11
会议日程

中国集成电路设计创新大会暨IC应用博览会

China IC Design Innovation Conference and IC Application Expo

ICDIA 2021

议程AGENDA

2021715日,星期四

Thursday,July 15, 2021

高峰论坛Top Forum


    地点苏州狮山国际会议中心狮山B

       Venue: Shishan Hall B, Suzhou Shishan International Convention Center

时间 Time

内容  Contents

Opening Ceremony

主持人:苏州市高新区领导(拟)

Moderator: Leader of SuZhou

08:00-08:30

江苏省及苏州市领导致辞

Address, Leaders of Jiangsu and Suzhou

国家部委领导致辞Ministries

Address, Leaders of of National

中国集成电路设计创新联盟理事长魏少军教授致辞

Address, Prof. Shaojun Wei, General Director, ICDIA

中国集成电路设计创新联盟长三角联络处揭牌

Opening of the Liaison Office of Yangtze River Delta

高峰论坛

Top Forum

主持人:程晋格,中国集成电路设计创新联盟秘书长

Moderator: Jinge Cheng, General Secretary, ICDIA

08:30-08:50

中国集成电路设计产业创新发展

Innovation and Development of Integrated Circuit Design Industry in China

  时龙兴教授,中国集成电路设计创新联盟专家组组长

-        Prof. Longxing Shi, The head of the ICDIA Expert Group

08:50-09:10

中国集成电路产业创新发展路径思考

Thinking on the Innovation and Development Path of China's Integrated Circuit Industry

      叶甜春,国家02专项技术总师、中国集成电路创新联盟副理事长兼秘书长

-        Tianchun Ye, Leader of the Panel of National Major Program 02 of Science and Technology, Secretary General of China Integrated Circuit Innovation Alliance

09:10-09:30

核心技术的自主创新是集成电路产业高质量发展的关键

Independent Innovation in Core Technologies are the Key Components to the High-quality Development of the IC Industry

      严晓浪教授,国家“芯火”双创基地建设专家组组长、国家示范性微电子学院建设专家组组长

-        Prof. Xiaolang Yan, the Head of the National "Xin Huo" Mass Entrepreneurship and Innovation Base Construction Expert Group, the Head of the National Demonstration Microelectronics Institute Construction Expert Group

09:30-09:50

关于集成电路产业在后摩尔时代的思考

Thoughts about IC Industry in Post-Moore’s Era

      吴汉明,中国工程院院士、浙江大学微纳电子学院院长

-        Hanming Wu, Academician, Academy of Chinese Engineering. Dean of the School of Micro-nano Electronics, Zhejiang University

09:50-10:10

如何让自研芯片成为我国系统整机产品的创新驱动力?

How to Make Self-research Chips Become the Innovation Force of System Products in China

      杜晓黎博士,国家01专项技术副总师、联想研究院副院长

Dr. Du Xiaoli,Vice President of Lenovo Research of Lenovo Group

10:10-10:30

芯粒(Chiplet) 的机遇和挑战

Opportunities and Challenges of Chiplet

      戴伟民博士,芯原股份创始人、董事长兼总裁

-        Dr. Wayne Dai, Chairman, President and CEO, VeriSilicon

10:30-10:50

自主EDA发展之路

The Development Path of China EDA Industry

      刘伟平,北京华大九天科技股份有限公司董事长

-        Weiping Liu, Chairman of the Board, Empyrean Technology Co., Ltd.

10:50-11:10

生态承载者的责任

The Responsibility of Backbone in Bigital World

      楚庆,紫光展锐科技有限公司CEO

-        Steve Chu, CEO, UNISOC Technologies Inc.

11:10-11:30

多种产业形态的半导体芯片发展模式

Development Mode of Semiconductor Chip in a Variety of Industry Form 陈向东,杭州士兰微电子股份有限公司董事长

-        Xiangdong Chen, Chairman of the Board, Hangzhou Silan Microelectronics Co., Ltd.

11:30-11:50

后摩尔时代封测技术的机遇与挑战

Opportunities and Challenges of Packaging and Testing Technology in the Post-Moore Era

      曹立强,中国集成电路封测创新联盟副理事长兼常务秘书长、中科院微电子所副所长

-        Liqiang Cao, Vice Chairman and Executive Secretary of CAAT, Deputy Director of the Institute of Microelectronics, CAS

11:50-12:10

协同创新构筑产业链基础能力

Collaborative innovation to build the basic capabilities of the industrial chain

      周玉梅,中国集成电路创新联盟技术创新推进组组长

-        Yumei Zhou, Technology Innovation Promotion Group of ICIA

12:10-13:30

自助午餐 Buffet Lunch

创新峰会

Innovation summit

主持人:陈军宁教授,中国集成电路设计创新联盟专家组专家

Moderator: Prof. Junning Chen, Expert group expert, ICDIA

13:30-13:50

智能家电集成电路应用展望

The Prospect of Integrated Circuit used in Smart home appliances

      徐鸿,中国家用电器研究院总工程师

Xu Hong, Chief Engineer, CHEARI (China Household Electric Appliance Research Institute)

13:50-14:10

高性能GPU的机遇与挑战

Opportunities and Challenges of High-Performance GPU

      陈维良,沐曦集成电路(上海)有限公司CEO

-        William Chen, CEO, MetaX Integrated Circuits (Shanghai) Co., Ltd.

14:10-14:30

如何以IP创新赋能产业数字化,应对行业发展所面临的机遇与挑战

How Does the Semiconductor Industry Realize Industrial Digitalization through IP Innovation to Meet Opportunities and Challenges in the Industry

      李孟璋,芯耀辉科技有限公司CTO

-        MC Lee, CTO, Akrostar Technology Co., Ltd.

14:30-14:50

下一代国产高性能GPUIC创新应用的支持

The Support of Next Generation Domestic High Performance for IC Innovation and Application

      何颖,芯动科技(珠海)有限公司VP&CTO

-        Ying He, VP/CTO, INNOSILICON Technology Ltd.

14:50-15:10

汽车智能芯片助力共建开放产业生态

Automotive Smart Processors Help Nuild an Open Industry Ecosystem

      黄畅博士,地平线联合创始人&CTO

-        Ph.D. Chang Huang, Co-founder & CTO, Horizon Robotics

15:10-15:30

茶歇,交流 Coffee Break

15:30-15:50

芯来科技RISC-V处理器IP家族再添高性能 [多核]新成员

Nuclei Launching the High-Performance Multi-Core RISC-V CPU IP

      彭剑英,芯来科技执行总裁

-        Jianying Peng, Executive President, Nuclei

15:50-16:10

后摩尔时代EDA工具的机遇与挑战

Opportunities and Challenges of EDA Tools in Post-Moore’s Era

      贺青,杭州行芯科技有限公司CEO

-        Qing He, CEO, Hangzhou Phlexing Technology Co., Ltd.

16:10-16:30

Labless的前世今生

Labless- Past Present & Future

      李晓旻,胜科纳米(苏州)股份有限公司CEO

-        Xiaomin Li, CEO, Wintech-Nano (Suzhou) Co., Ltd.

16:30-17:20

圆桌论坛:创新、自立—本土化需求与自主芯片的机遇

Panel Discussion: Innovation, Self-sufficient - local demands and independent IC opportunities

1.创新挑战与关键技术突破

Innovation challenge and Key technology breach

2.应用牵引,芯机联动与本土化需求

Application traction, IC and System linkage and local demand

3.缺“芯”未来研判与应对策略

Lack of ICs Future study, judge and solution strategy

4. 创新思考:人才、技术、资本

Innovation thinking: Talent, Technology, Capital

5.新格局下全球半导体产业合作机遇

Under the new situation, Global semiconductor industry cooperation opportunities

18:30-20:30

欢迎晚宴  Welcome Dinner Banquet

地点:苏州狮山国际会议中心狮山厅B

Venue: Shishan Hall B, Suzhou Shishan International Convention Center



2021715日下午,星期四

Thursday, July 15 , 2021

汽车芯片供需对接会

 (闭门会议,定向邀请汽车芯片、整车、零部件企业参与)

时间:2021716日上午,星期五

地点: 苏州狮山国际会议中心2号会议室

主持人:原诚寅,国家新能源汽车技术创新中心主任/总经理,中国汽车芯片产业创新战略联盟秘书长



2021716日,星期五

Friday, July 16, 2021

IC设计创新论坛

IC Design Innovation Forum

 

    地点:苏州狮山国际会议中心2号会议室

       Venue: Meeting Room 2, Suzhou Shishan International Convention Center

 

Time

   

Contents

演讲人

Lecturer

主持人:周玉梅,中国集成电路设计创新联盟副理事长

Moderator: Yumei Zhou, Vice General Director, ICDIA

09:00-09:20

设计创新的地平线

Horizon of Design for Innovation

谭磊,设计创新联盟专家组专家、圣邦微电子(北京)股份有限公司副总经理

Taylor Tan, VP, SG Micro Corp

09:20-09:40

芯动科技——国产一站式高速接口IP及高性能计算芯片定制解决方案

INNOSILICON——Domestic One Stop High Speed Interface IP and High Performance Computing Chip Customization Solution

高专,芯动科技(珠海)有限公司技术总监

Zhuan Gao, Technical Director, INNOSILICON Technology Ltd.

09:40-10:00

差异化DDR IP技术助力应用创新需求

Differentiated DDR IP Technology Enables Applications Innovation

刘好朋,芯耀辉科技有限公司技术支持总监

Haopeng Liu, Technical Support Director, Akrostar Technology Co., Ltd.

10:00-10:20

基于芯来RISC- V处理器打造专属应用解决方案

Customized SoC Subsystem Solution Based on Nuclei's RISC-V Processor IPs

李海忠,芯来科技处理器解决方案架构师

Haizhong Li, Processor Solution Architect

10:20-10:40

私有云在IC验证中的应用

Private Cloud in IC Verification

王登宝,华桑电子无锡分公司总经理兼技术总监

Dengbao Wang, CTO, Newtouch Electronics

10:40-11:00

先进工艺下全芯片寄生参数提取EDA解决方案

EDA Solution for Full Chip Parasitic Parameter Extraction at Advanced Process Nodes

崔晓亮,杭州行芯科技有限公司产品总监

Xiaoliang Cui, Product Director, Hangzhou Phlexing Technology Co., Ltd.

11:00-11:20

智能高算力驱动IC设计仿真效率革命

IC Simulation Efficiency Revolution Driven by Intelligent High Computing Power

张贺,中科芯云微电子科技有限公司 技术总监、中国科学院微电子研究所 高级工程师

He Zhang, CTO, Chip Cloud Microelectronics Technology Co., Ltd., Senior Engineer, Institute of Microelectronics of Chinese Academy of Sciences

11:20-11:40

探索芯片智能验证

Exploration of SoC Smart Verification

黄武,芯华章科技产品营销总监

David Hwang, Product Marketing Director of X-EPIC

11:40-12:00

汽车电子系统架构设计案例分享:先进驾驶辅助系统、电池管理、功能安全

Automotive Software and E/E Architecture Design Case Study - ADAS, Battery Management, FuSa.

陈正坚,上海国微思尔芯技术股份有限公司资深技术市场总监

Ken Chen, Senior Director of Technical Marketing Department

12:00-13:30

自助午餐 Buffet Lunch

主持人:樊晓华, 中国集成电路设计创新联盟副秘书长

Moderator: Xiaohua Fan, Vice General Secretary, ICDIA

13:30-13:50

GPU+AI赋能数字化升级

GPU + AI Enabling Digital Upgrade

时昕,Imagination中国区战略市场和生态副总

Tim Shi, Imagination Technologies

13:50-14:10

志翔核“芯”安全,为IC企业构建安全高效的研发环境

ZShieldSecure the Workplace for IC Company

蒋天仪,北京志翔科技股份有限公司 联合创始人

Tianyi Jiang, Co-Founder, Zshield Inc.

14:10-14:30

智能图像解决方案 - 智慧城市IPC

Intelligent Camera Solution - IPC for Smart City 

柴卫华,安谋科技产品经理

Bobby Chai, Product Manager, Arm China

14:30-14:50

达索系统助力集成电路设计创新

Dassault Systems Power Integrated Circuit Design Innovation

孙健,达索析统(上海)信息技术有限公司技术顾问

Jerry SUN, Industry Process Consultant, Dassault Systemes

14:50-15:10

RTL ArchitectIC设计插上“shift-left”翅膀

Simply Better RTL: Enabling Shift Left Strategy with RTL Architect

李莉,新思科技数字设计部项目经理

LI LI, DDG PM, Synopsys

15:10-15:30

茶歇,交流 Coffee Break

15:30-15:50

芯片云助力IC设计仿真提速

Chip Cloud to Turbocharge IC Design and Simulation

邓世友,紫光云技术有限公司CTO兼办公室主任

Shiyou Deng, Director UniCloud CTO Office, UNICLOUD Tech Co., Ltd.

15:50-16:10

国产光通信电芯片的突破创新发展

Innovation and Development of Domestic Optical Communication IC

林少衡,厦门优迅高速芯片有限公司产品总监

Shaoheng Lin, Product Director, Xiamen UX High-speed IC Co., Ltd.

16:10-16:30

中科昊芯RISC-V DSP:打造新一代工业控制解决方案

Haawking RISC-V DSP: Create a New Generation of Industrial Control Solutions

戴恩强,北京中科昊芯科技有限公司,高级芯片应用工程师

Enqiang Dai, Senior DSP Application Engineer, Beijing Haawking Technology Co., Ltd.

16:30-16:50

MEMS自主可控的机遇与挑战

MEMS Autonomously Controllable Opportunities and Challenges

张辰良,苏州敏芯微电子技术股份有限公司VP

Carl Zhang, VP, SuZhou MEMSensing Microelectronics Co., Ltd.

16:50-17:10

面向大规模SoC验证的EDA IaaS 解决方案

EDA IaaS Solution for Large Scale SoC Verification

王琦,英诺达(成都)电子科技有限公司CEO

Qi Wang, CEO, EnnoCAD Electronics Technology Co., Ltd.

17:10-17:30

下一代EDA通用底座推动EDA生态建设

Open Source EDA Infrastructure Enabling Construction of Domestic EDA Ecosystem

李琳,南京集成电路设计服务产业创新中心有限公司(简称E创或EDA创新中心)副总经理

Lin Li, VP, Nanjing Industrial Innovation Center of EDA

18:00-20:00

闭幕晚宴(苏州日航酒店2F姑苏厅)

Closing Banquet (Gusu Hall, 2F, Hotel Nikko Suzhou)


2021716日,星期五

Friday, July 16 , 2021

第四届AI芯片与5G互联论坛

The 4th AI Chip and 5G Interconnect Forum

 

    地点:苏州狮山国际会议中心3号会议室

       Venue: Meeting Room 3, Suzhou Shishan International Convention Center

 

Time

   

Contents

演讲人

Lecturer

主持人:张力天,中国集成电路设计创新联盟副秘书长

Moderator: Litian Zhang, Vice General Secretary, ICDIA

08:40-09:00

亚马逊云科技赋能芯片设计和制造

Amazon Enable Semiconductor Innovation in Design and Manufacturing

周宇,亚马逊云科技高科技行业拓展经理

Kein Zhou, High-tech and Semiconductor Industry Business Development, Amazon Web Services

09:00-09:20

后摩尔时代的AI计算架构创新与思考

AI Computing Innovation and Prospect Beyond Moore’s Law

尚会滨,千芯科技(北京)有限公司副总经理

Huibin Shang, VP, Tensorchip Technology Co., Ltd.

09:20-09:40

真实感图形实时渲染技术的进展与未来展望

Progress and Future Prospect of Real-time Rendering Technology for Realistic Graphics

杨建,沐曦集成电路(上海)有限公司,CTO

Jian Yang, CTO, MetaX Integrated Circuits (Shanghai) Co., Ltd.

09:40-10:00

高端ASIC设计服务的展望

High-end ASIC Design Service Outlook

黄建棋,世芯电子设计研发副总裁

James Huang, Vice President of R&D, Alchip Technologies

10:00-10:20

更好的EDA带来更好的AI

Better EDA for Better AI

杨晔,芯华章科技产品和业务规划总监

Luke Yang, Product and Business Planning Director of X-EPIC

10:20-10:40

爱芯AX630A:高性能、低功耗的人工智能视觉处理器芯片

AX630A: a High-performance Low-power Computer Vision AI SoC

刘建伟,爱芯科技研发副总裁

Jianwei Liu, VP, Axera Technology Co., Ltd.

10:40-11:00

使用UCT(通用芯片遥测)设计实现人工智能性能的SoC

Designing SoCs for AI Performance Using UCT (Universal Chip Telemetry)

Nir SeverProteanTecs产品营销高级总监

Nir Sever, Senior Director of Product Marketing, ProteanTecs

11:00-11:20

高速Serdes 5G通信领域的支持

High-Speed SerDes in 5G Communication

陈连康,芯动科技(珠海)有限公司技术总监

Clark Chen, Technical Director, INNOSILICON Technology Ltd.

11:20-11:40

Tensilica DNA150 IP和超强神经网络编译器在AI芯片设计中的应用

The Application of Tensilica DNA150 IP and Super Neural Network Compiler in AI Chip Design

王伟,Cadence AE经理

Wangwei, Sr. AE Manager, Cadence

11:40-12:00

安霸解决方案助力AI产品快速落地

Ambarella’s Solution to Overcome Challenges of AI Productization

杨志侃,安霸计算机视觉团队AI技术专家

Zhikan Yang, AI Specialist, Ambarella

12:00-13:30

自助午餐 Buffet Lunch

主持人:李军, 中国集成电路设计创新联盟副秘书长

Moderator: Jun Li, Vice General Secretary, ICDIA

13:30-13:50

DesignWare IP赋能与众不同的AI SoC设计

DesignWare IP Enables the Distinctive AI SoC Design

王迎春,新思科技资深应用工程总监

Director, Applications Engineering, Synopsys

13:50-14:10

5G+AIoT时代背景下的机遇

Opportunity During the 5G+AIoT Market Booming

王彬,芯天下技术股份有限公司执行副总裁

Steve Wang, EVP, XTX Technology Co., Ltd.

14:10-14:30

从芯到云,是德科技高性能芯片测试之道

From Chipset to Cloud, Keysight Helps on High Performance IC Test

阳任平,是德科技IC行业经理

Renping Yang, Keysight IC Industry Manager

14:30-14:50

核芯达助力清晰语音入口

Hexintek Lead the Way to Clear Voice

肖丹,北京核芯达科技有限公司语音产品总监

Dany, Acoustics Product Manager, Beijing He Xin Da Science and Technology Co., Ltd.

14:50-15:10

茶歇,交流 Coffee Break

15:10-15:30

释放5G潜能,助力智造未来

Release 5G Potential, Promote the Future of Industrial Intelligence

蓝华,华为无线网络产品线5GtoB行业规划总监

Vincent lan, Senior Director of 5GtoB and Industry Wireless Product Line Huawei Technologies Co., Ltd.

15:30-15:50

异构领域专用加速器

Heterogeneous Domain Specific Accelerators

杨良峰,华夏芯(北京)通用技术处理器有限公司验证总监

Liangfeng Yang, Huaxia General Processor Technology Ltd, Verification Director

15:50-16:10

题目待定

鼎捷软件股份有限公司

16:10-16:30

5G时代的AI和视频计算

AI and Video Processing for 5G

徐科,深圳市中兴微电子技术有限公司人工智能首席科学家/芯片技术总监

Ke Xu, AI Chief Scientist & Director of Engineering, Sanechips Technology Co., Ltd.

16:30-16:50

昆仑芯,让AI计算更智能

Kunlun Chip, Makes AI Computing More Intelligent

漆维,昆仑芯(北京)科技有限公司副总经理

Wei Qi, Vice General Manager, Kunlun Xin (Beijing) Technology Ltd.

16:50-17:10

IC设计企业信息化优秀业务实践

Fabless IC Informatization Best Practice

许力,易科软件(上海)有限公司                       高级业务顾问半导体行业总监

Tony Xu, Senior Business Consultant, Director of Semiconductor Industry, Exact Software (Shanghai) Co., Ltd.

18:00-20:00

闭幕晚宴(苏州日航酒店2F姑苏厅)

Closing Banquet (Gusu Hall, 2F, Hotel Nikko Suzhou)


 2021716日,星期五

Friday, July 16, 2021

第八届汽车电子创新论坛

The 8th Auto Electronic Innovation Forum

 

    地点:苏州狮山国际会议中心4号会议室

       Venue: Meeting Room 4, Suzhou Shishan International Convention Center

 

Time

   

Contents

演讲人

Lecturer

主持人:梁元聪,上海市汽车工程学会秘书长

Moderator: Yuancong Liang, Secretary-General, SAES

08:30-08:40

领导致辞,《汽车电子芯片创新产品目录》发布解读

Address of Leaders, the Publish and Interpretation of Automotive Electronics Chip Innovation Product Catalog

08:40-09:00

中国汽车芯片产业的机遇挑战和应对策略

Opportunities, Challenges and Countermeasures of China's Automotive Chip Industry

原诚寅,国家新能源汽车技术创新中心主任、总经理,中国汽车芯片产业创新战略联盟秘书长

Chengyin Yuan, Director, General Manager, National New Energy Vehicle Technology Innovation Center

09:00-09:20

国产车规芯片准入标准与途径思考

Consideration on the Admittance Standard and Approach of Domestic Vehicle Specification Chip

陈大为,中国电子技术标准化研究院副总工程师

David Chen, Deputy Chief Engineer of China Electronics Standardization Institute

09:20-09:40

基于汽车动力BMS的全套国产自主芯片解决方案

Domestic Independent Chip Turnkey Solution for Automotive Battery Management System

秦岭,上海琪埔维半导体有限公司CEO

Harry Qin, CEO, Chipways Technology Co., Ltd.

09:40-10:00

专用AI芯片性能评估与设计

Performance Evaluation and Design of Dedicated AI Chip

罗恒,地平线BPU算法负责人

Heng Luo, Horizon Robotics, Head of BPU Algorithm

10:00-10:20

车用电子封装趋势与解决方案 Packaging Trend and Solutions for Automotive

林子翔,日月光技术开发暨设计处长

Roger Lin, Director of R&D Department, ASE Group

10:20-10:40

ADI以创新助力中国新能源汽车发展

ADI Support the Development of New Energy Vehicles in China with Innovation

陈晟,亚德诺半导体技术(上海)有限公司

中国汽车事业部资深战略与业务发展经理

Edward Chen, Senior Strategy and Business Development Manager China Automotive Business, Analog Devices

10:40-11:00

ACTT LogicFlash®助力车用传感器信号调理芯片的配置和校准

ACTT LogicFlash® Assists on Configuration and Calibration of Automotive Sensors Signal Conditioning IC

王明,成都锐成芯微科技股份有限公司 器件研发总监

Samuel Wang, Device Director, Chengdu Analog Circuit Technology Inc. (Actt)

11:00-11:20

芯旺车规芯片KF32A156在车身控制领域的应用

The Application of ChipON’s KF32A156 in the Field of Body Control

卢恒洋,上海芯旺微电子FAE总监

Ethan Lu, FAE Director, ChipON

11:20-11:40

基于MBSE的汽车电子芯片规划

Automotive Electronic IC Planning Base on MBSE

徐文强,达索析统(上海)信息科技有限公司高科技行业资深顾问

Wenqiang Xu, HT Senior Consultant,

Dassault System (shanghai) I.T. Co., Ltd.

11:40-12:00

智能网联电子电器架构与自主芯片的机会

Opportunities for Independent Chips and Intelligent Networked Electronic and Electrical Architecture

沙文瀚,奇瑞新能源汽车技术有限公司电驱电控电器部部长

Sandy Sha, Electronic Control and Architecture Department &

Electrical Drive and Electrical Department Minister

Chery New Energy Automobile Technology Co., Ltd.

12:00-13:30

自助午餐Buffet Lunch

主持人:卢万成,联合汽车电子有限公司副总工

Moderator: Wancheng LuDeputy Engineer, United Automotive

Electronic Systems Co., Ltd.

13:30-13:50

汽车电子企业对车规芯片本土化的需求

Requirement of an Automotive Electronics Company for Localization of Chipsets

于垂顺,联合汽车电子有限公司硬件开发经理

Chuishun Yu, Hardware Development Manager, United Automotive Electronic Systems Co., Ltd.

13:50-14:10

信号链MCU在智能汽车的创新

The Innovation of Signal Chain MCU in Smart Cars

庞功会,芯海科技副总裁

Dave Pang, VP, Chipsea Technologies (Shenzhen) Corp.

14:10-14:30

集成电路检测技术

IC Test Technology

毛景雄,广电计量检测股份有限公司集成电路测试技术副总监

Simon Mao, IC Test DirectorGuangzhou GRG Metrology & Test Co., Ltd.

14:30-14:50

汽车中先进SoC的深度数据健康和性能监控

Deep Data Health and Performance Monitoring of Advanced SoCs in Automotive

Gal Carmel, proteanTecs

汽车业务部门执行副总裁兼总经理,

Gal Carmel, EVP, GM Automotive, proteanTecs

14:50-15:10

域控制器和汽车未来电子架构——云途车规MCU发展之道

Domain Controllers and Future Auto Electronics Architectures – the Way of Development of Yuntu Vehicle Specification MCU

耿晓祥,苏州云途半导体有限公司总经理

Xiaoxiang Geng, GM, Suzhou Yuntu Semiconductor Co., Ltd.

15:10-15:30

茶歇,交流Coffee Break

15:30-15:50

Close the Gap: Functional Safety Verification

孙晓阳,楷登电子产品工程总监

Tim Sun, Group Director, Cadence

15:50-16:10

半导体领域的功能安全

Functional Safety in Semiconductor

孙喆,芯华章科技技术总监

Jimmy Sun, Technical Director of X-EPIC

16:10-16:30

国产汽车电子关键技术突破与应用

Breakthrough and Application of Key Technology of Domestic Automotive Electronics

肖佐楠,苏州国芯科技股份有限公司总经理

Joe Xiao,CEO, C*Core Technology Co., Ltd.

16:30-16:50

自动驾驶高性能AI芯片的平台

Automated Driving Platform Applications with High Performance AI Chip

武钰,黑芝麻智能产品总监

Yu Wu, Product Director, Black Sesame Technologies

16:50-17:10

中国车载半导体产业趋势分析

Development Trends of China's Automotive Semiconductor Industry

鲍海森,上海海思战略与业务发展部部长

Nick Bao, Minister of Strategy and Business Development, HiSilicon (Shanghai) Technologies Co., Limited

17:10-17:30

英博超算自主知识产权国产智能驾驶量产解决方案

Intelligent Driving Mass Production Solution with Domestic Independent Intellectual Property Rights

田锋,英博超算(南京)科技有限公司总经理

Feng Tian, General Manager, Unlimited AI Technology Co., Ltd.

18:00-20:00

闭幕晚宴(苏州日航酒店2F姑苏厅)

Closing Banquet (Gusu Hall, 2F, Hotel Nikko Suzhou)

 

2021716日,星期五

Friday, July 16, 2021

射频设计与测试论坛

RF Design and Testing Forum

 

    地点:苏州狮山国际会议中心狮山厅5号会议室

       Venue: Meeting Room 5, Suzhou Shishan International Convention Center

 

Time

   

Contents

演讲人

Lecturer

主持人:黄烨锋,Aspencore资深产业分析师

Moderator: Illumi Huang, Senior Industry Analyst, Aspencore

09:00-09:10

主持人欢迎致辞

Moderator’s Welcome Introduction

黄烨锋,Aspencore资深产业分析师

Illumi Huang, Senior Industry Analyst, Aspencore

09:10-09:30

疫情下的射频前端与网络连接性市场发展现状

Development Status of RF Front End and Network Market under COVID-19

黄烨锋,Aspencore资深产业分析师

Illumi Huang, Senior Industry Analyst, Aspencore

09:30-10:00

Ansys射频芯片(RFIC)电磁场仿真技术介绍

The introductions of Ansys RFIC EM simulation technology

罗辉,Ansys公司高频应用工程师

Hui Luo, High Frequency Application Engineer, Ansys China

10:00-10:30

5G射频前端的终局之战:毫米波

Endgame of 5G RFFE: mmW

赵玉龙,Qorvo 高级销售经理

David Zhao, Senior Sales Manager, Qorvo

10:30-11:00

全球最新的NFC控制器技术与NFC无线充电方案

World Leading NFC Controller and NFC Wireless Charging Solution

严更真,奥地利Panthronics公司亚太区副总裁

Yanick Yan, VP of APAC, Panthronics

11:00-11:30

半导体射频工艺无源器件PDK建模和测试

RF Passive Devices PDK Modeling and Verification

苏周祥,芯和半导体科技(上海)有限公司技术支持总监

Zhouxiang Su, AE Director, Xpeedic Co., Ltd.

11:30-12:00

多端口射频前端与变频器件的测试方案

Measurement Solution for FEM and Frequency Converting Devices

荀飞,罗德与施瓦茨矢量网络分析仪产品经理

Ivan Xun, R&S VNA PM

12:00-13:30

自助午餐Buffet Lunch


       *如有修订,以现场发布为准。