会议日程Agenda

议程 Agenda

(时间:2018822-23日,地点:南京明发珍珠泉大酒店)

(一)高峰论坛:趋势、机遇与挑战

(I) Top Forum: Trend, Opportunity and Challenge

 

  时间:822日上午

    Time: Morning, Aug. 22

  地点:南京明发珍珠泉大酒店,三楼定山厅

    Venue: Dingshan Hall, 3F, Mingfa Pearl Spring Hotel Nanjing

 主持人:刘迪军,中国通信学会集成电路专委会主任委员

    Moderator: Dijun Liu, Directorship Member of the CIC-IC

时间 Time

演讲题目Topic / 演讲人 Speaker

08:30-08:50

签到 Registration

08:50-09:00

    南京市领导致辞

-        Address by Leaders of Nanjing City

    工信部致辞

-        Address by of Ministry of Industry and Information Technology

—  中国通信学会常务副理事长兼秘书长张延川致辞

-        Address by Yanchuan Zhang, Secretary - General and Vice Chairman of China Institute of Communications

09:00-09:40

芯片架构创新新时代

-        A New Era of Chip Architecture Innovation

    许居衍, 中国工程院院士

-        Juyan Xu, Academician of Chinese Academy of Engineering

09:40-10:00

机遇与挑战:LTE-V2X车联网技术及应用推动智能网联汽车发展

-        Opportunities and Challenges: LTE-V2X Technology and Applications promote ICV Development

      陈山枝,中国信息通信科技集团有限公司副总经理,无线移动通信国家重点实验室主任,新一代移动通信无线网络与芯片技术国家工程实验室理事长及主任

-        Shanzhi Chen, Vice president of China Information and Communication Technology Group Co., Ltd.,  Director of State Key Laboratory of Wireless Mobile Communications, the Chairman and Director of State Engineering Laboratory of New Generation Mobile Communication Wireless Network and Chip Technology

10:00-10:20

先进存储器技术

-        Advanced Technologies for Memory

      张卫,教育部长江特批教授,复旦大学微电子学院执行院长 

-        Wei Zhang, Changjiang Scholarship Professor of Education Ministry of China, Executive Dean of School of Microelectronics, Fudan University

10:20-10:40

共创万物互联的智能化时代

-        Innovate an Intelligent Era of IOE

      礼宾,Synopsys中国区副总经理

-        Alex Wang, Deputy Country Manager, Synopsys China

10:40-11:00

智能、通信与EDA

-        Intelligence, Communication and EDA

      刘矛,Cadence资深市场总监,南京凯鼎电子科技有限公司副总裁

-        Mao Liu, Senior Marketing Director and Vice President, Cadence

11:00-11:20

通信集成电路发展中的EDA新机遇

-        New EDA Opportunities in the Development of Communication ICs

      吾立峰,华大九天高级副总经理,南京九芯电子科技有限公司总经理

-        Kevin Wu, Senior VP, Empyrean

11:20-11:40

突破计算创新,共赢数据未来

-        Winning the Data Future through Computing Innovation

      宋继强,英特尔中国研究院院长

-        Jiqiang Song, Managing Director, Intel Labs China

11:40-12:00

以新兴市场为牵引,推动国内集成电路产业创新

-        Promoting Innovation in the Domestic IC Industry by Emerging Markets

      李珂,工信部赛迪研究院赛迪顾问副总裁

-        Ke Li, Consultant and Vice President of CCID Research Institute, the Ministry of Industry and Information Technology

12:00-13:30

自助午餐 Lunch Buffet


(二)IC设计与应用

(II) IC Design and Application

 

  时间:822日下午

    Time: Afternoon, Aug. 22

  地点:南京明发珍珠泉大酒店,三楼定山厅

    Venue: Dingshan Hall, 3F, Mingfa Pearl Spring Hotel Nanjing

 主持人:王志华教授,中国通信学会集成电路专委会副主任委员,清华大学教授

    Moderator: Prof. Zhihua Wang, the Deputy Directorship Member of the CIC-IC, Professor of Tsinghua University

时间 Time

演讲题目Topic / 演讲人 Speaker

专题一:5G与通信集成电路

Subject I: 5G and Communications IC

13:30-13:50

无处不在的集成电路——兼谈集成电路产品引领医疗器械创新

-        The Ubiquitous Integrated Circuit – Innovation of Medical Devices Leading by Integrated Circuit

      王志华,清华大学教授、IEEE 会士

-        Zhihua Wang, Professor of Tsinghua University, Fellow IEEE

13:50-14:10

近在咫尺:让 5G 梦想变为现实

-        Around the corner: Transforming 5G from Concept into Reality

      郑纪峰,是德科技(中国) 有限公司大中华区

市场总经理

-        Jifeng Zheng, General Manager, Greater China Marketing, Keysight Technologies

14:10-14:30

解决5G智能手机中的射频复杂性

-        Solving 5G Smartphone RF Complexity

      江雄,Qorvo中国区手机事业部销售总监

-        Locker Jiang, Sales Director, Qorvo China Mobile

14:30-14:50

5G前传网络芯片设计挑战与方法

-        Challenges and Solutions of 5G Front-Haul Networks ASIC Design

      张睿,武汉飞思灵微电子技术有限公司逻辑开发专项经理

-        Rui Zhang, DV Director, Wuhan Fisilink Microelectronics Technology Co., Ltd.

14:50-15:10

通信与导航融合给IC带来的机遇与挑战

-        Opportunities and Challenges: IC Design of Communications and Navigation Integration

      邓中亮,北京邮电大学教授

-        Zhongliang Deng, Professor, Beijing University of Posts and Telecommunications

15:10-15:30

茶歇与交流 Tea Break & Talk

专题二:IC创新与应用

Subject II: IC Innovation and Application

15:30-15:50

动态可重构计算芯片

-        Dynamic Reconfigurable Computing Processor

      刘雷波,清华大学微电子所教授、博士生导师

-        Leibo Liu, Professor, Institute of Microelectronics, Tsinghua University

15:50-16:10

开放赋能:Arm人工智能解决方案

-        Arm AI Solution Enable Device AI

      杨磊Arm China AI产品经理

-        Alvin Yang, Product Manager, Arm China

16:10-16:30

神经调控芯片与系统

-        Chips and Systems for Neural Modulation

      王志功,教育部长江学者特聘教授,国家杰出青年基金获得者,东南大学射频与光电集成电路研究所所长

-        Zhigong Wang, Changjiang Scholarship Professor of Education Ministry of China, Winner of the National Outstanding Youth Fund, Director of the Institute of RF- & OE-ICs of Southeast University

16:30-16:50

柔性透明半导体器件和芯片技术

-        Flexible and Transparent Semiconductor Devices and Chip Technologies

    辛倩,山东大学微电子学院纳电子工程研究中心副主任,副研究员

-        Qian Xin, Associate Professor, Nanoelectronics Engineering Center, School of Microelectronics, Shandong University.

16:50-18:30

参观南京集成电路产业服务中心

Visit Nanjing IC Industry Service Center

18:30-20:00

交流晚宴 Communication Dinner

  

(三)智能中国芯

Smart Chinese Chips

 

  时间:823日上午

    Time: Morning, Aug. 23

  地点:南京明发珍珠泉大酒店,三楼定山厅

    Venue: Dingshan Hall, 3F, Mingfa Pearl Spring Hotel Nanjing

 主持人:邓中亮教授,中国通信学会集成电路专委会副主任委员,北京邮电大学科学技术发展研究院常务副院长

    Moderator: Zhongliang Deng, Professor / PhD Supervisor, the Deputy Directorship Member of the CIC-IC,                            Beijing University of Posts and Telecommunications

时间 Time

演讲题目Topic / 演讲人 Speaker

09:00-09:20

FPGA中国芯在当前严峻形势下的机遇与挑战

-        The Opportunities and Challenges of “Chinese Chips” FPGA in the Current Grim Situation

    包朝伟,深圳市紫光同创电子有限公司总裁助理兼营销中心总经理

-        Chaowei Bao, Assistant President and General Manager of Marketing Center, Shenzhen Pango Microsystems Co., Ltd.

09:20-09:40

FPGA与人工智能

-        FPGA in Artificial Intelligence

    陈利光安路信息科技有限公司副总经理

-        Liguang Chen, VP, Anlogic Inc.

09:40-10:00

面向物联网的人工智能芯片及其开源解决方案

-        AI-Chip for IoT & the Open Source Solutions Based on It

    李霄寒,云知声联合创始人

-        XiaoHan Li ,Co-Funder, Unisound

10:00-10:20

中国存储器产业崛起之路探索

-        Exploring the Road to the Rise of China's Memory Industry

    苏志强,北京兆易创新科技股份有限公司战略市场部总监

-        Zhiqiang Su, Director of Strategic Marketing ,Gigadevice Semiconductor Inc.

10:20-10:40

汽车防撞雷达芯片与系统

-      Integrated Circuits (IC) and System for Automotive Radar

杨守军,厦门市首批“双百计划”领军型创业人才,厦门意行半导体科技有限公司总经理、技术总监

-        Shoujun Yang, A Leading Entrepreneurial Talent of the First Batch of “Hundreds of Talents Plan” in Xiamen, Technical Director and General Manager of Xiamen IMSEMI Semiconductor Technology Co., Ltd.

10:40-11:00

茶歇与交流 Tea Break & Talk

11:00-12:00

圆桌论坛:同铸中国芯、共圆中国梦

— 中国芯产业发展之路

 

主持人:时龙兴教授,国家专用集成电路系统工程技术研究中心主任

中兴事件引发我们对自主芯片发展的思考,目前我国尚未形成适合芯片产业发展的创新体系、激励机制和市场化调配资源的手段,中国的集成电路产业要达到自主可控,还有相当长的路要走。

如何构建完善的产业体系、激励机制、全球化知识产权体系,推进中国芯片产业自主可控、持续健康发展,邀请行业专家、企业家围绕以下内容展开探讨。

1、 人才培养

2、 自主技术创新

3、 市场资源调配

4、 产业与资本

12:00-13:30

自助午餐Lunch Buffet

    注:最终议程以会议当天发布为准。

          Note: The final agenda is subject to the on-site announcement.


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