会议日程 Agenda 2018


中国集成电路设计业2018年会

珠海集成电路产业创新发展高峰论坛

CSIA-ICCAD 2018 Annual Conference &

Zhuhai IC Industry Innovation and Development Summit

会议日程

Agenda

 

20181129日,星期四

Nov 29, Thursday, 2018


 地点珠海国际会展中心四楼珠海

Venue: Zhuhai Ballroom, L4, Zhuhai International Convention & Exhibition Center

 

Time

       

Contents

Opening Ceremony

主持人:珠海市副市长  芦晓凤女士

Moderator: Ms. Xiaofeng Lu, Vice Mayor, Zhuhai

 

08:30-09:00

中国半导体行业协会领导致词

Address, CSIA

领导、嘉宾致辞

Address, Leader and Guest

珠海市领导致辞

Address, Zhuhai

09:00-09:10

重大项目签约仪式

The Signing Ceremony of Major Projects

高峰论坛

Top Forum

主持人:中国半导体行业协会集成电路设计分会秘书长  程晋格先生

Moderator: Mr. Jinge Cheng, General Secretary, CSIA-ICCAD

09:10-09:40

主旨演讲

       中国半导体行业协会集成电路设计分会理事长  魏少军教授

Keynote Speech

       Prof. Shaojun Wei, General Director, CSIA-ICCAD

09:40-10:00

为何半导体行业内的设计不断加快?

       Dr. Walden.C. Rhines, CEO Emeritus of Mentor, a Siemens business

Why Is Semiconductor Industry Design Activity Accelerating?

       Dr. Walden.C. Rhines, CEO Emeritus of Mentor, a Siemens business

10:00-10:20

 

       台积电中国业务发展副总经理  罗镇球先生

 

       Mr. Roger Luo, Vice President, Business Development, TSMC China

10:20-10:40

AI如何落地?

       芯原控股有限公司董事长兼总裁  戴伟民博士

How to Make AI Real?

       Dr. Wayne Dai, Chairman, President and CEO, VeriSilicon Holdings Co., Ltd.

10:40-11:00

 

 

       Cadence公司全球副总裁,亚太及日本区总裁  石丰瑜先生

       Mr. Michael Shih, Corporate Vice President, Asia Pacific and Japan, Cadence Design Systems, Inc.

11:00-11:20

 

       Synopsys

11:20-11:40

利用半导体为第四代工业革命创造未来

       三星电子资深副总裁  朴宰弘博士

Creating the Future with Silicon for the 4th Industrial Revolution

      Ph. D. Jaehong Park, SVP, Head of Foundry Design Service Team, Samsung Foundry

11:40-12:00

       格力电器  董明珠女士

12:00-13:25

自助午餐 Buffet Lunch

主持人: 中国半导体行业协会IC设计分会副理事长  黄学良先生

Moderator: Mr. Xueliang Huang, Vice General Director, CSIA-ICCAD

13:25-13:30

幸运抽奖Lucky Draw

13:30-13:50

专注于制造当地化的晶圆代工服务

       和舰芯片制造(苏州)股份有限公司副总经理  林伟圣先生

Local Manufacture Focus Foundry

       Mr. W S Lin, VP, Hejian Technology (Suzhou) Co., Ltd.

13:50-14:10

需求导向,专业服务,推动集成电路产业发展

       国家专用集成电路系统工程技术研究中心主任  时龙兴教授

Demand Oriented, Professional Services, to Promote the Development of IC Industry

       Prof. Longxing Shi, Director, National ASIC System Engineering Research Centre

14:10-14:30

打造新型差异化晶圆厂

       格芯副总裁兼大中华区总经理  白农先生

Building a New Breed of Differentiated Foundry

       Mr. Wallace Pai, VP & General Manager, GlobalFoundries

14:30-14:50

 

       Arm

14:50-15:10

 

       北京华大九天软件有限公司

        

15:10-15:30

芯片制造推动创新变革

       上海华力微电子有限公司市场部部长  杨展悌博士

IC Manufacturing Drive the Innovation and Change

       Ph.D. James Yang, Marketing Director, HLMC

15:30-15:45

茶歇,交流Coffee Break

15:45-15:50

幸运抽奖Lucky Draw

15:50-16:10

SiFive 引领半导体设计革命

       SiFive全球CEO  Naveed Sherwani博士

SiFive – Leading Semiconductor Design Revolution

       Dr. Naveed Sherwani, CEO, SiFive

16:10-16:30

嵌入式非挥发存储器在汽车电子浪潮中的机遇与挑战

       成都锐成芯微科技股份有限公司CEO  向建军先生

Opportunities and Challenges of Embedded non Volatile Memory in Automotive Electronic Wave

       Mr. Jianjun Xiang, CEO, Chengdu Analog Circuit Technology Inc.

16:30-16:50

用于物联网、大数据、人工智能、自动驾驶等领域,为SoC设计迅速占领市场提供的EDAIP

       Silvaco CEO  David L. Dutton先生

EDA and IP for Fast Time to Market SoC Design in IoT, Big Data, AI and Autonomous Driving

       Mr. David L. Dutton, CEO, Silvaco, Inc.

16:50-17:10

十年再造一个TI

       摩尔精英CEO  张竞扬先生

Build a New “TI” in 10 Years

       Mr. JY Zhang, Chairman & CEO, MooreElite

17:10-17:30

SoC开启的万物智联时代

      索喜科技(上海)有限公司董事长兼总经理  铃木寿哉

The AIoT World Made by SoC

      Mr. Toshiya Suzuki, Chairman & President, Socionext Technology (Shanghai) Co., Ltd.

17:30-17:50

面向无处不在的AI:可重构神经网络计算架构

       清华大学微电子所副所长  尹首一博士

Towards Deploying AI Everywhere: High Energy Efficient NN Computing Architecture

       Dr. Shouyi Yin, Deputy Director, Institute of Microelectronics, Tsinghua University

17:50-17:55

幸运抽奖Lucky Draw

19:00-21:00

欢迎晚宴(Mentor公司赞助)

Welcome Dinner Banquet (Sponsored by Mentor)

地点:珠海国际会展中心珠海

Site: Zhuhai Ballroom, 4F, Zhuhai International Convention & Exhibition Center


20181130日,星期五

Nov 30, Friday, 2018

专题论坛(一)

Subject Forum (Ⅰ)

 

地点:珠海国际会展中心四楼珠海厅5

Venue: Zhuhai Hall 5, L4, Zhuhai International Convention & Exhibition Center

 

Time

   

Contents

演讲人

Lecturer

EDAIC设计服务

EDA and IC Design Service

主持人:中国半导体行业协会集成电路设计分会副理事长,周生明先生

Moderator: Mr. Shengming Zhou, Vice General Director, CSIA-ICCAD

08:40-09:00

Machine Learning in Synopsys’ Design Platform

Kenny Kwan, Synopsys

 

09:00-09:20

AI芯片设计以及验证的挑战

梁戈超,Cadence公司资深技术支持经理

09:20-09:40

人工智能快速开发流程:HLS到硬件加速器,加速你的设计周期

AI Quick Deployment Flow: HSL to Emulation Speed Up Your Design Cycle

张俊,明导电子资深技术经理

Justin Zhang, Senior AE Manager, Mentor, A Siemens Business

09:40-10:00

基于22FDX的蓝牙5.0NB-IoT片上系统

22FDX Based, Integrated BLE5.0 and NB-IoT SoC Solution

曾毅,芯原微电子(上海)有限公司IoT平台总监

Yi Zeng, Director, IoT Platform, VeriSilicon Microelectronics (Shanghai) Co., Ltd.

10:00-10:20

加速先进工艺的电路仿真验证

Accelerate Circuit Simulation and Validation on Advanced Process

董森华,北京华大九天软件有限公司VP

Senhua Dong, CEO, Beijing Empyrean Software Co., Ltd.

10:20-10:40

浅析公共技术服务平台对IC企业集聚的促进作用

Analysis on Relationship between Public Technology Service Platform and IC Enterprises Aggregation

李辉,南京集成电路产业服务中心(南京ICC)平台总监(公共技术服务平台、系统应用服务平台总监)

Hui Li, Director, Nanjing IC Industry Service Center (ICisC) Public Technology Service Platform Director & System Application Service Platform 

10:40-11:00

使用Silvaco cell工具进行标准单元库版图的迁移和优化

Layout Migration and Optimization with Silvaco’s Cello

刘客,芯师(上海)电子科技有限公司AE经理

Ke Liu, AE Manager, Silvaco China., Ltd.

11:00-11:20

怎样解决IC、封装和系统设计的建模与仿真挑战

Addressing Modeling and Simulation Challenges for IC, Package and System

代文亮,苏州芯禾电子科技有限公司创始人、工程副总裁

Wenliang Dai, Founder, VP Engineering, Xpeedic Technology

11:20-11:40

基于HBM2 IPCoWoS封装适合人工智能、超算与高速通信的高性能ASIC设计方法

High Performance ASIC Design Methodology for AI, HPC and Networking Based on HBM2 IP and CoWoS Package

陈宏铭博士,创意电子股份有限公司 华东区业务总监

Dr. Arthur Hung-Ming Chen, East China Regional Sales Director, Global Unichip Corporation

11:40-12:00

创造芯片协同设计新价值 ASIC设计服务

ASIC: Design Enablement for Semiconductor Mega Trend & Evolution

赖荣兴,智原科技营销协理

Raymond Lai, Marketing & Investment AVP, Faraday Technology

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐Buffet Lunch

主持人:中国半导体行业协会集成电路设计分会副秘书长,韩乐福先生

Moderator: Mr. Lefu Han, Vice General Secretary, CSIA-ICCAD

13:30-13:50

异构计算下的FPGA发展

 

王海力,京微齐力(北京)科技有限公司CEO

Haili Wang, CEO, Hercules Microelectronics Co., Ltd.

13:50-14:10

查找高性能SOC中电磁串扰问题

Finding Aggressors in High Performance SOC’s

Thomas Flynn, Helic副总裁

Thomas Flynn, Vice President, Helic

14:10-14:30

设计服务的创新

Innovation in Design Service

庄志青,灿芯半导体(上海)有限公司代理首席执行官

John Zhuang, Acting CEO, Brite Semiconductor (Shanghai) Corporation

14:30-14:50

支持嵌入式智能的物联网处理器平台

Embedded Intelligent Data Processor for IoT Application

陈岚博士,中国科学院EDA中心主任

Dr. Lan Chen, Director, EDA Center of Chinese Academy of Sciences

14:50-15:10

Gigachip设计上的一种创新时序收敛方法,借助Tweaker ECO平台,实现在数百scenario中高效的runtime和内存消耗

A Novel Methodology of Timing Closure for Gigachip Design Having Hundreds of Scenarios Simultaneously with Effective Runtime & Memory Using Tweaker ECO Platform

林仕洲,知亿科技股份有限公司资深技术总监

Joe Lin, Senior Director, Dorado Design Automation, Inc.

15:10-15:30

ICO----智能设计平台 以更少资源赢得投片时间和质量

ICO - Extremely Smart Design Methodology to Accomplish Shocking Turn-Around Time and Quality

和王峰,南京科拉德电子技术有限公司技术副总

Aaron He, CTO, Nanjing Cloud Electronic Technology Co., Ltd.

15:30-15:50

茶歇,交流Coffee Break

15:50-16:10

 硅知识产权保护方法与策略

Silicon Intellectual Property Protection Methods and Strategies

石子信,北京芯愿景软件技术有限公司副总经理

Tony Shi, VP, Cellixsoft Corporation

 

16:10-16:30

APPRY: SoC设计一次成功的关键

The Critical Role of APPRY in SoC Design

谷建餘,无锡华大国奇科技有限公司CEO

Jianyu Gu, CEO, Qualchip Technologies, Inc.

16:30-16:50

面向先进IC设计的器件建模和电路仿真解决方案

Addressing Modeling and Simulation Challenges for Fabless IC Design Companies

吴伟雄,概伦电子科技有限公司高级市场总监

Weixiong Wu, Sr. Product Marketing Director, ProPlus Design Solutions, Inc.

16:50-17:10

半导体和电子产业的机遇与挑战

Semiconductor and Electronics: Opportunities and Challenges

张书强,ANSYS中国半导体事业部AE经理

Shuqiang Zhang, AE Manager, SCBU of ANSYS Inc.

17:10-17:30

EasyECO:大幅加快设计流程的自动化ECO工具

EasyECO: An Intelligence Enhanced Functional ECO Tool to Largely Speed up the Design Flow

魏星,香港奇捷科技股份有限公司CTO

Xing Wei, CTO, Hong Kong Easy-Logic Technology Limited

17:30-17:35

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:珠海国际会展中心十字门厅

Site: Shizimen Hall, Zhuhai International Convention & Exhibition Center


20181130日,星期五

Nov 30, Friday, 2018

专题论坛(二)

Subject Forum (II)

 

地点:珠海国际会展中心四楼珠海厅4

Venue: Zhuhai Hall 4, L4, Zhuhai International Convention & Exhibition Center

 

Time

   

Contents

演讲人

Lecturer

IPIC设计(一)

IP and IC Design (I)

主持人:中国半导体行业协会集成电路设计分会副理事长,张力天先生

Moderator: Mr. Litian Zhang, Vice General Director, CSIA-ICCAD

08:40-09:00

补足IC行业短板 谋求创新发展

新形势下思考本土CPU企业前行道路

傅城博士,上海兆芯集成电路有限公司副总裁

Dr. Cheng Fu, VP, Shanghai Zhaoxin Semiconductor Co., Ltd.

09:00-09:20

中国架构,全球生态—人工智能平台周易

Chinese Architecture, Global Ecosystem - AI Platform Zhouyi

刘澍,Head of Product Development,安谋科技(中国)

Shu Liu, Head of Product DevelopmentArm China

09:20-09:40

以完整的IP解决方案迎接下一代AIADAS芯片设计挑战

钟香建,新思科技华南区IP销售总监

09:40-10:00

SiFive基于RISC-V架构的CPU发展蓝图

SiFive RISC-V Product Overview

Jack Kang, SiFive产品副总裁

Jack Kang, VP of product, SiFive

10:00-10:20

ADAS系统高性能SoC的设计挑战

Challenges of Building High Performance ADAS SoC

刘晖,索喜科技(上海)有限公司高端定制SoC事业部亚太区总经理

Kenn Liu, General Manager of Advanced Custom SoC Division, Socionext Technology (Shanghai) Co., Ltd.

10:20-10:40

台积电 OIP,设计流程和设计实现

TSMC OIP, Reference Flow and Design Enablement

任建军,台积电

George Ren, TSMC

10:40-11:00

 

NetSpeed

11:00-11:20

Visual Plus SLAM专用芯片赋能机器人产业

Visual Plus SLAM ASIC Empowers the Robot Industry

姜新桥,珠海市一微半导体有限公司市场营销副总

Tina Jiang, Vice President of Marketing, Amicro Semiconductor Co., Ltd.

11:20-11:40

开启智能语音新纪元

A New Ear of Intelligent Voice

劳懋元,杭州中天微系统有限公司中天微智能语音平台负责人

Patrick Lao, Sr. Manager, C-SKY Microsystem

11:40-12:00

专为前端深度学习设计的AI处理器

A Specialized AI Processor for Deep-Learning Inference at the Edge

柴卫华,CEVA中国市场拓展经理

Bobby Chai, Business Development Manager China Market, CEVA

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐 Buffet Lunch

主持人:中国半导体行业协会集成电路设计分会副秘书长,徐秀法先生

Moderator: Mr. Xiufa Xu, Vice General Secretary, CSIA-ICCAD

13:30-13:50

Imagination先进视觉无损压缩技术

Visually Lossless Compression

郑凯,Imagination Technologies中国区解决方案技术经理

Kai Zheng, Solutions Engineering Manager, Imagination Technologies

13:50-14:10

先进设计方法:系统层级架构探索与高阶综合

Advanced Design Methodology: System-level Architecture Exploration & High Level Synthesis

李俊德,宏太科技股份有限公司技术经理

Elvis Li, Technical Manager, Avant Technology Inc.

14:10-14:30

AndesCore V5 CPU Families迎接智能物联世代

Embracing the AIoT Era with AndesCore V5 CPU Families

王胜雯,晶心科技市场及技术服务处处长

Wen Wang, Director of Marketing and Technical Service Division, Andes Technology

14:30-14:50

PCIe5.0将会在未来的SoC里普及化吗?

Will PCIe 5.0 become ubiquitous in tomorrow’s SoCs?

Rex Yu, Field Application Engineer, Support and Applications, PLDA Inc.

14:50-15:10

保卫万物智联:国产高安全IP和安全方案

Protect IoT with OSR Security IP and Solutions

樊俊锋,深圳市纽创信安科技开发有限公司CEO

Junfeng Fan, CEO, Open Security Research, Inc.

15:10-15:30

7nm5nm FinFET工艺上开发物联网和微功率产品的时钟系统

Developing Clocking System for IoT and Micropower Products in 7nm and 5nm FinFET

Andrew Cole, VP, Silicon Creations

15:30-15:50

茶歇,交流Coffee Break

15:50-16:10

USB3 – 推动未来百亿元的产业机遇

USB3 - Driving the Next Billion Dollar Opportunity

芦笙,芯启源公司董事长&首席执行官

Sheng Lu, Chairman and CEO, Corigine Inc.

16:10-16:30

在基于ARM CPUSoC芯片中集成嵌入式FPGA

Integrating an Embedded FPGA IP into Your ARM-Based SoC

郭道正,Achronix半导体公司中国区销售总监

Dawson Guo, Sales Director of China, Achronix Semiconductor Corporation

16:30-16:50

利用软硬件协同验证平台加速SSD主控芯片设计

Accelerate SSD Controller Development via Software-hardware Synergistic Platform

王时,北京忆芯科技有限公司SSD架构师

Shi Wang, Architect, SSD Design, Beijing Starblaze Technology Co., Ltd.

16:50-17:10

防逆向工程伪装技术保护你的集成电路设计

Silicon Camouflage Technology - Why would You Need to Protect an Integrated Circuit?

Ron Cocchi, 法商颖设科技有限公司CTO

Ron Cocchi, Chief Technology Officer, Inside Secure

17:10-17:30

面向新环境下提供客户ASIC IP/SOC 整体设计及解决方案

Providing ASIC IP/SOC Overall Design and Solution to Customers Under New Circumstances

谭飞鸿,广州思信电子科技有限公司CEO

Feihong Tan, CEO, Guangzhou Sytrons Technology Co., Ltd.

徐立文,广州思信电子科技有限公司 项目总监

Liwen Xu, Project Director, Guangzhou Sytrons Technology Co., Ltd.

17:30-17:35

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:珠海国际会展中心十字门厅

Site: Shizimen Hall, Zhuhai International Convention & Exhibition Center


20181130日,星期五

Nov 30, Friday, 2018

专题论坛(三)

Subject Forum (III)

 

地点:珠海国际会展中心四楼珠海厅7

Venue: Zhuhai Hall 7, L4, Zhuhai International Convention & Exhibition Center

 

Time

   

Contents

演讲人

Lecturer

FOUNDRY与工艺技术

Foundry and Process Technology

主持人:中国半导体行业协会集成电路设计分会副秘书长,刘洋先生

Moderator: Mr. Yang Liu, Vice General Secretary, CSIA-ICCAD

08:40-09:00

台积电N7/N7+/N12/N22技术平台

TSMC N7/N7+/N12/N22 Design Enablement Platforms

韩晓峰,台积电技术支持经理

Evan Han, Technical Support Manager, TSMC

09:00-09:20

利用FDSOI推动差异化解决方案以应对日益严苛的市场需求

Driving Differentiated Solutions with FD-SOI for Demanding Markets

韩志勇,格芯中国区销售总经理

Zhiyong Han, China Sales General Manager, Globalfoundries

09:20-09:40

先进特色工艺与前沿应用创新

Advanced Specialty Technologies for Leading Edge Applications

于德洵,联华电子股份有限公司韩国暨中国销售支援处资深处长

Remi Yu, Senior Director, United Microelectronics Corporation (UMC)

09:40-10:00

全面拥抱智能时代

Preparing for the Age of Intelligence

魏峥颖,上海华力微电子有限公司副厂长

Raymond WeiDeputy Senior Director, HLMC

10:00-10:20

 

摩尔精英

10:20-10:40

武汉新芯3D IC技术平台——后摩尔时代的设计新思路

XMC 3D IC Platform - New Design View in the Post-Moore Era

孙鹏,武汉新芯集成电路制造有限公司运营中心副总裁

Holly Sun, VP of Operation Center, Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.

10:40-11:00

汇聚“芯”动力,打造“芯”生态

Tap Chip Potential to Create a Chip Ecosystem

胡湘俊,上海华虹宏力半导体制造有限公司战略、市场与发展部门部长

Calvin Hu, Director of Strategy, Marketing and Development Division, Shanghai Huahong Grace Semiconductor Manufacturing Corporation

11:00-11:20

65纳米工艺上的模拟产品

Analog Products in 65nm

秦磊,TowerJazz中国区总经理

Lei Qin, China General Manager, TowerJazz

11:20-11:40

华邦专业嵌入式新兴电阻记忆体工艺平台增进创新

Winbond Specialty Embedded Emerging ReRAM Foundry Platform Enables Innovation

谢明辉博士,华邦电子公司技术总监

Dr. Ming-Huei Shieh, Technology Executive, Winbond

11:40-12:00

 

三重富士通

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐 Buffet Lunch

IPIC设计(二)

IP and IC Design (II)

主持人:中国半导体行业协会集成电路设计分会副秘书长,刘娜女士

Moderator: Ms. Na Liu, Vice General Secretary, CSIA-ICCAD

13:30-13:50

赛普拉斯半导体先进的电荷陷阱嵌入式闪存

CYPRESS Advanced Charge Trap Embedded Flash

那炜,赛普拉斯半导体技术(上海)有限公司总监

Wei Na, Director, CYPRESS Semiconductor Technology(Shanghai) Co., Ltd.

13:50-14:10

边缘计算和可编程逻辑器件FPGA

Edge Computing and FPGA

王添平,广东高云半导体科技股份有限公司工程副总裁

TP Wang, VP of Engineering, Gowin Semiconductor Corp.

14:10-14:30

万物联网AIoE——M31,引领IP迈向深智慧新应用新纪元

AIoE (AI+IoE) M31, Leading IPs into the New Era of Deep Intelligence Applications

王怀德博士,M31科技公司经理

Huaide Wang, Ph.D., Technical Manager, M31 Technology Corp.

 

14:30-14:50

Wave Computing:将AI赋能Mips IP

Wave Computing: AI Enables Mips

熊大鹏,Wave Computing大中国区总经理

Dapeng XiongGM, Wave Computing Great China

14:50-15:10

和众之长,芯创蓝海—— IPGoal与中小集成电路企业的共荣之道

Together, Create a Harmonious Environment and Grow along with Customers.

邹铮贤,四川和芯微电子股份有限公司董事长兼CEO

Jackie Zou, Chairman of the Board & CEO, IPGoal Microelectronics (Sichuan) Co., Ltd.

15:10-15:30

 

北京集创北方

15:30-15:50

茶歇,交流Coffee Break

15:50-16:10

 集成电路IP共享

中科院微电子所

16:10-16:30

Implementing Mesh, Ring and 3D Torus Interconnect Topologies for Machine Learning Acceleration

葛礼鹏,资深架构师,Arteris IP

Gary Ge, Senior Solution Architect, Arteris IP

16:30-16:50

尖端工艺节点上的高度定制化IP解决方案

Highly Customized IP Solution in 28/14/10nm

何颖,芯动科技有限公司FAE 总监

Huck He, FAE Director, Innosilicon Technology Ltd.

16:50-17:10

智能物连网 -- 嵌入式根密钥解决方案与芯片防盗拷技术

NeoPUF Embedded Root of Trust Solution and Chip Anti-clone Applications for AIoT

柳星舟,力旺电子股份有限公司市场发展部项目经理

Emory Liu, Product Portfolio Manager of Market Development Department, eMemory

17:10-17:30

 最优存储器解决方案

Optimal Memory Solution

范煜川,爱普存储技术(杭州)有限公司设计与系统验证工程部经理

Eric Fan, FAE Director, AP Memory Technology (Hangzhou) Limited Co.

17:30-17:35

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:珠海国际会展中心十字门厅

Site: Shizimen Hall, Zhuhai International Convention & Exhibition Center


20181130日,星期五

Nov 30, Friday, 2018

专题论坛(四)

Subject Forum (IV)

 

地点:珠海国际会展中心四楼珠海厅1

Venue: Zhuhai Hall 1, L4, Zhuhai International Convention & Exhibition Center

 

Time

   

Contents

演讲人

Lecturer

先进封装与测试

Advanced Packaging and Testing

主持人:中国半导体行业协会集成电路设计分会副秘书长,李军先生

Moderator: Mr. Jun Li, Vice General Secretary, CSIA-ICCAD

08:40-09:00

通富微电的功率半导体封装技术发展与挑战

The Development and Challenge of Power Packaging in TFME

通富微电子股份有限公司技术中心副总,林伟

Wayne Lin, Vice President, R&D Center, TFME

09:00-09:20

 半导体全产业链大数据应用新业态

Innovative Big Data Application in Semiconductor Full Supply Chain

蓝碧健,普迪飞半导体业务拓展总监

Rebecca Lan, Business Development Director, PDF Solutions 

09:20-09:40

一站式ATE测试平台

One-Stop ATE Test Platform

潘博,苏州华兴源创科技股份有限公司 CTO

Jin Pan, CTO, Suzhou HYC Technology Co., LTD

09:40-10:00

先进封装技术发展趋势

Development Trend of Advanced IC Packaging

梁新夫,江苏长电科技股份有发公司  高级副总裁

Steve Liang, Ph.D., Senior Vice President, JCET

10:00-10:20

物联网的系统级封装平台解决方案

SiP Solution Platform for IoT

郑民耀,日月光集团处长

Eddie Cheng, Director, ASE Group

10:20-10:40

先进封装对环氧塑封料的性能要求

Performance Requirements of Epoxy Molding Compound for Advanced IC Package

王善学,北京科化新材料科技有限公司运营总监,科化新材料泰州有限公司总经理

Shanxue Wang, COO of Beijing KEHUA, GM of KEHUA Taizhou

10:40-11:00

晶圆级倒装先进封装装备及其核心技术国产化

Introduction of A Made-in-China Wafer Level Flip-chip Advanced Packaging Machine and Its Core Technologies

贺云波教授,广东工业大学微电子装备与技术教育部重点实验室

Prof. Yunbo He, Guangdong University of Technology

11:00-11:20

人工智能辅助汽车电子芯片测试技术从A+提升至A++等级

Automotive with AI (A&A) Motivate Test Technologies from A+ to A++ level

刘安炫,京隆科技(苏州)有限公司/京元集团总经理

Anhsuan Liu, President, King long Technology (Suzhou) Co., Ltd. (KLT) /KYEC Group

11:20-11:40

测量的脉动

Measure the "Pulse" of a Chipset

郑纪峰,是德科技(中国) 有限公司大中华区市场总经理

Jifeng Zheng, General Manager, Greater China Marketing,

Keysight Technologies

11:40-12:00

晶圆级封装技术发展与展望

Advanced WLP Technology Development

郭谦,中芯长电半导体(江阴)有限公司资深经理

Chien Kuo, Senior Manager, SJ Semiconductor(Jiangyin) Corp.

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐Buffet Lunch

主持人:中国半导体行业协会集成电路设计分会副秘书长,赵建忠教授

Moderator: Prof. Jianzhong Zhao, Vice General Secretary, CSIA-ICCAD

13:30-13:50

台积电工艺平台概要

Overview of TSMC Technology Platforms

刘坚斌,台积电客户经理

Armstrong Liu, Account Manager, TSMC

13:50-14:10

高性能异构芯片集成封装 - 2.5D 封装和 HDFO

Advanced Heterogeneous Packaging Solutions - 2.5D Package and HDFO

李吕祝,安靠科技资深总监

John Lee, Sr. Director, Amkor Technology, Inc.

14:10-14:30

先进系统级封装趋势及应用

Advanced System Integration Package Technology Trends & Application

刘卫东,华天科技(西安)有限公司研究院院长

Wade Liu, R&D Director of Huatian Technology Xi'anCo., Ltd.

14:30-14:50

未来封装解决方案展望

“All In One" Package - Package Solution for the Future

袁虹,奥特斯(中国)有限公司前端工程部总监

Rainbow Yuan, Front-End Engineering Director, AT&SChinaCo., Ltd.

14:50-15:10

系统级封装进化

SiP Technology Evolution

蔡瀛洲,台中硅品精密公司处长

Jensen Tsai, Director, Siliconware Precision Industries Co., Ltd.

15:10-15:30

划时代的在线存储器测试暨修复工具 - START

Innovated SRAM BIST/BISR Solution -START

张容诚,厚翼科技股份有限公司中国区销售总监

Michael Chang, Sales Director of China Region, HOY Technologies Co., Ltd.

15:30-15:50

茶歇,交流Coffee Break

15:50-16:10

人工智能时代的芯片测试解决方案

Testing Solution for Artificial Intelligence Devices

徐琨,爱德万测试(中国)管理有限公司系统支持部专家工程师

Kun Xu, Expert Engineer of System Engineering Department, Advantest (China) Co., Ltd.

16:10-16:30

射频IC芯片测试

Radio Frequency IC Testing Solution

甘秉鸿,罗德与施瓦茨(中国)科技有限公司资深产品应用专家

Binghong Gan, Product Specialist,

Rohde & Schwarz (China) Technology Co., Ltd.

16:30-16:35

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:珠海国际会展中心十字门厅

Site: Shizimen Hall, Zhuhai International Convention & Exhibition Center


20181130日,星期五

Nov 30, Friday, 2018

专题论坛(五)

Subject Forum (V)

 

地点:珠海国际会展中心四楼珠海厅2

Venue: Zhuhai Hall 2, L4, Zhuhai International Convention & Exhibition Center

 

Time

   

Contents

演讲人

Lecturer

珠海集成电路创新创业发展论坛

Zhuhai IC Innovation and Entrepreneurship Forum

主持人:珠海市科技工业和信息化局副局长刘嘉先生

Moderator: Mr. Jia Liu, Deputy Director, Zhuhai Science and Technology and Industrialization Information Bureau

09:00-09:05

介绍嘉宾

09:05-09:35

致辞

Speech

魏少军教授,中国半导体行业协会集成电路设计分会理事长

Prof. Shaojun Wei, General Director, CSIA-ICCAD

09:35-09:50

珠海市集成电路产业发展环境介绍

贺军,珠海市科技工业和信息化局局长

Jun He, Director, Zhuhai Science and Technology and Industrialization Information Bureau

09:50-10:05

 

珠海零边界集成电路有限公司

10:05-10:20

澳门大学集成电路国家重点实验室技术创新之路

模拟与混合信号超大规模集成电路国家重点实验室(澳门大学)

10:20-10:35

 

珠海艾派克微电子有限公司 

10:35-10:55

我们如何看待半导体行业在大湾区的发展前景

陈源远,珠海华金创新投资有限公司执行董事先生

10:55-11:45

圆桌论坛

12:00-13:30

自助午餐Buffet Lunch

资本与IC设计业

Capital and IC Design Industry

主持人:石溪资本合伙人中国半导体行业协会集成电路设计分会副秘书长,孙坚女士

Moderator: Ms. Jian Sun, Vice General Secretary, CSIA-ICCAD

13:30-13:50

 砥砺前行,还看今朝——深耕中国半导体产业20

Keep Forging ahead, in the Best Now - Deeply Root and Develop in China IC Industry for over 20 Years

黄庆博士,华登国际董事总经理

Dr. Hing Wong, Managing Director(MD), Walden International

13:50-14:10

新形势下对中国集成电路产业发展及投资的思考

Thoughts on the Development and Investment of China's IC Industry Under the New Situation

孙玉望,中芯聚源股权投资管理(上海)有限公司创始合伙人&总裁

Yuwang Sun, Partner & President, China Fortune-Tech Capital Co., Ltd.

14:10-14:30

集成电路设计业投资机会分析

Analysis of Investment Opportunities in IC Design Industry

孙加兴,国新风险投资管理(深圳)有限公司执行董事

Jacky SunExecutive DirectorChina Reform Venture Investment Management (Shenzhen) Ltd.

自由研讨IPO、企业并购和商业经营,产业发展缺一不可的路径

Panel – IPO, M & A and Business Operation, Integral Industry Development Way

14:30-15:30

研讨嘉宾:陈大同、孙玉望、高松涛、黄庆、孙加兴等

中国半导体行业经历了3年令人兴奋的投资高潮和良好的市场发展;时至今日,中美贸易摩擦“高烧”未退,产品市场需求增长乏力,资本市场一级二级趋于倒挂;面对资金来源、技术交流和市场发展多重不利因素的影响,我们集成电路设计行业、产业界和投资界正在思考如何应对挑战。

 

Honored Guests Dr. Datong Chen, Mr. Yuwang Sun, Mr. Songtao Gao, Dr. Hing Wong, Mr. Jiaxing Sun, etc.

 

China semiconductor industry has been experiencing 3 years' exciting investment boom and promising market development. Nowadays, the Sino-US trade frictions high fever still not down, the product market demand weak to grow, the primary and secondary capital markets upside down; Facing the multiple unfavorable factors influence including capital resource, technology communication and market development, we IC design industry and investors are considering how to face the challenges.

芯片奥林匹克IEEE国际固态电路峰会ISSCC 2019中国发布会 - 最新IC设计技术趋势

“Chip Olympic” - IEEE ISSCC 2019 China Press Conference –

Technical Trends of IC Design   

主持人:ISSCC国际技术委员会中国区代表, 余成斌 教授,IEEE 会士

Moderator: Prof. Seng-Pan (Ben) U, IEEE Fellow, ISSCC ITPC China Country Representative

15:30-15:50

注册

Registration

15:50-16:00

芯片奥林匹克IEEE国际固态电路峰会ISSCC 2019简介

Introduction of Chip Olympic IEEE ISSCC 2019

李泰成教授,ISSCC国际技术委员会远东区主席, 台湾大学

Prof. Tai-Cheng Lee, ISSCC 2018 ITPC Far East Chair, Taiwan University

16:00-16:10

ISSCC 2019远东区的技术趋势

Far East Technical Trends for ISSCC 2019

高宮真教授,ISSCC国际技术委员会远东区副主席, 日本东京大学

Prof. Makoto Takamiya, ISSCC ITPC Far East Vice-Chair, Univ. of Tokyo

16:10-16:20

ISSCC 2019中国区入选论文和发展趋势

ISSCC 2019 China Papers and Trends

余成斌教授,IEEE会士,ISSCC国际技术委员会委员及中国区代表,澳门大学和新诺普思澳门

Prof. Seng-Pan (Ben) U, IEEE Fellow, ISSCC ITPC China Country Representative, Univ. of Macau and Synopsys Macau

ISSCC 2019峰会设计领域论文亮点和点评

       ISSCC 2019国际技术委员会委员

ISSCC 2019 Subcommittee Paper Highlights

       ISSCC 2019 International Technical Program Committee (ITPC) Member

16:20-17:30

电源管理

Power Management

洪志良教授,复旦大学
Prof. Zhiliang Hong, Fudan University

模拟电路

Analog

罗文基副教授澳门大学
Prof.
Man-Kay Law, Univ. of Macau

数据转换器

Data Converters

余成斌教授,澳门大学和新诺普思澳门
Prof. Seng-Pan (Ben) U, Univ. of Macau and Synopsys Macau

数字架构和系统 / 数字电路

Digital Architecture & System / Digital Circuits

高宮真教授, 日本东京大学

Prof. Makoto Takamiya, Univ. of Tokyo

无线通讯 / 射频电路

Wireless / RF

Howard Luong教授, 香港科技大学

Prof. Howard Luong, HK Univ. of S&T

有线通讯

Wireline

李泰成教授,台湾大学

Prof. Tai-Cheng Lee, Taiwan University

存储器 / 图像, MEMS, 医疗和显示

Memory / Imagers, MEMS, Medical & Displays (IMMD)

Dr. Long Yan, 韩国三星电子

Dr. Long Yan, Samsung Electronics

前瞻技术领域

Technology Directions

麦沛然教授,澳门大学
Prof. Pui-In Mak, University of Macau

17:30-17:50

问答讨论和合影

Q&A, Group Photo

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点:珠海国际会展中心十字门厅

Site: Shizimen Hall, Zhuhai International Convention & Exhibition Center


                                           会议日程以最终现场公布为准Agenda up to final site release


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