会议日程 Agenda 2017


中国集成电路设计2017会暨

北京集成电路产业创新发展高峰论坛

CSIA-ICCAD 2017 Annual Conference &

Beijing IC Industry Innovation and Development Summit

会议日程(拟稿)

Agenda

20171116日,星期四

Nov 16, Thursday, 2017

 地点北京稻香湖景酒店牡丹厅

  Venue: Peony Ballroom, Nirvana Resort Beijing

 

Time

       

Contents

Opening Ceremony

主持人:北京市经信委领导

Moderator: Leader of Beijing Municipal Commission of Economy and

Information Technology

08:30-08:50

中国半导体行业协会领导致词

Address, CSIA

北京市政府领导致词

Address, Beijing Municipal Government

工业和信息化部领导致词

Address, MIIT

科技部领导致词

Address, MOST

国家发改委领导致词

Address, NDRC

08:50-09:00

签约仪式

Signnature Ceremony

高峰论坛

Top Forum

主持人:中国半导体行业协会集成电路设计分会秘书长  程晋格先生

Moderator: Mr. Cheng Jinge, General Secretary, CSIA-ICCAD

09:00-09:30

 

      中国半导体行业协会集成电路设计分会理事长  魏少军教授

      Prof. Shaojun Wei, General Director, CSIA-ICCAD

09:30-09:45

打造国际化集成电路产业发展生态

      中关村发展集团总经理  宣鸿先生

09:45-10:00

 

      紫光集团董事长  赵伟国先生

10:00-10:20

Smart, Secure Everything from Silicon to Software

      Chi-Foon Chan, President and co-CEO, Synopsys

10:20-10:40

英特尔精尖制造大浪淘沙,永立潮头

      英特尔公司中国区总裁  杨旭先生

10:40-11:00

从万物互联到万物智联

      芯原控股有限公司董事长兼总裁  戴伟民博士

From IoT to AIoT

      Wayne Dai, Chairman, President and CEO, VeriSilicon Holdings Co., Ltd.

11:00-11:20

半导体合并与专业化

      明导电子亚太区总裁  彭启煌先生

      Danny Perng, PacRim Managing Director, Mentor Graphics

11:20-11:40

      台积电(南京)总经理  罗镇球先生

11:40-12:00

系统战略推动梦想成真

      Cadence中国区总经理  徐昀女士

SDE, One Step from Dream to a Reality

      Sherry Xu, China Country Manager, Cadence

12:00-13:25

自助午餐 Buffet Lunch

主持人: 中国半导体行业协会IC设计分会副理事长  黄学良先生

Moderator: Mr. Xueliang Huang, Vice General Director, CSIA-ICCAD

13:25-13:30

幸运抽奖Lucky Draw

13:30-13:50

半导体展望: 人工智能带来新动能

      联华电子总经理  简山先生

Semiconductor Innovation Gears up Artificial Intelligence Revolution

      Mr. S. C. Chien, Co-president, UMC

13:50-14:10

拓展工艺及设计服务, 创新产业链合作模式

      中芯国际集成电路制造有限公司执行副总裁  汤天申先生

SMIC’s Innovations in Ecosystem Collaboration for Design Services & Technology Offerings

      Mr. Tianshen Tang, EVP, SMIC

14:10-14:30

 

      Arm全球执行副总裁兼大中华区总裁  吴雄昂先生

Connected to Singularity: AI+ Driving IC Growth in China

      Mr. Allen Wu, EVP and President of Greater China, Arm

14:30-14:50

 

      GLOBALFOUNDRIES公司业务发展副总裁  Pankaj Mayor先生

      Mr. Pankaj Mayor, Vice President, Business Development, GLOBALFOUNDRIES

14:50-15:10

开放合作,创新融合, EDA助力产业跨界多赢

      北京华大九天软件有限公司副总经理  杨晓东先生

Seizing the Opportunity That Open Innovation Offers Us to Achieve Multi-win for Industry by Electronic Design Automation

      Mr. Steve Yang, VP, Huada Empyrean Software Co., Ltd.

15:10-15:30

芯片制造助力全球创新转型

      上海华力微电子有限公司市场部部长  杨展悌先生

IC Manufacturing Facilitates Technological Innovation and Upgrading Globally

      Mr. James Yang, Marketing Director, Shanghai Huali Microelectronics Corporation

15:30-15:45

茶歇,交流Coffee Break

15:45-15:50

幸运抽奖Lucky Draw

15:50-16:10

      国际设计自动化大会(DAC  李卓先生

16:10-16:30

      志翔科技

16:30-16:50

摩尔精英让中国没有难做的芯片

      摩尔精英CEO  张竞扬先生

MooreElite - To Make IC Design Business Easy & Fun

      Mr. Jing-Yang JY Zhang, CEO, MooreElite Group

16:50-17:10

14nm10nm Finfet工艺下如何轻松集成IP

      芯动科技有限公司CEO  敖海先生

Smooth Integration of Interface IP at 14/10nm

      Gordon Ao, CEO of INNOSILICON TECHNOLOGY LTD

17:10-17:30

 

      成都锐成芯微科技股份有限公司总经理  向建军先生

      Mr. Xiang Jianjun, GM, Chengdu Analog Circuit Technology Inc.

17:30-17:50

终端应用趋势

      小米科技副总裁  张峰先生

17:50-17:55

幸运抽奖Lucky Draw

19:30-21:30

欢迎晚宴(Synopsys公司赞助)

Welcome Dinner Banquet (Sponsored by Synopsys)

地点:北京稻香湖景酒店牡丹厅

Site: Peony Ballroom, Nirvana Resort Beijing


20171117日,星期五

Nov 17, Friday, 2017

专题论坛(一)

Subject Forum (Ⅰ)

 

地点:北京稻香湖景酒店多媒体室

Venue: Multi-function Room, Nirvana Resort Beijing

 

Time

   

Contents

演讲人

Lecturer

IPIC设计(I

IP and IC Design (I)

主持人:中国半导体行业协会集成电路设计分会副理事长,周生明先生

Moderator: Mr. Shengming Zhou, Vice General Director, CSIA-ICCAD

09:00-09:20

赛普拉斯公司低成本高可靠嵌入式闪存技术

Cypress Embedded Non-Volatile Memory Technologies

赛普拉斯半导体大中华区IP授权事业部总监,那炜

Wei Na, Director of IPBUCYPRESS

09:20-09:40

C-SKY安全解决方案为信息安全提供持续保障

C-SKY Security Solution Provides Sustaining Support for Information Security

杭州中天微系统有限公司资深技术专家&IC设计部经理,杨军

Stephen Yang, Technical expert & Manager of IC Design Department, C-SKY Microsystems Co., Ltd.

09:40-10:00

 

北京芯愿景软件技术有限公司

10:00-10:20

第二代高带宽内存物理层(PHY)与控制器(Controller

High Bandwidth Memory (HBM) PHY and Controller

创意电子股份有限公司CEO,曾文正

Vincent Tseng, Director, GLOBAL UNICHIP CORP. Co., Ltd.

10:20-10:40

智原ASIC/IP平台方案助力半导体产业百家争鸣新机遇

Faraday’s ASIC/IP Platform Enables the Innovation of Next Big Wave

智原科技市场暨投资处长,赖荣兴

Raymond Lai, Marketing & Investment AVP at Faraday Technology

10:40-11:00

Andes CPU IP提升系统芯片效能

Boosting SoC Performance Efficiency with Andes CPU IP

晶心科技AVP,陈志贤

Vincent Chen, AVP, Andes Technology

11:00-11:20

IP技术在国内十年来的演进和发展

The Evolution and Development of IP Technology in a Decade in China

四川和芯微电子股份有限公司董事长兼CEO,邹铮贤

Jackie Zou, Chairman of the Board & CEO, IPGoal Microelectronics (Sichuan) Co., Ltd.

11:20-11:40

科技新时代的芯片设计服务

Design Service: Your Trusted Turnkey Partner in Revolution Age

灿芯半导体(上海)有限公司首席技术官,庄志青

John Zhuang, CTO, Brite Semiconductor (Shanghai) Corporation

11:40-12:00

如何设计自驾车所需高效能SoC芯片

Building a High Performance SoC for Autonomous Car

Brian Huang, Senior Solution Architect, Arteris, Inc.

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐Buffet Lunch

EDAIC设计

IP and IC Design

主持人:中国半导体行业协会集成电路设计分会副秘书长,李军先生

Moderator: Mr. Jun Li, Vice General Secretary, CSIA-ICCAD

13:30-13:50

 

Cadence 公司

13:50-14:10

 

Mentor Graphics

14:10-14:30

 

Synopsys

14:30-14:50

时序Sign-off的革命

The Revolution of Timing Sign-off

北京华大九天软件有限公司产品总监,董森华

Senhua Dong, Supervisor of Product,  Huada Empyrean Software Co., Ltd.

14:50-15:10

茶歇,交流Coffee Break

15:10-15:30

集成电路硬件安全:保证信息系统安全可靠的物理基础

Hardware Security: The Physical Protection of Modern IT System

中国科学院EDA中心主任,陈岚博士

Dr. Chen Lan, Director, EDA Center of Chinese Academy of Sciences

15:30-15:50

加速高性能计算集成电路多物理场多维度签核

Accelerating HPC IC Multi-physics Multi-scale Signoff

ANSYS公司高级应用工程师,赵常

Chang Zhao, Lead Application Engineer, ANSYS Shanghai

15:50-16:10

倍增你的仿真容量

Double Your Simulation Capacity

北京天云融创软件技术有限公司,郭宏

Hong Guo, Skycloud Software Co., Ltd.

16:10-16:30

先进工艺节点的寄生RC分析和缩减

Analaysis and Reduction of Parasitic RCs For Advanced Nodes

芯师(上海)电子科技有限公司AE Manager,刘客

Ke Liu, AE Manager, Silvaco China., Ltd.

16:30-16:50

下一代ECO平台带来性能、功耗与面积的优化,以及可靠性的提高

The Next Generation ECO Platform for Optimizing Performance, Power, Area and Improving Reliability

知亿科技技术咨询总监,林仕洲

Joe Lin, Technical Consulting Director, Dorado Design Automation, Inc.

16:50-17:10

台积电12FFC设计平台与生态系统

TSMC N12FFC Design Platform and Ecosystem

台积电中国业务发展技术经理,卓銘

Ming Zhuo, Technical Manager, Business Development, TSMC

17:10-17:15

幸运抽奖Lucky Draw

18:00-20:00

闭幕招待晚宴

Closing Reception Banquet

地点:北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana Resort Beijing


20171117日,星期五

Nov 17, Friday, 2017

专题论坛(二)

Subject Forum (Ⅱ)

地点:北京稻香湖景酒店牡丹1

Venue: Peony Ballroom 1, Nirvana Resort Beijing

 

Time

   

Contents

演讲人

Lecturer

FOUNDRY与工艺技术

Foundry and Manufacturing Process Technology

主持人:中国半导体行业协会集成电路设计分会副秘书长,王志华教授

Moderator: Prof. Zhihua Wang, Vice General Secretary, CSIA-ICCAD

09:00-09:20

台积电领先技术:7奈米/12奈米/22奈米

TSMC Technology Leadership: N7/N12/N22

台积电中国业务发展技术经理,何瑞灵

Ray He, Technical Manager, Business Development, TSMC

09:20-09:40

 

格罗方德半导体科技(上海)有限公司

09:40-10:00

迎接即将爆发的新产品应用浪潮——晶圆专工在特殊工艺的技术创新

Foundry Innovation on Specialty Technology for Emerging Applications

联华电子副总经理,刘士维 

Steven Liu, Senior Vice President, UMC

10:00-10:20

垂直生态系统及跨行业合作

Vertical Channel Eco-System & Cross-Industry Cooperation

中芯国际集成电路制造有限公司垂直市场生态策略总监吴耿源

KY Wu, Director of Vertical Channel Marketing, SMIC.

10:20-10:40

华力微电子28纳米低功耗工艺技术

HLMC 28LP PolySiON Technology

上海华力微电子有限公司研发二部总监,彭树根

Albert Pang, Senior Director of TD, Shanghai Huali Microelectronics Co., Ltd.

10:40-11:00

让中国没有难做的芯片,摩尔FOC (Fabless Operation Cloud) 助力IC设计公司发展

To Make IC Design Business Easy & Fun, MooreElite FOC (Fabless Operation Cloud) Enables Small Fabless Start-ups

摩尔精英CEO,张竞扬

Jing-Yang JY Zhang, CEO, MooreElite Group

11:00-11:20

深耕模拟与功率半导体制造,助力集成电路成长

CSMC, Specialized in Analog and Power Management Foundry and Boosted Customer's Growth

华润上华科技有限公司市场销售副总,邵军

Jun Shao, VP of Marketing and Sales, CSMC

11:20-11:40

三重富士通车规级芯片制造开发与质量管理

Mie Fujitsu Semiconductor Automotive IC Manufacturing and Quality Management

三重富士通半导体有限公司质量保证部长,大村

Toru Omura, Director, Quality Assurance Dept., MIE Fujitsu Semiconductor Limited

11:40-12:00

智能时代,畅想机遇

Opportunities in the Smart Era

上海华虹宏力半导体制造有限公司战略、市场与发展部门部长,胡湘俊

Calvin Hu, Director of Strategy, Marketing and Development Division, Shanghai Huahong Grace Semiconductor Manufacturing Corporation

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐 Buffet Lunch

主持人:中国半导体行业协会集成电路设计分会副秘书长,赵丽女士

Moderator: Ms. Li Zhao, Vice General Secretary, CSIA-ICCAD

13:30-13:50

特种工艺链接世界

A World Connected by Specialty Technologies

TowerJazz中国区总经理,秦磊

Lei Qin, Senior Sales Director China Country Manager, TowerJazz

13:50-14:10

流片服务对于芯片研发和产品成功的重要性

Professional Tapeout Service Plays a Key Role in R&D and Market Success

MOSIS专业流片服务机构业务拓展经理,袁泉

YuanQuan, Business Development Manager, The MOSIS Service

14:10-14:30

 

Ams

14:30-14:50

武汉新芯特种工艺平台

XMC Specialty Process Platform

武汉新芯集成电路制造有限公司芯片代工事业部总监,沈亮

Neo Shen, Director of Foundry Service Business Unit, XMC

14:50-15:10

茶歇,交流Coffee Break

资本与IC设计业

Capital and IC Design Industry

主持人:中国半导体行业协会集成电路设计分会副秘书长,孙坚女士

Moderator: Ms. Jian Sun, Vice General Secretary , CSIA-ICCAD

15:10-15:30

 

 

15:30-15:50

 

 

15:50-16:10

 

华登国际董事总经理,黄庆

Dr. Hing Wong, Managing Director, Walden International

自由研讨IPO、企业并购和商业经营,产业发展缺一不可的路径

Panel – IPO, M & A and Business Operation, Integral Industry Development Way

主持人:华创投资合伙人,刘越女士

Moderator: Ms. Yue Liu, Partner, Hua-Capital Management Co., Ltd.

16:10-17:30

研讨嘉宾:魏少军、陈大同、黄庆、高松涛等

 

17:30-17:35

幸运抽奖Lucky Draw

18:00-20:00

闭幕招待晚宴

Closing Reception Banquet

地点:北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana Resort Beijing

 


20171117日,星期五

Nov 17, Friday, 2017

专题论坛(三)

Subject Forum (Ⅲ)

 

地点:北京稻香湖景酒店牡丹2

Venue: Peony Ballroom 2, Nirvana Resort Beijing

 

Time

   

Contents

演讲人

Lecturer

IPIC设计(II

IP and IC Design (II)

主持人:中国半导体行业协会集成电路设计分会副秘书长,徐秀法先生

Moderator: Mr. Xiufa Xu, Vice General Secretary, CSIA-ICCAD

09:00-09:20

 

兆芯

09:20-09:40

台积电7nm先进工艺下的设计方法

TSMC N7 Digital Design Enablement

台积电南京设计服务中心部门经理,曹宗良

Z.L. CAO, Department Manager, Nanjing Design Service Center, TSMC

09:40-10:00

高效的处理架构让AI无处不在

An Efficient Processor Architecture Enable AI Everywhere

芯原控股有限公司执行副总裁、IP事业部总经理、首席战略官,戴伟进

Weijin Dai, Executive Vice President, GM of IP Division and Chief Strategy Officer, VeriSilicon Holdings Co., Ltd.

10:00-10:20

面向物联网设备的平台安全架构

Platform Security Architecture for IoT Device

Arm高级技术市场经理,王骏超

Eric Wang, Senior Technical Marketing Manager, Arm China

10:20-10:40

高度定制化IP解决方案的现状和展望

The Trend and Prospect of Highly Customized IP Solution

芯动科技有限公司FAE 总监,何颖

Huck He, FAE Director, Innosilicon Technology Ltd.

10:40-11:00

 

恩智浦

11:00-11:20

人工智能时代的2.5D/3D先进封装设计

2.5D / 3D Advanced Packaging Design for Artificial Intelligence Era

苏州芯禾电子科技有限公司创始人/工程副总裁,代文亮

Dai Wenliang, Founder VP Engineering, Xpeedic Technology

11:20-11:40

 

无锡华大国奇科技有限公司总裁,谷建余

Gu Jianyu, President, Qualchip Technologies, Inc.

11:40-12:00

现今趋势中在线存储器测试与修复之应用

The Trend of Memory on Demand Test and Repair of Applications

厚翼科技中国区销售总监,王炳兴

Benson Wang, VP of China Region

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐 Buffet Lunch

主持人:中国半导体行业协会集成电路设计分会副秘书长,刘娜女士

Moderator: Ms. Na Liu, Vice General Secretary, CSIA-ICCAD

13:30-13:50

The Challenge of Systemic Complexity: The need for an architecture for debug, safety & security

Rupert Baines, CEO, UltraSoC

13:50-14:10

M31低功耗套装平台

M31 Low Power Platform

円星科技股份有限公司业务副总监,林世腾

Johnson Lin, Deputy Sales Director, M31 Technology

14:10-14:30

针对NB-IoT终端设备的单处理器核完整IP方案

Complete Single Processor IP Solution for NB-IoT Enabled Endpoint Devices

CEVA中国FAE经理杨晔

Luke Yang, China FAE Manager, CEVA

14:30-14:50

领导变革-芯片行业如何部署技术创新和外包战略

Leading Change-How does Industrials & Electronics Industry Deploy Technology Innovation and Outsourcing Strategy

亚创中国 半导体事业部总监,石贤帅

Xianshuai (Stone) Shi, I&E Division Director, Altran China

14:50-15:10

茶歇,交流

15:10-15:30

 

Chips&Media

15:30-15:50

Imagination AI解决方案激发智能社会充满想象

Imagination AI Stimulate the Innovation of Human Society

进想科技(上海)有限公司中国区市场总监,柯川

Bowen Ke, Marketing Director, Imagination Technologies

15:50-16:10

系统层级设计方法: 架构探索与高阶合成设计

Electronic System-Level Design Methodology: Architecture Exploration & High Level Synthesis

宏太科技股份有限公司应用经理,王义成

Frank Wang, AE Manager, Avant Technology Inc.

16:10-16:30

针对自动驾驶SoC的智能互联

Intelligent Interconnect for Automotive SoCs

Alex Chao, Sr. Director of Worldwide Field Applications, NetSpeed Systems

16:30-16:50

物联网应用之安全强化- 特殊型NeoFuse IP解决方案

Specialty NeoFuse IP simplify security enhancement for IoT application

力旺电子营销副处长,郭东政

Steve Kuo, Marketing Deputy Director, eMemory

16:50-17:10

 

Vipin Tiwari, Director, Marketing and Business Development, Silicon Storage Technology, Inc.

17:10-17:30

 

爱普科技股份有限公司

17:30-17:35

幸运抽奖Lucky Draw

18:00-20:00

闭幕招待晚宴

Closing Reception Banquet

地点:北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana Resort Beijing

 


20171117日,星期五

Nov 17, Friday, 2017

专题论坛(四)

Subject Forum (Ⅳ)

 

地点:北京稻香湖景酒店牡丹3

Venue: Peony Ballroom 3, Nirvana Resort Beijing

 

Time

   

Contents

演讲人

Lecturer

封装测试与IC设计

IC Design and Packaging & Testing

主持人:中国半导体行业协会集成电路设计分会副秘书长,刘洋先生

Moderator: Mr. Yang Liu, Vice General Secretary, CSIA-ICCAD

09:00-09:20

 

江苏长电科技股份有限公司

 

09:20-09:40

通富微电在Processing Unit的封测解决方案

TFME Full Backend Solution at Processing Unit

通富微电子技术中心副总,林伟

Wayne Lin, Vice President, R&D center, TFME

09:40-10:00

芯片产品的全程可溯

IC Product Traceability Across Supply Chain

PDF中国总经理、全球副总裁,房华博士

Dr. Hua Fang, PDF-China GM, Global VP

10:00-10:20

智能芯片商机与可靠性之挑战

Business Opportunity and Challenge for AI Semiconductors

宜特检测技术有限公司董事长,崔革文

Kevin Tsui, iST China Chairman & General Manager

10:20-10:40

 

日月光集团制造工程处处长,沈政昌

Allen Shen, Director, ASE Group

10:40-11:00

系统级封装(SiP)的市场和技术发展趋势

SiP (System in Package) Market and Technology Trend

安靠封装测试资深总监,李吕祝

John Lee, Sr. Director, Amkor Technology

11:00-11:20

高性能计算应用之创新封装解决方案

The Innovate Packaging Solutions In High Performance Computing

矽品精密工业股份有限公司研发中心客户前瞻产品处副处长,陳盟順

Royal Chen, Deputy Director, Customer Advanced Package Application Engineering of CRD, SPIL

11:20-11:40

 

深圳市道格特科技有限公司副总经理,李忠民

Tommy Lee, VP, Shenzhen Doctor Technology Co., Ltd.

11:40-12:00

物联网技术的测试挑战以及是德科技的解决方案

IoT Technology Test Challenges and Keysight Solutions

是德科技中华区市场部行业市场经理,祝晓悦

Xiaoyue Zhu, Marketing Industry Manager, Keysight Technologies

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐Buffet Lunch

主持人:中国半导体行业协会集成电路设计分会副秘书长,赵建忠教授

Moderator: Prof. Jianzhong Zhao, Vice General Secretary, CSIA-ICCAD

13:30-13:50

持续驱动集成电路小型化和性能提升的晶圆级封装技术

Wafer-level packaging technologies as a key enabler for continuous miniaturization and performance enhancement of integrated circuits

华天科技(昆山)电子有限公司技术总监,王腾

Teng Wang, Technical Director, Huatian Technology (Kunshan) Electronics Co., Ltd.

13:50-14:10

 

泰瑞达

14:10-14:30

R&S 最新IoT测试技术和解决方案

R&S Latest IoT Test Techniques and Solutions

罗德与施瓦茨(中国)科技有限公司业务发展主管,杨洪文

Hongwen Yang, Business Development Manager, Rohde & Schwarz (China) Technology Co., Ltd.

14:30-14:50

 

美国国家仪器有限公司

 

14:50-15:10

茶歇,交流Coffee Break

15:10-15:30

物联网时代的芯片测试解决方案

Testing Devices for the IoT and Smart Applications

爱德万测试(中国)管理有限公司北京分公司测试技术部课长,张可

Ke Zhang, Section Manager, BJT Department, Advantest (China) Co., Ltd. Beijing Branch

15:30-15:50

全方位测试解决方案

Comprehensive Semiconductor Testing Solution

京元电子股份有限公司/京隆科技(苏州)有限公司/苏州震坤科技有限公司总经理,刘安炫

Liu Anhsuan, President, KYEC Yuan Electronics Co., Ltd. / King Long Technology (Suzhou) Co., Ltd. / Suzhou Zhen Kun Technology Co., Ltd.

15:50-15:55

幸运抽奖Lucky Draw

18:00-20:00

闭幕招待晚宴

Closing Reception Banquet

地点:北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana Resort Beijing


20171117日,星期五

Nov 17, Friday, 2017

专题论坛(五)

Subject Forum (V)

 

地点:北京稻香湖景酒店牡丹4

Venue: Peony Ballroom 4, Nirvana Resort Beijing

 

Time

   

Contents

演讲人

Lecturer

动北京 - 暨首届中关村IC产业发展论坛

Chip-Power Beijing and First Zhongguancun IC Industry Development Forum

主持人:中关村集成电路设计园领导主持

Moderator: IC PARK Leader

09:00-09:05

海淀区政府领导致欢迎词

Welcome Speech from the Leader of Haidian District Government

09:05-09:10

中关村管委会领导讲话

Speech from the Leader of Administrative Committee of Zhongguancun Science Park

09:10-09:15

市科委领导讲话

Speech from the Leader of Beijing Municipal Committee of Science and Technology

09:15-09:30

人工智能行业研究及成果转化

Research and Result transformation of AI industry

清华微电子所所长魏少军

Director of Institute of Microelectronics,Tsinghua University Wei Shaojun

09:30-09:45

百度人工智能的基础技术及应用创新

Basic Technology and Application Innovation of Baidu AI

百度技术体系主任架构师欧阳剑

Director of technology system architect of Baidu Ouyang Jian

09:45-10:00

人工智能芯片趋势研究

Research on the Tendency of AI Chip

英特尔人工智能专家

Intel AI Expert

10:00-10:15

人工智能处理器:新的产业军备竞赛

Processors of AI:A New Arms Race in the Industry

地平线CEO余凯

Horizon Robotics CEO Yu Kai

10:15-10:30

智能语音技术如何商业化应用

How to Commercialize Intelligent Voice Technologies

云知声CEO黄伟

Unisound CEO Huang Wei

10:30-10:45

 

英韧科技CEO吴子宁

10:45-10:50

幸运抽奖Lucky Draw

12:00-13:30

自助午餐Buffet Lunch

                                                                                     会议日程以最终现场公布为准

Agenda up to final site release.


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