Proactive Response of China's Automotive Chip

- Chengyin Yuan, General Manager, National New Energy Vehicle Technology Innovation Center

09:20-09:40

车规半导体供应链现状与趋势

— 卢万成，联合汽车电子有限公司副总工程师

Status Quo and Trends of Automotive Semiconductor Supply Chain

- Wancheng Lu，Deputy Chief Engineer, United Automotive Electronic Systems Co., Ltd.

09:40-10:00

“车芯联动”赋能汽车产业变革

— 王辉，华大半导体战略规划部总经理

Automotive IC Empowers the Transformation of the Automotive Industry

- Hui Wang, General Manager of Strategic & Planning Department, Huada Semiconductor

10:00-10:20

新能源汽车电池和电驱动芯片技术突破的途径

— 秦岭，上海琪埔维半导体有限公司首席执行官

Breakthrough in New Energy Vehicle Battery and Electric Drive Chip Technology

- Harry Qin, CEO, Chipways Communications Technology Co., Ltd.

10:20-10:40

打造高性能汽车半导体，助力汽车迈向智能边缘

— 陈晟，亚德诺投资有限公司亚太区汽车业务市场总监

ADI is Engaging in Building High-quality Supply Chain for China NEV Industry

- Edward Chen, Marketing Director of APJC Automotive Business, ADI

10:40-11:00

全场景车规芯片赋能未来电子电气架构

— 贾建龙，芯驰科技资深产品市场总监

Full Scene Vehicle Specification Chip Empowers Future Electronic and Electrical Architecture

- Frank Jia, Senior Product Marketing Director, SemiDrive

11:00-11:20

从模拟到数字，几种典型芯片测试方法

— 阳任平，是德科技中国区IC行业经理

From Analog to Digital, Several Typical Chipset Test Methods

- Renping Yang, Greater China IC Industry Manager, Keysight

11:20-11:40

汽车功率半导体对减少碳排放的贡献

— 苏田，博世汽车电子（中国区）战略部负责人

Contribution of Automotive Power Semiconductors in Reducing Carbon Emissions

- Sebastian Mueller, Head of Business Development & Strategy, Bosch Automotive Electronics China

11:40-12:00

汽车芯片国产化之路的新思考

— 金星，上海汽车芯片工程中心CTO

New Thoughts on the Road to Localization of Automotive Chips

- Xing Jin, CTO, Shanghai Automotive Chip Engineering Center

12:00-13:30

午餐 Lunch

汽车芯片供需对接（闭门）

The Automotive Chips Supply - Demand Matchmaking Conference（Private Session）

主持人：莫永聪，上海市汽车工程学会汽车电子专委会副主任

Moderator：Yongcong Mo, Deputy Director of the Automotive Electronics Committee, the Shanghai Society of Automotive Engineers

13:30-14:00

《国产车规芯片可靠性分级目录》（2023）发布解读

— 陈大为，中国电子技术标准化研究院副总工程师

Release Interpretation of Reliability Classified Catalog of Automotive chips localized in China (RCCAcliC)（2023）

- David Chen, Deputy Chief Engineer, China Electronics Technology Standardization Institute

14:00-14:10

汽车芯片国产替代步入“深水区”

— 刘新杰，华大半导体战略规划部战略经理

Domestic Replacement of Automotive IC Enters the "Deep Water Zone"

- Xinjie Liu, Strategic Manager of the Strategic Planning Department, Huada Semiconductor

14:10-14:20

新能源汽车电池和电驱动芯片技术突破的途径

— 秦岭，上海琪埔维半导体有限公司首席执行官

Breakthrough in New Energy Vehicle Battery and Electric Drive Chip Technology

- Harry Qin, CEO, Chipways Communications Technology Co., Ltd.

14:20-14:30

杰发科技车规芯片多元化产品布局及发展

— 涂超平，合肥杰发科技有限公司高级产品经理

Diversified Product Layout and Development of AutoChips’ Automotive Grade Chip

- Chaoping Tu, Product Manager, AutoChips Inc.

14:30-14:40

KungFu内核汽车级MCU的布局和应用

— 师林飞，上海芯旺微电子技术股份有限公司销售总监

The Layout and Application of KungFu Automotive MCU

- Fline, Sales Director, ChipON

14:40-14:50

智能汽车高清音视频SerDes产品介绍

— 李东明，慷智集成电路华东区销售总监

Introduction to High Definition Audio and Video Automotive SerDes Product

- Dongming Li, Sales Director of East China, AI Micron Co., Ltd.

14:50-15:00

新能源汽车低功耗应用CAN FD收发器芯片

— 王闰星，湖南芯力特电子科技有限公司汽车电子销售总监

Low Power Application CAN FD Transceiver Chip for New Energy Vehicles

- Runxing Wang, Director of Automotive Electronics Sales, Silicon Internet of Things Technology Co., Ltd.

15:00-15:10

复旦微提升汽车安全性、便捷性体验感

— 许万鹏，上海复旦微电子集团股份有限公司市场总监

Fudan Microelectronics Enhances the Experience of Car Safety and Convenience

- Wanpeng Xu, Marketing Director, Shanghai Fudan Microelectronics Group Co., Ltd.

15:10-15:30

茶歇，交流 Coffee Break

15:30-15:40

车载驱动芯片解决方案

- 戴观祖，无锡芯朋微电子股份有限公司驱动产品线总监

Automotive Driver IC Solution

- Garrick Dai, Driver Product Line Director, Wuxi Chipown Microelectronics Co., Ltd, 

15:40-15:50

以可定制化芯片平台和方案应对汽车电子电器架构快速演进

— 夏超，苏州国芯科技股份有限公司汽车电子芯片事业部市场总监

Build a Customizable Chip Platform and Solutions to Cope with the Rapid Evolution of Automotive Electronic and Electrical Architectures

- Chao Xia, Marketing Director of the Automotive Electronic Chip Department,    C*Core Technology Co.,Ltd.  

15:50-16:00

车规芯片的质量目标和实现

— 戚风云，瓴芯电子科技 (无锡) 有限公司工程总监

Quality Objectives and Implementation of Automotive IC

- Claud Qi, Engineering Director, LEN Technology

16:00-16:10

少即是多，一站式汽车模拟芯片解决方案

— 犹家元，思瑞浦微电子科技（苏州）股份有限公司市场拓展经理

3PEAK Automotive Analog Chips Solution

- Jiayuan You, Business Development Manager, 3PEAK INCOPORATED

16:10-16:20

放芯驰骋，驾驭未来，打造多边共赢的汽车供应链

— 贾建龙，芯驰科技资深产品市场总监 

Building a Multilateral and Win-win Automotive Supply Chain with Semidrive

- Frank Jia, Senior Product Marketing Director, SemiDrive

16:20-16:30

汽车智能化-高算力SoC加速舱泊一体化架构发展

— 黄伟伟，芯擎科技业务拓展总监

Driving the Future of Automotive Intelligence - Development of High Computing Power SoC Accelerated Cabin and Berthing Integrated Architecture

- Harvey Huang, BD Director, SiEngine

16:30-16:40

汽车传感器芯片--霍尔式3D角度技术和电感式技术

— 陈思年，飞仙智能科技销售经理

Automotive Sensor Chip - Hall 3D Angle Technology and Inductive Technology

— Bill, Sales Manager, SZ Flying Fairy Intelligent

16:40-16:50

单SoC芯片方案加速汽车智能化转型

— 额日特，黑芝麻智能高级产品市场经理

Single SoC Chip Enabling Intelligent Transformation of Automobile

- Eric, Senior Product Marketing Manager, Black Sesame Technologies Co., Ltd.

16:50-17:00

海思解决方案介绍

— 鲍海森，上海海思战略总监

Introduction to HiSilicon Solutions

- Nick Bao, Strategy Director, HiSilicon (Shanghai) Technologies Co., Ltd.

17:00-17:30

汽车芯片国产应用

— 沈利威，上海汇众汽车制造有限公司产品开发科经理

Domestic Application of Automotive Chips

- Liwei Shen, Manager of Product Development Department, Shanghai Huizhong Automotive Manufacturing Co., Ltd.

18:00-20:00

交流晚宴  Dinner Banquet

2023汽车电子创新颁奖

2023 Automotive Electronic Innovation Award Ceremony

时  间

Time

内    容

Contents

演讲人

Lecturer

主持人：罗来军，联创汽车电子有限公司总工程师

Moderator：Laijun Luo, Chief Engineer, Dias Automotive Electronic System Co., Ltd.

09:00-09:20

EDA 加速实现汽车智能化

EDA Accelerates Smart Vehicle Transformation 

李立基，西门子EDA亚太区技术总经理

Lincoln Lee, PacRim Technical Director, Siemens EDA

09:20-09:40

行远自迩 笃行不怠—国产车规MCU的创“芯”之路

The Road of Domestic Automotive MCU

梁少峰，小华半导体有限公司市场总监

Joe Liang, Director of Marketing, XHSC

09:40-10:00

锐成芯微车规级IP设计和验证

Design and Qualification of ACTT Auto Grade IP

洪东，成都锐成芯微科技股份有限公司器件技术经理

Dong Hong, Device Technology Manager, Actt

10:00-10:20

数模混合芯片的可测性设计的一些思考

Some Thoughts on DFT of Digital-Analog Hybrid Chips

张建华，中科赛飞（广州）半导体有限公司总经理

Jianhua Zhang, General Manager, Saifei Semiconductor Co., Ltd.

10:20-10:40

汽车功能安全背景下的预测性维护

Predictive Maintenance in the Context of Automotive Functional Safety

徐文龙，以色列商博谛安科技股份有限公司应用工程设计总监

Dragon Hsu, AE Director, proteanTecs

10:40-11:00

国产车规级MCU功能安全及信息安全进阶之路

The Road to Advanced Functional Security and Information Security of Automotive Grade MCU

涂超平，合肥杰发科技有限公司高级产品经理

Chaoping Tu, Product Manager, AutoChips Inc.

11:00-11:20

专芯成就未来，复旦微助力国产汽车芯片

Better Chips Better Future, Fudan Micro helps Domestic Automotive Chips

段永刚，上海复旦微电子集团股份有限公司北京分公司总经理

Yonggang Duan, GM of Beijing Branch, Shanghai Fudan Microelectronics Group Co., Ltd.

11:20-11:40

为下一代汽车系统设计赋能

Enabling Next Generation Automotive Systems

耿晓杰，Cadence产品技术总监，亚太日本区总裁技术助理

George Geng, Account Technical Director, Cadence

11:40-12:00

汽车半导体封装-市场与技术动态

Automotive Semiconductor Packaging-Market & Technology Dynamics

黄玉峰，安靠科技技术专案管理资深经理

Yufeng Huang, Senior Manager of

Technical Program Management, Amkor Technology China

12:00-13:30

午餐 Lunch

13:30-13:50

在不缺货背景下如何增强国产车规MCU竞争力

How to Enhance the Competitiveness of Domestic Auto-MCU under No Shortage

安志鹏，豪威集团产品经理

Aaron An, PLM, Omnivision

13:50-14:10

M31高效能车用IP解决方案

Competitive IP Solutions for Automotive Applications

郑顺发，円星科技处长

Frank Cheng, Director, M31 Technology

14:10-14:30

联电先进特色工艺及车规平台

UMC Advanced Specialty Technologies & Auto Platform

陈剑波，和舰芯片制造（苏州）股份有限公司销售经理

Snowwolf Chen, Sales Manager, HeJian Technology (Suzhou) Co., Ltd.

时  间

Time

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演讲人

Lecturer

主持人：戈凯，江苏省汽车工程学会秘书长

Moderator：Kai Ge, Secretary General, Jiangsu Automotive Engineering Society

14:30-14:50

L3 自动驾驶量产的难题和 L2+智能驾驶的安全保障

The Problem of L3 Automatic Driving Mass Production and the Safety Guarantee of L2+ Intelligent Driving

朱西产，同济大学教授

Xichan Zhu, Professor, Tongji University

14:50-15:10

ICT芯片技术助力智能汽车的应用探索

Study the application of ICT Chips Design Technology in Intelligent Vehicle

周国全，深圳市中兴微电子技术有限公司IC产品规划总工

Gavin Zhou, Sr. IC Product Plannning Expert, Sanehips Technology Co., Ltd.

15:10-15:30

茶歇，交流 Coffee Break

15:30-15:50

AGI下的自动驾驶与算力之芯

Autonomous Driving and SoC Evolution Under AGI

袁霖，吉利汽车-自动驾驶中心，自动驾驶感知算法开发专家

Lin Yuan, Autonomous Driving Perception Expert, Geely IDC

15:50-16:10

中国车载高清音视频数据传输芯片自主研发之路以及机遇和挑战

The Challenge and Opportunity of Chinese Serdes IC

刘文军，慷智集成电路CEO

James Liu, CEO, AI Micron Co., Ltd.

16:10-16:30

芯原高性能芯片设计平台与自动驾驶解决方案

VeriSilicon High-performance SoC Design Platform and Autonomous Driving Solutions

周志刚，芯原股份系统芯片平台部副总裁

Michael Zhou, VP of SoC Platform, VeriSilicon

16:30-16:50

面向未来电子架构的芯片解决方案

Chip Solution for Future EE Architecture

詹毅，瑞萨电子汽车战略销售部高级经理

Yi Zhan, Senior Manager, Strategic Automotive Sales, Renesas Electronics

16:50-17:10

智能化芯片使能智能汽车

Intelligent Chips Enable Intelligent Cars

鲍海森 , 上海海思战略总监

Nick Bao, Strategy Director, HiSilicon (Shanghai) Technologies Co., Ltd.

17:10-17:30

创新引领量产——英博超算智能驾驶解决方案

Innovation Leads Mass Production

田锋，英博超算（南京）科技有限公司创始人兼总经理

Feng Tian, Founder & CEO, Unlimited AI Co., Ltd.

时  间

Time

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Contents

演讲人

Lecturer

主持人：何卫，中国集成电路设计创新联盟副理事长

Moderator: Wei He, Vice General Director, ICDIA

08:40-09:00

IC设计平台在先进工艺和大芯片时代的价值

The Value of IC Design Platform in the Era of Advanced Technology and Large Chips

张克非，博越微电子（江苏）有限公司技术市场总监

Kefei Zhang, Technical Marketing Director, Boyue Micro

09:00-09:20

AI时代，EDA系统仿真助推大规模芯片设计变革

EDA System Simulation Promotes Large-scale Chip Design Transformation in the AI Era

王辉，楷登电子资深技术支持总监

Hui Wang, AE Group Director, Cadence

09:20-09:40

芯耀辉完整Chiplet IP解决方案迎接后摩尔时代挑战

Akrostar's Complete Chiplet IP Solution Meets the Challenges of the Post-Moore Era

李益，芯耀辉应用工程总监

Yi Li, Director of Applied Engineering, Akrostar Technology Co., Ltd.

09:40-10:00

边缘计算变革，探索终端算力新边界

Explore New Boundaries of Terminal Devices’ Computing Power in the Time of Intelligent Computing

杨磊，安谋科技产品总监

Alvin Yang, Product Director, Arm Technology (China) Co., Ltd.

10:00-10:20

驱动芯粒互联生态的高性能接口解决方案

High Performance Interface Solution Driving Chiplet Eco-system

杨凯，上海合见工业软件集团高级研发总监

Kai Yang, Senior R&D Director, Univista

10:20-10:40

先进工艺下芯片EMIR-功耗-温度协同分析EDA解决方案

The Evolution of IC Design Model from Application Scenario Perspective

张润捷，杭州行芯科技有限公司研发总监

Ruijie Zhang, R&D Director, Hangzhou Phlexing Technology Co., Ltd.

10:40-11:00

汽车电子系统架构设计案例分享：整车电气系统、电池管理、功能安全

Genesis Architecture Design Solution for Automotive Applications

梁琪，思尔芯产品经理

Cindy, PM, S2C

11:00-11:20

托管+弹性，构建IC设计仿真算力最佳实践

Full-scenario Hosting Cloud + Elastic Compute: Best Practices for Building Simulation Computing Power in IC Design

刘鼎皓，世纪互联集团互联科技解决方案总监

Dinghao Liu, NEOLINK Solution Director, VNET Group

11:20-11:40

电力终端控制芯片发展与挑战

Development and Challenge of Power Terminal Control Chip

李德建，北京智芯微电子科技有限公司数字芯片设计中心总经理

Dejian Li, General Manager, Digital Chip Design Center, Beijing Smart-chip Microelectronics Technology Co.,Ltd.

11:40-12:00

计算，开启芯片设计云上芯速度

Cloud Computing, Accelerate Chip Design

张启成，阿里云计算有限公司电子半导体行业解决方案总监

Qicheng Zhang, Semicon Industry Soution Director, Alibaba Cloud Computing

12:00-13:30

午餐 Lunch

主持人：孙芹，中关村芯园（北京）有限公司副总经理

Moderator: Qin Sun, VP, Beijing ICC

13:30-13:50

先进工艺下超大规模芯片时序签核前沿技术

Delivering Faster Timing Signoff of Advanced-Node SoCs

冯春阳博士，深圳鸿芯微纳技术有限公司研发资深总监

Dr. Chunyang Feng, Senior R&D Director, Shenzhen Giga Design Automation Co., Ltd.

13:50-14:10

半导体工艺超线性发展对国产EDA的机遇和挑战

The Opportunity and Challenge of Superlinear Development of Semiconductor Process to Domestic EDA

白耿，深圳国微芯科技有限公司执行总裁/首席技术官

Geng Bai, Executive President/CTO, GWX Technology Co., Ltd.

14:10-14:30

22nm产品创新突破，助力国产FPGA新发展

Breakthrough Innovation in 22nm Technology as a Driving Force to the New Development of China's FPGA Industry

张伟平，京微齐力BD总监

Weiping Zhang, BD Director, HME

14:30-14:50

AlphawaveSemi:   在高性能运算，人工智能，机器学习，企业级网络领域中，复杂高性能IP /小芯片与ASIC设计服务挑战的正解

AlphawaveSemi: The Answers to the Complex of High Performance IP/chiplet and ASIC Design Service for HPC, AI,ML, Enterprise and Networking

郭大玮，源昉芯片科技（南京）有限公司资深销售总监

David Kuo, Senior Sales Director, Alphawave Semi (Nanjing) Co., Ltd.

14:50-15:10

西门子EDA加速3DIC的创新

How Siemens EDA Accelerates 3DIC Innovations

牛风举，西门子EDA中国区产品总监

Actel Niu, Product Director of China, Siemens EDA

15:10-15:30

茶歇，交流 Coffee Break

时  间

Time

内    容

Contents

演讲人

Lecturer

主持人：刘迪军，中国通信学会集成电路委员会主任委员

Moderator：Dijun Liu, Chairman of Integrated Circuit Committee, China Institute of Communications

15:30-15:50

UWB 装置测试的四大挑战和对策

Solving Four Major UWB Measurement Challenges

欧阳孚，NI亚太区半导体与电子业务发展经理

Fu Ouyang，Business Development Manager for Semiconductor and Electronics，NI

15:50-16:10

可重构高频带相控阵波束赋形芯片

High-frequency Phased Array Beamforming Chip with Reconfigurable Structure

刘石生，深圳市晶准通信技术有限公司总经理

Shisheng Liu, CEO, Shenzhen Jingzhun Communication Technology Co., Ltd. 

16:10-16:30

射频与光电通信集成电路设计

Design of RF and Optoelectronic Communication IC

王志功，东南大学无线电工程系（信息科学与工程学院）教授

Zhigong Wang, Professor, Southeast University

16:30-16:50

5.5G无源物联网芯片的研发与进展

5.5G Passive IoT IC Design and Development

李振彪，智汇芯联(厦门）微电子有限公司CEO

Andrew Li, CEO, Maxwave Microelectronics Ltd

16:50-17:10

展锐“芯”助力5G新业务发展

Development of 5G New Services Accelerated by UNISOC Terminal Chipsets

潘振岗，紫光展锐先进技术研发副总裁

Zhengang Pan, VP and Head of Advanced Comm. Tech. Lab, Central Research Institute of UNISOC

17:10-17:30

存算一体助力算力网络创新发展

In-Memory Computing Promotes the Innovation and Development of Computing Force Network

李小涛，中国移动研究院物联网技术与应用研究所技术经理

Xiaotao Li, Technical Manager, Department of Internet of Things Technology and Application,

China Mobile Research Institute

时  间

Time

内    容

Contents

演讲人

Lecturer

主持人：丁强，无锡国家集成电路设计基地有限公司总经理

Moderator：Qiang Ding, GM, Wuxi National Integrated Circuit Design Base Co., Ltd.

08:40-09:00

小容量存储在AIoT的展望

Prospects for Small Capacity Storage in AIoT

毛文铭，南京扬贺扬微电子科技有限公司运营联合创始人

Wenming Mao, Co-founder of Operations, Nanjing Heyangtek

09:00-09:20

可重构计算架构创新实现计算性能突破

Coarse-grained Reconfigurable Architecture（CGRA）to Achieve a Breakthrough in Computing Performance

欧阳鹏，北京清微智能科技有限公司 CTO

Peng Ouyang, CTO, Beijing Tsingmicro Intelligent Technology Co., Ltd.

09:20-09:40

爱芯元智AX650N Transformer大模型端边落地平台

AXera AX650N Transformer Platform

刘建伟，爱芯元智半导体（上海）有限公司联合创始人、副总裁

Jianwei Liu, Co-founder&VP, AXera Semiconductor (Shanghai) Co., Ltd.

09:40-10:00

高性能Transformer推理——芯原NPU VIP9000 

Accelerating Transformer with VeriSilicon NPU VIP9000

查凯南，芯原股份机器学习软件副总裁

Kainan Cha, VP, Machine Learning Software, VeriSilicon

10:00-10:20

芯华章敏捷验证创新助力大系统芯片设计

To Empower Large SoC Designs with Agile Verification

杨晔，芯华章科技资深产品与业务规划总监

Luke Yang, Product and Business Planning Senior Director, XEPIC

10:20-10:40

AIGC时代存算一体的发展和应用

The Development and Application of Computing-in-memory in AIGC Era

王绍迪，北京知存科技有限公司创始人兼CEO

Shaodi Wang, Founder and CEO,  Witmem(Zhicun) Technology

10:40-11:00

RRAM存算一体驱动大模型时代算力芯片实现突破

RRAM-based CIM Drives a Breakthrough in the Era of LLM Computing Throughput Chip

熊大鹏博士，亿铸科技创始人、董事长兼CEO

Dapeng Xiong, Founder, President & CEO, Suzhou Yizhu Intelligent Technology Co., Ltd.

11:00-11:20

国产GPU的大模型实践

Practice of Large Langugage Models (LLMs) on Domestically Produced GPUs

邹翾，上海天数智芯半导体有限公司副总裁，产品线总裁

Shawn Zou,VP, Product Line President, Shanghai ILuvatar CoreX Semiconductor Co., Ltd.

11:20-11:40

通用人工智能时代，重新定义新一代人机交互

Human-machine Interaction will be Redefined by AGI

徐燕松，安徽聆思智能科技有限公司副总裁

Yansong Xu, VP, Anhui Listenai Co., Ltd.

11:40-12:00

DRAM存算芯片，引领AI大模型算力革命

DRAM Memory Chip, Leading the AI Big Model Computing Power Revolution

许达文，成都视海芯图微电子有限公司创始人兼董事长

Dawen Xu, Founder and Chairman, Chengdu Seehi Microelectronics Co., Ltd.

12:00-13:30

午餐 Lunch

13:30-17:00

家电集成电路应用研讨会（闭门会）

主办：

中国集成电路设计创新联盟

中国家用电器研究院

Seminar on the Application of Household Electric Appliance Integrated Circuit (Closed Door Meeting)

Host:

Integrated Circuit Design Innovation Alliance（ICDIA）

China Household Electric Appliance Research Institute（CHEARI）