会议日程 Agenda 2017


中国集成电路设计2017会暨

北京集成电路产业创新发展高峰论坛

CSIA-ICCAD 2017 Annual Conference &

Beijing IC Industry Innovation and Development Summit

会议日程

Agenda

20171116日,星期四

Nov 16, Thursday, 2017


 地点北京稻香湖景酒店牡丹厅

  Venue: Peony Ballroom, Nirvana Resort Beijing

 

 

Time

        

Contents

Opening Ceremony

主持人:北京市经信委领导

Moderator: Leader of Beijing Municipal Commission of Economy and

Information Technology

08:30-08:50

中国半导体行业协会领导致词

Address, CSIA

北京市及相关部委领导致辞

Address, Beijing and Relative Departments

08:50-09:00

签约仪式

Signnature Ceremony

高峰论坛

Top Forum

主持人:中国半导体行业协会集成电路设计分会秘书长  程晋格先生

Moderator: Mr. Jinge Cheng, General Secretary, CSIA-ICCAD

09:00-09:30

砥砺前行的中国IC设计业

      中国半导体行业协会集成电路设计分会理事长  魏少军教授

China Fabless Industry: Keep Moving Forward

      Prof. Shaojun Wei, General Director, CSIA-ICCAD

09:30-09:45

打造中关村集成电路产业“芯”生态

      中关村发展集团总经理  宣鸿先生

Build Zhongguancun IC Industry Core Ecosystem

      Mr. Hong Xuan, General Manager, Zhongguancun Development Group

09:45-10:00

技术+制造 - 打造集成电路产业生态

      紫光集团董事长  赵伟国先生

Technology + Foundry -To Build IC Industry Ecosystem

      Mr. Weiguo Zhao, Chairman, Unisgroup

10:00-10:20

引领先进设计方法学,迎接中国半导体黄金十年

      Synopsys总裁兼联席CEO  陈志宽博士

Embracing the Golden Decade of China Semiconductor with Synopsys Design Methodology Advances

      Dr. Chi-Foon Chan, President and co-CEO, Synopsys

10:20-10:40

从万物互联到万物智联

      芯原控股有限公司董事长兼总裁  戴伟民博士

From IoT to AIoT

      Dr. Wayne Dai, Chairman, President and CEO, VeriSilicon Holdings Co., Ltd.

10:40-11:00

数字化转型的时代

      明导电子中国区总经理  凌琳先生

The Age of Digital Transformation

      Mr. Pete Ling, China Country Manager, Mentor, A Siemens Business

11:00-11:20

专注本业,做实做强

      台积电中国业务发展副总经理  罗镇球先生

Focus on Dedicated IC Foundry, Maintain Leadership, and Grow Stronger

      Mr. Roger Luo, Vice President, Business Development, TSMC China

11:20-11:40

系统战略推动梦想成真

      Cadence中国区总经理  徐昀女士

SDE, One Step from Dream to a Reality

      Ms. Sherry Xu, China Country Manager, Cadence

11:40-13:25

自助午餐 Buffet Lunch

主持人: 中国半导体行业协会IC设计分会副理事长  黄学良先生

Moderator: Mr. Xueliang Huang, Vice General Director, CSIA-ICCAD

13:25-13:30

幸运抽奖Lucky Draw

13:30-13:50

半导体展望: 人工智能带来新动能

      联华电子副总经理  刘士维先生

Semiconductor Innovation Gears up Artificial Intelligence Revolution

      Mr. Steven Liu, Senior Vice President, UMC

13:50-14:10

拓展工艺及设计服务, 创新产业链合作模式

      中芯国际集成电路制造有限公司执行副总裁  汤天申先生

SMIC’s Innovations in Ecosystem Collaboration for Design Services & Technology Offerings

      Mr. Tianshen Tang, EVP, SMIC

14:10-14:30

实现智能互联

      格芯全球副总裁兼大中华区总经理  白农先生

Enabling Connected Intelligence

      Mr. Wallace Pai, Vice President and Greater China General Manager, Globalfoundries

14:30-14:50

开放创新的生态系统,助力计算新时代

      Arm中国区战略总监  冯成先生

Open Innovation Ecosystem Enabling New Era of Computing

      Mr. Miles Feng, Director Strategic BD Public Affairs, Arm

14:50-15:10

持续创新塑造EDA新纪元

      北京华大九天软件有限公司副总经理  杨晓东先生

Redefine EDA with Innovations

      Mr. Steve Yang, VP, Huada Empyrean Software Co., Ltd.

15:10-15:30

芯片制造助力全球创新转型

      上海华力微电子有限公司市场部部长  杨展悌先生

IC Manufacturing Facilitates Technological Innovation and Upgrading Globally

      Mr. James Yang, Marketing Director, Shanghai Huali Microelectronics Corporation

15:30-15:45

茶歇,交流Coffee Break

15:45-15:50

幸运抽奖Lucky Draw

15:50-16:10

设计自动化大会(DAC):产学两界芯片设计与设计自动化从业人员的顶级聚会

      设计自动化大会执行委员会委员兼Designer Track主席,Cadence电子科技有限公司研发总监  李卓先生

Design Automation Conference: THE Premier Gathering Place for Designers, Design Tool Developers, Researchers, and Managers

      Mr. Zhuo Li, Design Automation Conference Executive Committee Member and Designer Track Chair, Engineering Director, Cadence Design Systems

16:10-16:30

IC新生态下的企业信息安全

      北京志翔科技股份有限公司CEO  蒋天仪先生

 Information Security in the New Semiconductor Ecosystem

      Mr. Tianyi Jiang, CEO, Zshield Inc.

16:30-16:50

摩尔精英让中国没有难做的芯片

      摩尔精英CEO  张竞扬先生

MooreElite - To Make IC Design Business Easy & Fun

      Mr. Jingyang JY Zhang, CEO, MooreElite Group

16:50-17:10

14nm10nm Finfet工艺下如何轻松集成IP

      芯动科技有限公司CEO  敖海先生

Smooth Integration of Interface IP at 14/10nm

      Mr. Gordon Ao, CEO of INNOSILICON TECHNOLOGY LTD

17:10-17:30

芯片设计在物联网时代的机遇与挑战

      成都锐成芯微科技股份有限公司CEO  向建军先生

New Opportunity and Challenge from IoT

      Mr. Jianjun Xiang, CEO, Chengdu Analog Circuit Technology Inc.

17:30-17:50

终端应用趋势

      小米供应链副总裁,江苏紫米电子技术有限公司创始人、CEO  张峰先生

Trend of End Application

      Mr. Feng Zhang, VP of Xiaomi Supply Chain, Founder & CEO of ZMI

17:50-17:55

幸运抽奖Lucky Draw

18:00-19:30

曲艺文化鉴赏

Chinese Folk Art Culture Appreciation

地点:北京稻香湖景酒店展厅

Site: Exhibition Hall, Nirvana Resort Beijing

19:30-21:30

欢迎晚宴(Synopsys公司赞助)

Welcome Dinner Banquet (Sponsored by Synopsys)

地点:北京稻香湖景酒店牡丹厅

Site: Peony Ballroom, Nirvana Resort Beijing


20171117日,星期五

Nov 17, Friday, 2017

专题论坛(一)

Subject Forum (Ⅰ)

 

地点:北京稻香湖景酒店多媒体室

Venue: Multi-function Room, Nirvana Resort Beijing

 

Time

   

Contents

演讲人

Lecturer

IPIC设计(一)

IP and IC Design (I)

主持人:中国半导体行业协会集成电路设计分会副秘书长,曹华锋先生

Moderator: Mr. Huafeng Cao, Vice General Secretary, CSIA-ICCAD

09:00-09:20

赛普拉斯公司低成本高可靠嵌入式闪存技术

Cypress Embedded Non-Volatile Memory Technologies

赛普拉斯半导体大中华区IP授权事业部总监,那炜

Wei Na, Director of IPBU, CYPRESS

09:20-09:40

C-SKY安全解决方案为信息安全提供持续保障

C-SKY Security Solution Provides Sustaining Support for Information Security

杭州中天微系统有限公司资深技术专家&IC设计部经理,杨军

Stephen Yang, Technical Expert & Manager of IC Design Department, C-SKY Microsystems Co., Ltd.

09:40-10:00

蜕变 - 从反向到正向的跨越式突破

Metamorphosis of IC Design-From RE to Forward Design

北京芯愿景软件技术有限公司总经理,张军

James Zhang, CEO, Cellixsoft Corporation

10:00-10:20

第二代高带宽内存物理层(PHY)与控制器(Controller

High Bandwidth Memory (HBM) PHY and Controller

创意电子股份有限公司CEO,曾文正

Vincent Tseng, Director, GLOBAL UNICHIP CORP. Co., Ltd.

10:20-10:40

智原ASIC/IP平台方案 - 助力半导体产业百家争鸣新机遇

Faraday’s ASIC/IP Platform Enables the Innovation of Next Big Wave

智原科技(上海)有限公司技术总监,陈宏铭博士

Dr. Arthur Hung-Ming Chen, Technical & Marketing Director in Faraday Tech. (Shanghai) Corporation

10:40-11:00

Andes CPU IP提升系统芯片效能

Boosting SoC Performance Efficiency with Andes CPU IP

晶心科技AVP,陈志贤

Vincent Chen, AVP, Andes Technology

11:00-11:20

IP技术在国内十年来的演进和发展

The Evolution and Development of IP Technology in a Decade in China

四川和芯微电子股份有限公司董事长兼CEO,邹铮贤

Jackie Zou, Chairman of the Board & CEO, IPGoal Microelectronics (Sichuan) Co., Ltd.

11:20-11:40

科技新时代的芯片设计服务

Design Service: Your Trusted Turnkey Partner in Revolution Age

灿芯半导体(上海)有限公司首席技术官,庄志青

John Zhuang, CTO, Brite Semiconductor (Shanghai) Corporation

11:40-12:00

如何设计自驾车所需高效能SoC芯片

Building a High Performance SoC for Autonomous Car

Arteris, Inc.资深方案架构师,黄继樟

Brian Huang, Senior Solution Architect, Arteris, Inc.

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐Buffet Lunch

EDAIC设计

EDA and IC Design

主持人:中国半导体行业协会集成电路设计分会副秘书长,李军先生

Moderator: Mr. Jun Li, Vice General Secretary, CSIA-ICCAD

13:30-13:50

Cadence Tensilica为人工智能提供算力支持

Cadence Tensilica Provide Computing Power for AI

Cadence公司商务拓展资深经理,徐勇

Jeffrey Xu, Senior Business Development Manager, Cadence China

13:50-14:10

从设计到芯片核签流程中最前沿的技术

Leading Edge Technologies Are Required For Golden Sign-Off

明导电子中国区资深技术经理,牛风举

Actel Niu, Account Technology Manager, Mentor, A Siemens Business

14:10-14:30

Synopsys驱动下一代芯片设计创新

Enabling the Next Wave of Design Innovation

Synopsys中国区技术应用总监,关逸基

Kenny Kwan, Director, Application Consulting of China, Synopsys

14:30-14:50

时序Sign-off的革命

The Revolution of Timing Sign-off

北京华大九天软件有限公司产品总监,董森华

Senhua Dong, Supervisor of Product,  Huada Empyrean Software Co., Ltd.

14:50-15:10

茶歇,交流Coffee Break

15:10-15:30

集成电路硬件安全:保证信息系统安全可靠的物理基础

Hardware Security: The Physical Protection of Modern IT System

中国科学院EDA中心主任,陈岚博士

Dr. Lan Chen, Director, EDA Center of Chinese Academy of Sciences

15:30-15:50

新一代功耗、噪声、可靠性分析平台 – RedHawk-SC

Next Generation SoC Power Noise Reliability Signoff by RedHawk-SC

ANSYS公司主任工程师,赵常

Chang Zhao, Lead Application Engineer, ANSYS

15:50-16:10

倍增你的仿真容量

Double Your Simulation Capacity

北京天云融创软件技术有限公司副总裁,郭宏

Hong Guo, VP, Skycloud Software Co., Ltd.

16:10-16:30

先进工艺节点的寄生RC分析和缩减

Analaysis and Reduction of Parasitic RCs For Advanced Nodes

芯师(上海)电子科技有限公司AE Manager,刘客

Ke Liu, AE Manager, Silvaco China., Ltd.

16:30-16:50

下一代ECO平台带来性能、功耗与面积的优化,以及可靠性的提高

The Next Generation ECO Platform for Optimizing Performance, Power, Area and Improving Reliability

知亿科技技术咨询总监,林仕洲

Joe Lin, Technical Consulting Director, Dorado Design Automation, Inc.

16:50-17:10

台积电12FFC设计平台与生态系统

TSMC N12FFC Design Platform and Ecosystem

台积电中国业务发展技术经理,卓铭

Ming Zhuo, Technical Manager, Business Development, TSMC

17:10-17:30

ECO手术逆向工程导引可能零补丁的第三代ECO技术

Easy DSP-ECO: A 3rd gen ECO Evolved from Adding Patches to Reverse Engineering Guided “ECO Operations” that might need No Patch

香港奇捷科技股份有限公司CEO,吴有亮

Yu-Liang Wu, CEO, Hong Kong Easy-Logic Technology Ltd.

17:30-17:35

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana Resort Beijing


20171117日,星期五

Nov 17, Friday, 2017

专题论坛(二)

Subject Forum (Ⅱ)

地点:北京稻香湖景酒店牡丹1

Venue: Peony Ballroom 1, Nirvana Resort Beijing

 

Time

   

Contents

演讲人

Lecturer

FOUNDRY与工艺技术

Foundry and Manufacturing Process Technology

主持人:中国半导体行业协会集成电路设计分会副秘书长,王志华教授

Moderator: Prof. Zhihua Wang, Vice General Secretary, CSIA-ICCAD

09:00-09:20

台积电领先技术:7奈米/12奈米/22奈米

TSMC Technology Leadership: N7/N12/N22

台积电中国业务发展技术经理,何瑞灵

Ray He, Technical Manager, Business Development, TSMC

09:20-09:40

格芯智能制造

GF Smart Manufacturing

格芯中国区销售总经理,韩志勇

Zhiyong Han, China Sales General Manager, Globalfoundries

09:40-10:00

迎接即将爆发的新产品应用浪潮——晶圆专工在特殊工艺的技术创新

Foundry Innovation on Specialty Technology for Emerging Applications

联华电子协理,许尧凯

Yau Kae Sheu, Associate Vice President, UMC

10:00-10:20

垂直生态系统及跨行业合作

Vertical Channel Eco-System & Cross-Industry Cooperation

中芯国际集成电路制造有限公司垂直市场生态策略总监吴耿源

KY Wu, Director of Vertical Channel Marketing, SMIC.

10:20-10:40

华力微电子28纳米低功耗工艺技术

HLMC 28LP PolySiON Technology

上海华力微电子有限公司研发二部总监,彭树根

Albert Pang, Senior Director of TD, Shanghai Huali Microelectronics Co., Ltd.

10:40-11:00

摩尔精英让中国没有难做的芯片

MooreElite - To Make IC Design Business Easy & Fun

摩尔精英COO,董伟

Wei Leo Dong, COO, MooreElite Group

11:00-11:20

深耕模拟与功率半导体制造,助力集成电路成长

CSMC, Specialized in Analog and Power Management Foundry and Boosted Customer's Growth

华润上华科技有限公司市场销售副总,邵军

Jun Shao, VP of Marketing and Sales, CSMC

11:20-11:40

三重富士通车规级芯片制造开发与质量管理

Mie Fujitsu Semiconductor Automotive IC Manufacturing and Quality Management

三重富士通半导体股份有限公司市场部部长,罗良辅

Liangfu Lo, Director (Aisa & Korea) of Marketing Dept., MIE Fujitsu Semiconductor Limited

11:40-12:00

智能时代,畅想机遇

Opportunities in the Smart Era

上海华虹宏力半导体制造有限公司战略、市场与发展部门部长,胡湘俊

Calvin Hu, Director of Strategy, Marketing and Development Division, Shanghai Huahong Grace Semiconductor Manufacturing Corporation

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐 Buffet Lunch

主持人:中国半导体行业协会集成电路设计分会副秘书长,赵丽女士

Moderator: Ms. Li Zhao, Vice General Secretary, CSIA-ICCAD

13:30-13:50

特种工艺链接世界

A World Connected by Specialty Technologies

TowerJazz中国区总经理,秦磊

Lei Qin, Senior Sales Director China Country Manager, TowerJazz

13:50-14:10

流片服务对于芯片研发和产品成功的重要性

Professional Tapeout Service Plays a Key Role in R&D and Market Success

MOSIS专业流片服务机构业务拓展经理,袁泉

Quan Yuan, Business Development Manager, The MOSIS Service

14:10-14:30

AMS尖端模拟工艺平台,助力客户进入高毛利市场

AMS High Performance Analog Process Support Customer Enter High Profit Market

上海劢仕电子有限公司市场部经理,周之琦

Zhiqi Zhou, Marketing Manager, Shanghai MEDs Technology Co., Ltd.

14:30-14:50

武汉新芯特种工艺平台

XMC Specialty Process Platform

武汉新芯集成电路制造有限公司芯片代工事业部总监,沈亮

Neo Shen, Director of Foundry Service Business Unit, XMC

14:50-15:10

茶歇,交流Coffee Break

资本与IC设计业

Capital and IC Design Industry

主持人:石溪资本合伙人中国半导体行业协会集成电路设计分会副秘书长,孙坚女士

Moderator: Ms. Jian Sun, Vice General Secretary, CSIA-ICCAD

15:10-15:30

新时代下,中国IC行业发展展望

China IC Industry Development Prospects in New Era

华芯投资管理有限责任公司副总裁,高松涛

Songtao Gao, Vice President, SINO IC CAPITAL Co., Ltd.

15:30-15:50

从投资的角度看中国IC设计业的现状与发展

China IC Design Industry Situation and Development from the Point of Investment

中芯聚源股权投资管理有限公司总裁,孙玉望

Yuwang Sun, President, China Fortune-Tech Capital Co., Ltd. 

15:50-16:10

风口浪尖上的中国半导体

China IC in Big Waves

华登国际董事总经理,黄庆博士

Dr. Hing Wong, Managing Director(MD), Walden International

自由研讨IPO、企业并购和商业经营,产业发展缺一不可的路径

Panel – IPO, M & A and Business Operation, Integral Industry Development Way

16:10-17:30

研讨嘉宾:陈大同、孙玉望、高松涛、刘越、黄庆等

在举国半导体投资发展热潮中,中国集成电路设计行业也有了长足的发展,继紫光集团成功收购展讯锐迪科之后;清芯华创牵头收购豪威科技,武岳峰牵头收购ISSI,兆易创新成功IPO成为全体中国IC设计公司瞩目的最新焦点!

那么,下一个兆易创新会在哪里?近距离面对中国这个最让人魂系神往的资本市场,我们中国集成电路设计企业应该如何才能淡定应对?全球集成电路行业会在那个层面展开新一轮的创新竞争?

 

Honored Guests Dr. Datong Chen, Mr. Yuwang Sun, Mr. Songtao Gao, Ms. Yue Liu, Dr. Hing Wong, etc.

 

Under the Tide of National Semiconductor Investment and Development, China IC Design Industry has been Developing Rapidly. After Unis Group successfully Acquired Spreadtrum and RDA, Hua Capital led to Acquire Omni Vision, Summit View Capital led to Acquire ISSI, China IC Design Industry is all Focusing on Giga Device successful IPO

 

Then, Where is Next Giga Device? When closely Facing this China Charming Capital Market, How shall We China IC Design Industry Respond Calmly? What’s Next Innovation Competition for Global IC Industry?

17:30-17:35

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana Resort Beijing

 


20171117日,星期五

Nov 17, Friday, 2017

专题论坛(三)

Subject Forum (Ⅲ)

 

地点:北京稻香湖景酒店牡丹2

Venue: Peony Ballroom 2, Nirvana Resort Beijing

 

Time

   

Contents

演讲人

Lecturer

IPIC设计(二)

IP and IC Design (II)

主持人:中国半导体行业协会集成电路设计分会副理事长,张力天先生

Moderator: Mr. Litian Zhang, Vice General Director, CSIA-ICCAD

09:00-09:20

钢铁是怎样炼成的

The Road to KX-5000 Series

上海兆芯集成电路有限公司副总裁,傅城

Cheng Fu, VP, Shanghai Zhaoxin Semiconductor Co., Ltd.

09:20-09:40

台积电7nm先进工艺下的设计方法

TSMC N7 Digital Design Enablement

台积电南京设计服务中心部门经理,曹宗良

Z.L. CAO, Department Manager, Nanjing Design Service Center, TSMC

09:40-10:00

高效的处理架构让AI无处不在

An Efficient Processor Architecture Enable AI Everywhere

芯原控股有限公司应用软件总监,查凯南

Kainan Cha, Director, Application Software, VeriSilicon Holdings Co., Ltd.

10:00-10:20

面向物联网设备的平台安全架构

Platform Security Architecture for IoT Device

Arm高级技术市场经理,王骏超

Eric Wang, Senior Technical Marketing Manager, Arm China

10:20-10:40

高度定制化IP解决方案的现状和展望

The Trend and Prospect of Highly Customized IP Solution

芯动科技有限公司FAE 总监,何颖

Huck He, FAE Director, Innosilicon Technology Ltd.

10:40-11:00

汽车MCU软件、硬件平台型开发技术

Discussion of Auto MCU Software and Hardware Platform Development Technology

恩智浦半导体汽车控制器和处理器事业部亚太市场总监,易生海

Jerwern Yi, Marketing Director, Asia Auto MCU and MPU, NXP

11:00-11:20

人工智能时代的2.5D/3D先进封装设计

2.5D/3D Advanced Packaging Design for Artificial Intelligence Era

苏州芯禾电子科技有限公司创始人/工程副总裁,代文亮

Wenliang Dai, Founder VP Engineering, Xpeedic Technology

11:20-11:40

浅谈人工智能时代的高性能计算芯片

Brief Discussion of High Performance Computing Chip in AI Era

无锡华大国奇科技有限公司CEO,谷建

Jianyu Gu, CEO, Qualchip Technologies, Inc.

11:40-12:00

现今趋势中在线存储器测试与修复之应用

The Trend of Memory on Demand Test and Repair of Applications

厚翼科技中国区销售总监,王炳兴

Benson Wang, VP of China Region, HOY Technologies Corp.

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐 Buffet Lunch

主持人:中国半导体行业协会集成电路设计分会副秘书长,徐秀法先生

Moderator: Mr. Xiufa Xu, Vice General Secretary, CSIA-ICCAD

13:30-13:50

系统复杂性的挑战:对用于调试,安全和安防的体系结构的需求

The Challenge of Systemic Complexity: The Need for An Architecture for Debug, Safety & Security

Rupert Baines, CEO, UltraSoC

13:50-14:10

M31创新低功耗整合平台--提升高效能更优化的智能芯片设计

M31 Innovative Low Power Integrated Platform - Improves the SoC Design with High Performance and High Optimization

円星科技股份有限公司业务副总监,林世腾

Johnson Lin, Deputy Sales Director, M31 Technology

14:10-14:30

针对NB-IoT终端设备的单处理器核完整IP方案

Complete Single Processor IP Solution for NB-IoT Enabled Endpoint Devices

CEVA中国FAE经理杨晔

Luke Yang, China FAE Manager, CEVA

14:30-14:50

领导变革 - 芯片行业如何部署技术创新和外包战略

Leading the Disruptions - How does Industrials & Electronics Industry Deploy Technology Innovation and Outsourcing Strategy

亚创中国半导体事业部总监,石贤帅

Xianshuai (Stone) Shi, I&E Division Director, Altran China

14:50-15:10

茶歇,交流Coffee Break

15:10-15:30

Chips&Media面向监控/车载应用,针对低照度环境优化的ISP IP

Chips&Media’s Low Light Environment Optimized Image Signal Processing IP for Surveillance and Automotive Applications

Chips&Media中国区销售经理,陶南

Larry Tao, Country Manager China Sales, Chips&Media

15:30-15:50

Imagination AI解决方案激发智能社会充满想象

Imagination AI Stimulate the Innovation of Human Society

Imagination中国区市场总监,柯川

Bowen Ke, Marketing Director, Imagination Technologies

15:50-16:10

系统层级设计方法: 架构探索与高阶合成设计

Electronic System-Level Design Methodology: Architecture Exploration & High Level Synthesis

宏太科技股份有限公司应用经理,王义成

Frank Wang, AE Manager, Avant Technology Inc.

16:10-16:30

针对自动驾驶SoC的智能互联

Intelligent Interconnect for Automotive SoCs

Sam Wong, Director, Great China Sales, NetSpeed Systems

16:30-16:50

物联网应用之安全强化 - 特殊型NeoFuse IP解决方案

Specialty NeoFuse IP Simplify Security Enhancement for IoT Application

力旺电子营销副处长,郭东政

Steve Kuo, Marketing Deputy Director, eMemory

16:50-17:10

多用途的嵌入式SuperFlash技术在物联网和汽车电子上的应用

Versatile Embedded SuperFlash® Technology for IoT and Automotive Applications

Vipin Tiwari, Director, Marketing and Business Development, Silicon Storage Technology, Inc.

17:10-17:30

物联网时代的DRAM:高速,串接简易

DRAM for IoT Applications with Low-Pin Count, High Speed, Serial Interface

爱普科技股份有限公司总经理,顾峻

Jun Gu, GM, AP Memory Technology CO., LTD.

17:30-17:35

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana Resort Beijing


20171117日,星期五

Nov 17, Friday, 2017

专题论坛(四)

Subject Forum (Ⅳ)

 

地点:北京稻香湖景酒店牡丹3

Venue: Peony Ballroom 3, Nirvana Resort Beijing

 

Time

   

Contents

演讲人

Lecturer

封装测试与IC设计

Packaging & Testing and IC Design

主持人:中国半导体行业协会集成电路设计分会副秘书长,韩乐福先生

Moderator: Mr. Lefu Han, Vice General Secretary, CSIA-ICCAD

09:00-09:20

高速成长IC新应用的先进封装技术

Advance Packaging Technologies for the Fast Growing IC Applications

江苏长电科技股份有限公司高级副总裁,梁新夫

Steve Xin Liang, SVP, JCET

09:20-09:40

通富微电在Processing Unit的封测解决方案

TFME Full Backend Solution at Processing Unit

通富微电子技术中心副总,林伟

Wayne Lin, Vice President, R&D Center, TFME

09:40-10:00

芯片产品的全程可溯

IC Product Traceability Across Supply Chain

PDF中国总经理、全球副总裁,房华博士

Dr. Hua Fang, PDF-China GM, Global VP

10:00-10:20

智能芯片商机与可靠性之挑战

Business Opportunity and Challenge for AI Semiconductors

宜特检测技术有限公司董事长,崔革文

Kevin Tsui, iST China Chairman & General Manager

10:20-10:40

车用电子新一波的封装技术趋势与解决方案

New Wave Technology Trend & Packaging Solution for Automotive Application

日月光集团制造工程处处长,沈政昌

Allen Shen, Engineering Director, ASE Group

10:40-11:00

系统级封装(SiP)的市场和技术发展趋势

SiP (System in Package) Market and Technology Trend

安靠封装测试资深总监,李吕祝

John Lee, Sr. Director, Amkor Technology

11:00-11:20

高性能计算应用之创新封装解决方案

The Innovate Packaging Solutions In High Performance Computing

矽品精密工业股份有限公司研发中心客户前瞻产品处副处长,陈盟顺

Royal Chen, Deputy Director, Customer Advanced Package Application Engineering of CRD, SPIL

11:20-11:40

IC 设计与Probe Card结合的重要性

IC Design and Probe Card Integration Solutions

深圳市道格特科技有限公司副总经理,李忠民

Tommy Lee, VP, Shenzhen Doctor Technology Co., Ltd.

11:40-12:00

物联网技术的测试挑战以及是德科技的解决方案

IoT Technology Test Challenges and Keysight Solutions

是德科技大中华区市场部行业市场经理,祝晓悦

Xiaoyue Zhu, Marketing Industry Manager, Keysight Technologies

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐Buffet Lunch

主持人:中国半导体行业协会集成电路设计分会副秘书长,赵建忠教授

Moderator: Prof. Jianzhong Zhao, Vice General Secretary, CSIA-ICCAD

13:30-13:50

持续驱动集成电路小型化和性能提升的晶圆级封装技术

Wafer-level Packaging Technologies as A Key Enabler for Continuous Miniaturization and Performance Enhancement of Integrated Circuits

华天科技(昆山)电子有限公司技术总监,王腾

Teng Wang, Technical Director, Huatian Technology (Kunshan) Electronics Co., Ltd.

13:50-14:10

测试的发展趋势:过去,现状及预测未来

Test Trends: Past, Present and Predicting the Future

泰瑞达半导体测试部SoC商务组和市场销售副总裁兼总经理,徐建仁

Jason Zee, VP and GM, SoC Business Group and Marketing, Teradyne

14:10-14:30

R&S 最新IoT测试技术和解决方案

R&S Latest IoT Test Techniques and Solutions

罗德与施瓦茨(中国)科技有限公司业务发展经理,杨洪文

Hongwen Yang, Business Development Manager, Rohde & Schwarz (China) Technology Co., Ltd.

14:30-14:50

利用NI平台降低测试成本与加速产品上市时间

Lowering the Cost of Test while Improving Time-To-Market with NI Platform-based Approach

美国国家仪器有限公司市场工程师,马力斯

Lisi Ma, Technical Marketing Engineer, National Instruments

14:50-15:10

茶歇,交流Coffee Break

15:10-15:30

物联网时代的芯片测试解决方案

Testing Devices for the IoT and Smart Applications

爱德万测试(中国)管理有限公司北京分公司测试技术部课长,张可

Ke Zhang, Section Manager, BJT Department, Advantest (China) Co., Ltd. Beijing Branch

15:30-15:50

全方位测试解决方案

Comprehensive Semiconductor Testing Solution

京元电子股份有限公司资深处长,刘大纲

Takang Liu, Senior Director, KYEC Yuan Electronics Co., Ltd.

15:50-15:55

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana Resort Beijing


20171117日,星期五

Nov 17, Friday, 2017

专题论坛(五)

Subject Forum (V)

 

地点:北京稻香湖景酒店牡丹4

Venue: Peony Ballroom 4, Nirvana Resort Beijing

 

Time

   

Contents

演讲人

Lecturer

动北京 - 暨首届中关村IC产业发展论坛

Chip-Power Beijing and First Zhongguancun IC Industry Development Forum

主持人:中关村集成电路设计园总经理,裴濬先生

Moderator: Mr. Jun Pei, General Manager, IC PARK

09:00-09:05

海淀区领导致欢迎词

Welcome Speech from the Leader of Haidian District Government

09:05-09:10

中关村管委会领导讲话

Speech from the Leader of Administrative Committee of Zhongguancun Science Park

09:10-09:15

市科委领导讲话

Speech from the Leader of Beijing Municipal Committee of Science and Technology

09:15-09:30

人工智能行业研究及成果转化

Research and Result Transformation of AI industry

清华微电子所所长,魏少军教授

Prof. Shaojun Wei, Director, Institute of Microelectronics, Tsinghua University

09:30-09:45

百度人工智能的基础技术及应用创新

Basic Technology and Application Innovation of Baidu AI

百度技术体系主任架构师,欧阳剑

Jian Ouyang, Director, Technology  System Architect, Baidu

09:45-10:00

人工智能时代的端到端芯片战略

End-to-end Chip Strategy in the AI Era

英特尔中国研究院院长,宋继强

Jiqiang Song, General Manager, Intel Labs China

10:00-10:15

嵌入式人工智能:从算法到处理器

Embedded AI: From Algorithms to Processors

北京地平线机器人技术研发有限公司创始人&CEO,余凯

Kai Yu, Founder & CEO, Beijing Horizon Robotics Technology Research and Development Co., Ltd.

10:15-10:30

人工智能如何商业化应用

How to Commercialize AI?

北京云知声信息技术有限公司CEO,黄伟

Wei Huang, CEO, Unisound

10:30-10:45

智慧存储加速人工智能创新

Intelligent Storage for Artificial Intelligence

英韧创信息科技有限公司董事长兼CEO,吴子宁

Zining Wu, Chairman and CEO, InnoGrit Co., Ltd.

10:45-11:00

万物智联时代的计算存储

Computing Storage in the AI IoT Era

北京忆芯科技有限公司ASIC设计首席工程师,孙唐

Tang Sun, Chief Architect, ASIC Design, Starblaze Technology Co., Ltd.

12:00-13:30

自助午餐Buffet Lunch

芯片奥林匹克IEEE国际固态电路峰会ISSCC中国发布会 - 最新IC设计技术趋势

“Chip Olympic” - IEEE ISSCC China Press Conference – Technical Trends of IC Design   

主持人:ISSCC国际技术委员会中国区代表, 余成斌 教授,IEEE会士

Moderator: Prof. Seng-Pan (Ben) U, IEEE Fellow, ISSCC ITPC China Country Representative

13:30-13:50

注册

Registration

13:50-14:00

致欢迎词

      Jan van der Spiegel 教授和IEEE会士,IEEE ISSCC 2018执行委员会成员,IEEE SSCS现任主席,美国宾夕法尼亚大学(清华大学访问教授)

Welcome Remarks

      Prof. Jan van der Spiegel, IEEE Fellow, IEEE ISSCC 2018 Executive Committee Member, IEEE SSCS President, Univ. of Pennsylvania, USA

14:00-14:10

芯片奥林匹克IEEE国际固态电路峰会ISSCC 2018简介

      Sungdae Choi博士,ISSCC国际技术委员会远东区主席,韩国海力士半导体

Introduction of Chip Olympic IEEE ISSCC 2018

      Dr. Sungdae Choi, ISSCC 2018 ITPC Far East Chair, SK Hynix, Korea

14:10-14:20

ISSCC 2018远东区的技术趋势 

      李泰成 教授,ISSCC国际技术委员会远东区副主席, 台湾大学

Far East Technical Trends for ISSCC 2018

      Tai-Cheng Lee, ISSCC ITPC Far East Vice-Chair, Taiwan University

14:20-14:35

ISSCC 2018中国区入选论文和发展趋势 

      余成斌 教授和IEEE会士,ISSCC国际技术委员会委员及中国区代表,澳门大学和Synopsys澳门

      王志华 教授和IEEE会士,SSCS行政委员会委员,清华大学

ISSCC 2018 China Papers and Trends

      Prof. Seng-Pan (Ben) U, IEEE Fellow, ISSCC ITPC China Country Representative, Univ. of Macau and Synopsys Macau

      Prof. Zhihua Wang, IEEE Fellow, SSCS AdCom, Tsinghua University

14:35-14:50

问答讨论(首轮)和合影

Q&A (1st round) and Group Photo

14:50-15:10

茶歇,交流Coffee Break

ISSCC 2018峰会设计领域论文亮点和点评

ISSCC 2018国际技术委员会委员

ISSCC 2018 Subcommittee Paper Highlights

ISSCC 2018 International Technical Program Committee (ITPC) Member

15:10-15:20

电源管理

Power Management

复旦大学,洪志良教授

Prof. Zhiliang Hong, Fudan University

15:20-15:30

模拟电路 / 射频电路

Analog / RF

澳门大学,罗文基副教授

Prof. Man-Kay Law, Univ. of Macau

15:30-15:40

数据转换器

Data Converters

澳门大学和Synopsys澳门,余成斌教授
Prof. Seng-Pan (Ben) U, Univ. of Macau and Synopsys Macau

15:40-15:50

数字架构和系统 / 数字电路

Digital Architecture & System / Digital Circuits

日本东京大学,Makoto Takamiya教授, Prof. Makoto Takamiya, Univ. of Tokyo

15:50-16:00

存储器

Memory

韩国海力士半导体,Sungdae Choi博士

Dr. Sungdae Choi, SK Hynix

16:00-16:10

图像, MEMS, 医疗和显示 / 有线通讯
Imagers, MEMS, Medical & Displays (IMMD) / Wireline

台湾大学,李泰成教授

Prof. Tai-Cheng Lee, Taiwan University

16:10-16:20

无线通讯 / 前瞻技术领域
Wireless / Technology Directions

澳门大学,麦沛然教授

Prof. Pui-In Mak, University of Macau

16:20-16:40

问答讨论(第二轮)

Q&A (2nd round)

16:40-16:45

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana Resort Beijing

                                                  会议日程以最终现场公布为准Agenda up to final site release 


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