会议日程 Agenda 2016


中国集成电路设计2016会暨

长沙集成电路产业创新发展高峰论坛

CSIA-ICCAD 2016 Annual Conference &

Changsha IC Industry Innovation and Development Summit

会议日程

Agenda

 

20161012日,星期三

October 12, Wednesday, 2016

 

地点湖南国际会展中心一楼C厅高峰论坛会议室

Venue: Top Forum Meeting Room, Hall C, 1/F, Hunan International Conference & Exhibition Center

 

 

Time

       

Contents

Opening Ceremony

主持人:长沙经济技术开发区管理委员会负责人

Moderator: Principal, Administrative Committee of Changsha National Economic & Technical Development Zone

08:30-09:00

长沙市政府领导致欢迎辞

Address, Changsha Municipal Government

中国半导体行业协会领导致辞

Address, CSIA

工业和信息化部领导致辞

Address, MIIT

湖南省政府领导致开幕词

Address, Hunan Province Government

高峰论坛

Top Forum

主持人:中国半导体行业协会集成电路设计分会秘书长  程晋格先生

Moderator: Mr. Cheng Jinge, General Secretary, CSIA-ICCAD

09:00-09:30

走向卓越~现实与奋斗之路

       中国半导体行业协会集成电路设计分会理事长  魏少军教授

Toward Excellence: the Reality and the Way to Strive

       Prof. Wei Shaojun, General Director, CSIA-ICCAD

09:30-09:45

湖南省集成电路产业发展情况

       湖南省经济和信息化委员会主任  谢超英先生

The Development Situation of IC Industry of Hunan Province

       Mr. Xie Chaoying, Director, Hunan Economic and Information Technology Commission

09:45-09:55

长沙经济技术开发区区情

       长沙经济技术开发区管理委员会负责人

Changsha National Economic & Technical Development Zone Introduction

       Principal, Administrative Committee of Changsha National Economic & Technical Development Zone

09:55-10:00

深圳IC基地长沙基地授牌仪式

Shenzhen ICC Changsha Base Opening Ceremony

10:00-10:20

如何让虚拟现实成为现实

       芯原股份有限公司董事长,总裁兼首席执行官  戴伟民博士

How to Make "Virtual Reality" a Reality

       Dr. Wayne Dai, Chairman, President and CEO, VeriSilicon Holdings Co., Ltd.

10:20-10:40

万物智能时代下的设计新方法学

       Synopsys全球副总裁,亚太区总裁  林荣坚先生

New Design Methodology at Smart Everything Era

       Mr. David Lin, Corporate Vice President and President of Asia PacificSynopsys

10:40-11:00

从物联网,深度学习到自动驾驶,看半导体的下一波浪潮

       Mentor Graphics全球副总裁,亚太区总裁  彭启煌先生

The Next Big Wave – from IoT, Deep Learning, to Autonomous Driving

       Mr. Danny Perng, Corp. Vice President, PacRim Managing Director, Mentor Graphics

11:00-11:20

瑞萨电子和日本半导体工业协会的发展战略

       瑞萨电子代表董事主席,日本半导体工业协会会长  Tetsuya Tsurumaru先生

Renesas and JSIA Strategy (Preliminary)

       Mr. Tetsuya Tsurumaru, Representative Director Chairman, Renesas Electronics Corp. and Chairman, JSIA

圆桌论坛-探讨中国集成电路设计业的机遇与挑战

Panel Discussion – Exploring Challenges and Opportunities for China

Semiconductor Industry

主持人:Cadence公司全球副总裁,石丰瑜先生

Moderator: Mr. Michael Shih, Corporate Vice President, Cadence

11:20-12:00

特邀嘉宾:

中国半导体行业协会集成电路设计分会理事长,魏少军教授

Cadence公司总裁兼CEO,陈立武先生

展讯通信董事长兼首席执行官,李力游博士

台积电(南京)总经理,罗镇球先生

ARM全球执行副总裁兼大中华区总裁,吴雄昂先生

Panelist:

Prof. Shao-jun Wei, General Director, CSIA-ICCAD

Mr. Lip-Bu Tan, President and Chief Executive Officer, Cadence

Dr. Leo Li, Chairman and Chief Executive Officer, Spreadtrum

Mr. Roger Luo, President, TSMC Nanjing

Mr. Allen Wu, EVP and President of Greater China, ARM

12:00-13:55

自助午餐 Buffet Lunch

主持人: 中国半导体行业协会IC设计分会第一副理事长  严晓浪教授

Moderator: Prof. Yan Xiaolang, Chief Vice General Director, CSIA-ICCAD

13:55-14:00

幸运抽奖Lucky Draw

14:00-14:20

合作创新

       联华电子股份有限公司副总经理/联芯集成电路副董事长  许志清先生

Innovation by Collaboration

       Mr. Michael, C C Hsu, VP/Vice Chairman, UMC

14:20-14:40

用芯共创未来

       中芯国际集成电路制造有限公司全球市场部资深副总裁  许天燊先生

Collaborate for a Bright Future with Silicon Innovation

       Mr. Sunny Hui, Senior Vice President, Worldwide Marketing, SMIC

14:40-15:00

开放创新的生态系统助力计算新时代

       ARM全球执行副总裁兼大中华区总裁  吴雄昂先生

Open Innovation Ecosystem Enabling New Era of Computing

       Mr. Allen Wu, EVP and President of Greater China, ARM

15:00-15:20

FDX掘起: FD-SOI产业蓝图

       GLOBALFOUNDRIES公司业务发展副总裁,Pankaj Mayor先生

FDX Rising: FD-SOI Roadmap for the Industry

       Mr. Pankaj Mayor, Vice President, Business Development, GLOBALFOUNDRIES

15:20-15:40

创新时代的机遇与挑战

       上海华力微电子有限公司市场部部长  杨展悌先生

Opportunities & Challenge in the Innovation Time

       Mr. James Yang, Marketing Director, Shanghai HLMC

15:40-15:55

茶歇,交流Coffee Break

15:55-16:00

幸运抽奖Lucky Draw

16:00-16:20

以物理版图为中心的解决方案,让先进工艺下的设计更加迅捷高效

       北京华大九天软件有限公司副总经理/技术总监  杨晓东先生

The Physical Layout Centric Design Solution for Advanced Technology Node

       Mr. Steve Yang, VP/CTO, Huada Empyrean Software Co., Ltd.

16:20-16:40

智能硬件需要怎样的半导体创新

       摩尔精英网络科技CEO  张竞扬先生

what does Smart Hardware want from IC industry

       Mr. JingYang JY Zhang, CEO, MooreElite Networking Technology

16:40-17:00

中关村集成电路设计园构建生态高地

       北京中关村集成电路设计园发展有限责任公司董事长  苗军先生

Zhongguancun IC Design Park Builds Up Ecosystem Chip Highland

       Mr. Miao Jun, Board Chairman, Beijing Zhongguancun ICC Co., Ltd.

17:00-17:20

极低功耗IoT设计完整解决方案

       成都锐成芯微科技股份有限公司总经理  向建军先生

Ultra-low Power Consumption Design Total Solution

       Mr. Xiang Jianjun, GM, Chengdu Analog Circuit Technology Inc.

17:20-17:40

VR及人工智能技术与传统产品的融合和机遇

       国科微电子股份有限公司 CTO  姜黎先生

       Mr. Jiang Li, CTO, GOKE Microelectronics Co., Ltd.

17:40-17:45

幸运抽奖Lucky Draw

18:30-20:30

欢迎晚宴(Cadence公司赞助)

Welcome Dinner Banquet (Sponsored by Cadence)

地点:湖南圣爵菲斯大酒店

Site: SAINT-TROPEZ Hotel Hunan


20161013日,星期四

Oct 13, Thursday, 2016

专题论坛(一)

Subject Forum (Ⅰ)

 

地点:湖南国际会展中心一楼C厅专题会场一

Venue: Subject Meeting Room I, Hall C, 1/F, Hunan International Conference & Exhibition Center

 

Time

   

Contents

演讲人

Lecturer

IPIC设计(一)

IP and IC DesignI

主持人:中国半导体行业协会集成电路设计分会副秘书长,赵丽女士

Moderator: Ms. Zhao Li, Vice General Secretary, CSIA-ICCAD

09:00-09:25

Imagination IP平台方案助力新的增长和突破

Imagination IP Platform Solution Enables New Growth and Breakthrough

进想科技(上海)有限公司公司副总裁/中国区总经理,刘国军

James Liu, Vice President & General Manager China, Imagination Technologies

09:25-09:50

整合高速硅智财的大型系统芯片设计实作

Large Scale SoC Chip Implementation with High Speed IP Integration

创意电子股份有限公司设计技术开发处处长,曾智谋

Kevin Tseng, Design Methodology Division Director, GUC

09:50-10:15

实现嵌入式系统创新的底层技术

Fundamental Technology to Enable Embedded System Innovation

ARM公司应用工程师经理,赵永超

Jason Zhao, FAE Manager, ARM

10:15-10:40

IPASIC的领航家智原 28纳米解决方案

Faraday’s 28nm HPCU Solution Driving IP & ASIC Service Innovation

智原科技股份有限公司业务行销副总经理,于德洵

Remi Yu, Vice president of Business and Marketing, Faraday Technology Corporation

10:40-11:05

Arteris Ncore 高速缓存一致性IP

Ncore Cache Coherent Interconnect

美国安通思控股有限公司技术顾问,黄继樟

Brian Huang, Solution Architect , Arteris Inc.

11:05-11:30

NeoFuse技术在16nm FinFET以及更先进制程上的演进

NeoFuse Technology Advancing into 16nm FinFET and Beyond

力旺电子研发部经理,黄柏豪

James Huang, Design Manager, eMemory

11:30-11:55

嵌入晶心 联网成金

Andes: Your IP Solutions for IoT

晶心科技股份有限公司总经理,林志明

JYH-MING F. LIN, President, Andes Technology Corporation

11:55-12:00

幸运抽奖Lucky Draw

12:00-13:30

自助午餐 Buffet Lunch

主持人:中国半导体行业协会集成电路设计分会副秘书长,刘娜女士

Moderator: Ms. Liu Na, Vice General Secretary, CSIA-ICCAD

13:30-13:55

如何在28/14纳米工艺上轻松集成芯动高速接口IP

Smooth Integration of Innosilicon Interface IP at 28/14nm

芯动科技有限公司FAE 总监,何颖

Huck He, FAE Director, Innosilicon Technology Ltd.

13:55-14:20

YoC - 云上芯片助你在IoT时代腾飞

YoC - Yun-on-Chip, the Future of IoT

杭州中天微系统有限公司副总裁,徐滔

Thomas Xu, VP, C-SKY Microsystems Co., Ltd.

14:20-14:45

YouSIP子系统助力您的产品早日上市

YouSIP Subsystem Enable Your Product Fast Time-to-Market

灿芯半导体(上海)有限公司首席技术官,庄志青

John Zhuang, CTO, Brite Semiconductor (Shanghai) Corporation

14:45-15:10

用于汽车领域的高可靠性嵌入式闪存

High Reliability Embedded Flash for Automotive Applications

Vipin Tiwari, Director, Marketing and Business Development, Silicon Storage Technology, Inc.

15:10-15:25

茶歇,交流Coffee Break

15:25-15:50

凌阳,您值得信赖的IP合作伙伴

Sunplus, Your Reliable IP Partner

凌阳科技股份有限公司工程总监,陈永光

Chen Yongguang, Enginnering Director, Sunplus Technology Co., Ltd.

15:50-16:15

一致性:SOC的新标准规范

Coherency: The New Normal in SOCs

Alex Chao, Director of Applications, NetSpeed Systems

16:15-16:40

面向神经网络的视觉DSP 定制化硬件和专用软件框架

A Neural - Network Oriented Vision DSP, Customized Hardware and Specialized Software Framework

美国思华科技有限公司FAE经理,杨晔

Luke Yang, FAE Manager, CEVA Inc.

16:40-17:05

人工智能芯片的架构与设计特点

The Architecture and Features of AI-Application Chips

无锡华大国奇科技有限公司总裁,谷建余

Gu Jianyu, President, Qualchip Technologies, Inc.

17:05-17:10

幸运抽奖Lucky Draw

18:00-20:00

闭幕招待晚宴

Closing Reception Banquet

地点:长沙三景韦尔斯利酒店

Site: Sanjing Whiersly Hotel Changsha

 


20161013日,星期四

Oct 13, Thursday, 2016

专题论坛(二)

Subject Forum (Ⅱ)

 

地点:湖南国际会展中心一楼C厅专题会场二

Venue: Subject Meeting Room II, Hall C, 1/F, Hunan International Conference & Exhibition Center

 

Time

   

Contents

演讲人

Lecturer

IPIC设计(二)

IP and IC DesignII

主持人:中国半导体行业协会集成电路设计分会副秘书长,何晓宁先生

Moderator: Mr. He Xiaoning, Vice General Secretary, CSIA-ICCAD

09:00-09:25

TSMC先进工艺平台"All IP"策略和质量控制体系

TSMC All-IP Strategy and Quality Control Program for Advanced Technologies

TSMC中国业务发展技术经理,任建军

George Ren, Technical Manager, Business Development, TSMC

09:25-09:50

兼容系统的设计方法

Design Approach for Compatible System

北京芯愿景软件技术有限公司总经理,张军

James Zhang, CEO, Cellixsoft Corporation

09:50-10:15

系统层级设计方法: 架构探索与高阶合成设计

System - Level Design Methodology: Architecture Exploration & High Level Synthesis Design

宏太科技股份有限公司应用经理,王义成

Frank Wang, AE Manager, Avant Technology Inc.

10:15-10:40

开创嵌入式快闪记忆体时代新纪元

Setting New Standard in MTP

Shusaku Miyabe, GM, Business Development, Floadia Corporation

10:40-11:05

M31 Metris 标准组件库:SoC设计加速的利器

Speed Up SoC Design with M31 Metris Standard Cell Library

円星科技股份有限公司销售总监,陈丽

Lynda Chen, Sales Director, M31 Technology Corporation

11:05-11:30

视频编解码发展趋势

Video Codec Trend

芯媒半导体(上海)有限公司中国区销售总经理,王田

Tian Wang, China Country Manager, Chips&Media, Inc.

11:30-11:55

低成本高可靠性SONOS嵌入式闪存

       广泛用于MCU/SOC/Smart Card/ FPGA的解决方案

Low Cost, High Reliability SONOS Embedded Flash

       An Advanced Solution for MCU/ SOC/Smart Card/FPGA

赛普拉斯半导体技术(上海)有限公司资深经理,那炜

Na Wei, Senior Manager, Cypress Semiconductor Technology (Shanghai) Co., Ltd.

11:55-12:00

幸运抽奖Lucky Draw

12:00-13:30

自助午餐 Buffet Lunch

资本与IC设计业

Capital and IC Design Industry

主持人:中国半导体行业协会集成电路设计分会副秘书长,孙坚女士

Moderator: Ms. Sun Jian, Vice General Secretary , CSIA-ICCAD

13:30-14:00

资本联通产业,协作凝聚力量

Capital Uniting Industry, Cooperation Strengthening Power

华芯投资管理有限责任公司副总裁,高松涛

Mr. Gao Songtao, Vice President, SINO IC CAPITAL Co., Ltd.

14:00-14:30

0IPO: GigaDevice的故事和启示

From Zero to IPO: What GigaDevice Told Us?

启迪创投创始合伙人,薛军

Mr. Xue Jun, Tuspark Ventures, Founding Partner

14:30-15:00

并购狂潮下的半导体投资

SEMI Investment Under the M&A frenzy

华登国际董事总经理,黄庆

Dr. Hing Wong, Managing Director, Walden International

15:00-15:15

茶歇,交流Coffee Break

自由研讨IPO、企业并购和商业经营,产业发展缺一不可的路径

Panel – IPO, M & A and Business Operation, Integral Industry Development Way

主持人:华创投资合伙人,刘越女士

Moderator: Ms. Liu Yue, Partner, Hua-Capital Management Co., Ltd.

15:15-17:00

研讨嘉宾:魏少军、陈大同、黄庆、高松涛、薛军等

2015-2016年度,在举国半导体投资发展热潮中,中国集成电路设计行业也有了长足的发展,继紫光集团成功收购展讯锐迪科之后;清芯华创牵头收购豪威科技,武岳峰牵头收购ISSI,兆易创新成功IPO成为全体中国IC设计公司瞩目的最新焦点!

那么,下一个兆易创新会在哪里?近距离面对中国这个最让人魂系神往的资本市场,我们中国集成电路设计企业应该如何才能淡定应对?全球集成电路行业会在那个层面展开新一轮的创新竞争?

 

Honored GuestsProf. Wei Shaojun, Dr. Chen Datong, Dr. Hing Wong,

Mr. Gao Songtao, Mr. Xue Jun, etc.

 

During 2015 to 2016, under the Tide of National Semiconductor Investment and Development, China IC Design Industry has been Developing Rapidly. After Unis Group successfully Acquired Spreadtrum and RDA, Hua Capital led to Acquire Omni Vision, Summit View Capital led to Acquire ISSI, China IC Design Industry is all Focusing on Giga Device successful IPO

 

Then, Where is Next Giga Device? When closely Facing this China Charming Capital Market, How shall We China IC Design Industry Respond Calmly? What’s Next Innovation Competition for Global IC Industry?

17:00-17:05

抽奖Lucky Draw

18:00-20:00

闭幕招待晚宴

Closing Reception Banquet

地点:长沙三景韦尔斯利酒店

Site: Sanjing Whiersly Hotel Changsha

 


20161013日,星期四

Oct 13, Thursday, 2016

专题论坛(三)

Subject Forum (Ⅲ)

 

地点:湖南国际会展中心一楼C厅专题会场三

Venue: Subject Meeting Room III, Hall C, 1/F, Hunan International Conference & Exhibition Center

 

Time

   

Contents

演讲人

Lecturer

FOUNDRY与工艺技术

Foundry and Manufacturing Process Technology

主持人:中国半导体行业协会集成电路设计分会副秘书长,王志华教授

Moderator: Prof. Wang Zhihua, Vice General Secretary, CSIA-ICCAD

09:00-09:25

TSMC先进工艺全面支持四大成长领域

TSMC Advanced Technology Targeting Four Strategic Markets

TSMC中国业务发展客户经理,林锦瑜

Sarah Lin, Account Manager, Business Development, TSMC

09:25-09:50

迈向一个全新的汽车世代

Driving Towards a Brave New Automotive World

联华电子股份有限公司市场营销资深处长,黄克勤

Keh-Ching Huang, Senior Director of Corporate Marketing, UMC

09:50-10:15

FDX:低功耗,低成本具有广泛应用的工艺技术

FDX: The Low Power, Low Cost and Wide Application Technology

格罗方德半导体科技(上海)有限公司,陈建良

John Chen, Director of Technology & Integration, GLOBALFOUNDRIES

10:15-10:40

拓展工艺,助力共赢

Innovative Platforms Strive Collaborative Success

中芯国际集成电路制造有限公司产品市场总监,史望澄

David Shih, Director, Product Marketing, SMIC

10:40-11:05

华力微电子平台及特色工艺技术

HLMC Platform and Specialty Technology

上海华力微电子有限公司研发一部总监,邵华

Chris Shao, Senior Director of TD, HLMC

11:05-11:30

为碎片化物联网SOC应运而生的MIFS特色工艺

MIFS Special Technology for Fragmental IoT SOC

三重富士通半导体股份有限公司产品部总监,谢杰

Jacky Xie, Director Product Management, MIE Fujitsu Semiconductor Limited

11:30-11:55

Why Choose Dongbu HiTek for BCD Technology ?

Kim Keun Ho, Taiwan Office Technology Marketing, Dongbu HiTek

11:55-12:00

幸运抽奖Lucky Draw

12:00-13:30

自助午餐 Buffet Lunch

主持人:中国半导体行业协会集成电路设计分会副秘书长,徐秀法先生

Moderator: Mr. Xu Xiufa, Vice General Secretary, CSIA-ICCAD

13:30-13:55

三安集成的化合物半导体制造技术

Sanan-IC GaAs Compound Semiconductor Manufacture Technology

厦门市三安集成电路有限公司器件工程处处长,李斌

Li Bin, Director of Device Engineering, Xiamen Sanan Integrated Circuit Co., Ltd.

13:55-14:20

模拟IC的快速发展及技术趋势

The Explosive Growth of RF ICs and Related Product/Technology Trends

TowerJazz中国区总经理,秦磊

Qin Lei, China Country Manager, TowerJazz

14:20-14:45

聚焦新业态,引领发展

Innovation and Development for IC Emerging Applications

上海华虹宏力半导体制造有限公司销售与客户支持副总裁,陈卫

Tony Chen, Vice President of Sales and Customer Support, Shanghai Huahong Grace Semiconductor Manufacturing Corporation

14:45-15:10

先进的光掩模产线建设以迎合中国快速成长的半导体市场

Advanced Photomask and Infrastructure for China Rapid Growing Semiconductor Market

凸版光罩股份有限公司亚太区业务副总经理,郭天全

Arthur Kuo, Ph. D, VP of TPI AP Sales, Toppan Photomasks, Inc.

15:10-15:25

茶歇,交流Coffee Break

15:25-15:50

武汉新芯55纳米技术可定制化物联网工艺平台

XMC 55nm Technology Customized IoT Platform

武汉新芯集成电路制造有限公司市场部资深总监,董乃琦

Nigel Doong, Marketing Senior Manager, XMC

15:50-16:15

领先初创公司和杰出研发团队需要的半导体工艺和服务

Technologies and Services Required by Top Start-ups and Outstanding R&D Groups

MOSIS专业流片服务业务拓展经理,袁泉

YuanQuan, Business Development Manager, The MOSIS Service

16:15-16:40

针对高功率器件的新型环氧塑封料与银胶研究开发

Innovative EMC & Ag Paste Development for Power Device

苏州住友电木有限公司研发副部长,卢世欢

Lu Shihuan, R&D Deputy Senior Manager, Sumitomo Bakelite (Suzhou) Co., Ltd.

16:40-16:45

幸运抽奖Lucky Draw

18:00-20:00

闭幕招待晚宴

Closing Reception Banquet

地点:长沙三景韦尔斯利酒店

Site: Sanjing Whiersly Hotel Changsha


20161013日,星期四

Oct 13, Thursday, 2016

专题论坛(四)

Subject Forum (Ⅳ)

 

地点:湖南国际会展中心一楼C厅专题会场四

Venue: Subject Meeting Room IV, Hall C, 1/F, Hunan International Conference & Exhibition Center

 

Time

   

Contents

演讲人

Lecturer

IC设计与封装测试

IC Design and Packaging & Testing

主持人:中国半导体行业协会集成电路设计分会副理事长,高松涛先生

Moderator: Mr. Gao Songtao, Vice General Director, CSIA-ICCAD

09:00-09:25

工业4.0  半导体封测互联互通新格局

Fully Interconnected New Architecture in Semiconductor Assembly & Test Industry

普迪飞半导体中国区总经理,房华

Fang Hua, GM, VP, PDF Solutions

09:25-09:50

封装技术发展之通往互联世界

Package Technology Toward the Connected World

安靠封装测试资深总监,李吕祝

John Lee, Sr. Director, Amkor Technology

09:50-10:15

封装的异质整合和系统级封装解决方案

Package Solution for Heterogeneous Integration and System in Package

日月光集团工程整合处资深技术处长,冯耀信

Oscar Feng, Senior Technical Director, Central Engineering Integration, ASE Group

10:15-10:40

Cadence Sigrity自动化SI/PI仿真分析平台加速IC-PKG-PCB互连验证

Cadence Sigrity Automatic SI/PI Analysis Platform to Accelerate IC-PKG-PCB Interconnection Verification

展讯通讯(上海)有限公司硬件部高级副总裁,罗强

John Rowland, SVP of Hardware Engineering, Spreadtrum Inc.

10:40-11:05

R&S先进IC测试方案,全面助力万物互连时代的IC设计应用

R&S Advanced IC Test Solution - Fully Support the IC Design in IoT Era

罗德与施瓦茨(中国)科技有限公司业务发展主管,杨洪文

Yang Hongwen, BD Supervisor, Rohde & Schwarz (China) Technology Co., Ltd.

11:05-11:30

晶圆级先进封装关键工艺和发展

Key Process R&D in Wafer Level Advanced Packaging

华进半导体封装先导技术研发中心有限公司市场部部长,周鸣昊

Zhou Minghao, Marketing Manager, National Center for Advanced Packaging Co., Ltd.

11:30-11:55

全方位测试解决方案

Comprehensive Semiconductor Testing Solution

京元电子股份有限公司/京隆科技(苏州)有限公司/苏州震坤科技有限公司总经理,刘安炫

Liu Anhsuan, President, KYEC Yuan Electronics Co., Ltd. / King Long Technology (Suzhou) Co., Ltd. / Suzhou Zhen Kun Technology Co., Ltd.

11:55-12:00

幸运抽奖Lucky Draw

12:00-13:30

自助午餐Buffet Lunch

主持人:中国半导体行业协会集成电路设计分会副秘书长,赵建忠教授

Moderator: Prof. Zhao Jianzhong, Vice General Secretary, CSIA-ICCAD

13:30-13:55

面向芯片的快速测试程序自动开发系统

Device Oriented Fast Test Program Auto-Generation System

爱德万测试(中国)管理有限公司高级专家工程师,孙志民

Sun Zhimin, Senior Expert Engineer, Advantest (China) Co., Ltd.

13:55-14:20

华天科技新型硅基板扇出技术研发进展

Progress of Huatian eSiFOTM (Embedded Si Fan-Out) Technology

华天科技(昆山)有限公司技术总监,于大全

Yu Daquan, Technical Director, Hua Tian Technology (kuanshan) Co., Ltd. 

14:20-14:45

TCB-NCP/MUF等技术为基础的高密度系统集成封装量产技术开发与产业化

High Volume Manufacturing Methodology Development for High Density Sip (System in Package) Using TCB-NCP/MUF Technology

南通富士通微电子股份有限公司部长,王鹏

Wang Peng, Director, Nantong Fujitsu Microelectronics Co., Ltd.

14:45-15:10

悬臂探针卡和垂直探针卡的应用研讨

Cantilever Probe Card and Vertical Probe Card

深圳市道格特科技有限公司副总经理,李忠民

Tommy Lee, VP, Shenzhen Doctor Technology Co., Ltd.

15:10-15:25

茶歇,交流Coffee Break

15:25-15:50

从实验室到量产 物联网背景下灵活通用的测试解决方案

From Lab to Production – One Flexible Test Platform for All in IoT Era

美国国家仪器有限公司中国区自动化测试市场经理,陈宇睿

Chen Yurui, Technical Marketing Manager, Automated Test, China/HK, National Instruments

15:50-16:15

新市场、新应用、新需求 长电科技先进封装技术解决方案

JCET Packaging Solutions for Emerging Market

江苏长电科技股份有限公司工程中心副总,包旭升

Anderson Bao, VP of Tech Center, JCET

16:15-16:20

幸运抽奖Lucky Draw

18:00-20:00

闭幕招待晚宴

Closing Reception Banquet

地点:长沙三景韦尔斯利酒店

Site: Sanjing Whiersly Hotel Changsha

 


20161013日,星期四

Oct 13, Thursday, 2016

专题论坛(五)

Subject Forum (V)

 

地点:湖南国际会展中心一楼C厅专题会场五

Venue: Subject Meeting Room V, Hall C, 1/F, Hunan International Conference & Exhibition Center

 

Time

   

Contents

演讲人

Lecturer

EDAIPIC设计服务

EDA, IP and IC Design Service

主持人:中国半导体行业协会集成电路设计分会副理事长,周生明先生

Moderator: Mr. Zhou Shengming, Vice General Director, CSIA-ICCAD

09:00-09:25

Cadence RTLSignoff的先进制程的数字解决方案

Advanced Node Digital Implementation Using Cadence RTL to Sign-Off Solution

Cadence 公司数字集成电路自动化设计总监,刘淼

Liu Miao, Product Engineering Group Director, Cadence Design System, Inc.

09:25-09:50

创新的深度学习视觉处理器架构

An Innovative Deep Learning Vision Processor Architecture

芯原股份有限公司执行副总裁/IP事业部总经理/首席战略官,戴伟进

Dai Weijin, Executive Vice President and General Manager of Intellectual Property Division, Chief Strategy Officer, VeriSilicon Holdings Co., Ltd.

09:50-10:15

Veloce将硬件加速器带入应用新领域

Veloce Apps Brings Emulation into a New Era

Mentor Graphics设计验证和加速器技术经理,张俊

Justin Zhang, Emulation Technical Program Manager, Mentor Graphics

10:15-10:40

TSMC先进工艺EDA解决方案

TSMC Advanced Technology EDA Solutions

TSMC中国业务发展技术经理,龚毅

David Gong, Technical Manager, Business Development, TSMC

10:40-11:05

Synopsys lP加速方案

Synopsys lP Accelerated Initiative

Synopsys资深技术支持顾问,阳晔

Jeff Yang, Senior Field Application Engineer, Synopsys

11:05-11:30

新一代高性能并行电路仿真解决方案

New Generation of High Performance Parallel Simulation Solutions

北京华大九天软件有限公司产品与技术支持中心总监,董森华

Dong Senhua, Director of Product and Application Center, Huada Empyrean Software Co., Ltd.

11:30-11:55

更快、更精准、更简便 来自中国的射频芯片设计EDAIP方案

“Faster, Accurate, User-Friendly” - An Advanced RF IC EDA and IP Solution from China 

苏州芯禾电子科技有限公司创始人/工程副总裁,代文亮

Dai Wenliang, Founder VP Engineering, Xpeedic Technology

11:55-12:00

幸运抽奖Lucky Draw

12:00-13:30

自助午餐Buffet Lunch

主持人:中国半导体行业协会集成电路设计分会副秘书长,李军先生

Moderator: Mr. Li Jun, Vice General Secretary, CSIA-ICCAD

13:30-13:55

IC设计共享经济

Sharing Economy of IC Designs

上海微技术工业研究院设计服务总监,孙新泰

Stan Sun, Design Service Director, Shanghai Industrial μTechnology Research Institute (SITRI) 

13:55-14:20

设计与加工协同技术:构建虚拟代工厂

Manufacture Aware Design Technologies: Key Element to Build Up Virtual Fabrication Platform

中国科学院EDA中心主任,陈岚

Chen Lan, Director, EDA Center of Chinese Academy of Sciences

14:20-14:45

全流程定制服务

Turn-Key Design Service

北京芯诣世纪科技有限公司市场总监,李伟

Andrew Li, Marketing Director,  StarChip Technologies, Inc.

14:45-15:10

高速ADC/DAC的测试方法

The Measurement of High-speed ADC/DAC

是德科技大中华区市场部经理,任彦楠

Ren Yannan, Marketing Development Manager, Keysight Technologies

15:10-15:25

茶歇,交流Coffee Break

15:25-15:50

IC 新生态下的企业信息安全

Information Security in the New Semiconductor Ecosystem

北京志翔科技股份有限公司总经理,蒋天仪

Jiang Tianyi, CEO, Zshield Inc.

15:50-16:15

中科睿微Wi-Fi+:创新物联网芯片平台解决方案

Casemic Wi-Fi+: Innovation IoT IC Platform Solution

中科睿微电子科技有限公司总经理,吴斌

Wu Bin, GM, Casemic Electronic Technology Co., Ltd.

16:15-16:40

国产通用处理器促进经济转型

Local General CPU Promote the Economic Transformation

上海兆芯集成电路有限公司市场行销总监,何英松

Edward He, Marketing Director, Shanghai Zhaoxin Semiconductor Co., Ltd.

16:40-17:05

大数据平台在芯片设计中的创新性应用 - SeaHawk

ANSYS Big Data Architecture Using In-design Analysis - SeaHawk

ANSYS公司高级应用工程师,赵常

Zhao Chang, Lead Application Engineer, ANSYS Shanghai

17:05-17:10

幸运抽奖Lucky Draw

18:00-20:00

闭幕招待晚宴

Closing Reception Banquet

地点:长沙三景韦尔斯利酒店

Site: Sanjing Whiersly Hotel Changsha

 

                                             会议日程以最终现场公布为准

Agenda up to final site release.


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